Abstract: A dust cap is particularly constructed for capping an adapter of the type that receives connectors terminating two optical fibers in respective ferrules. In one instance an optical connector may be received in one end of the adapter and the dust cap may be received in another end of the adapter, opposite the connector. The dust cap is at least partially translucent or transparent, and constructed so that light passing from one ferrule of the optical connector is preferentially directed toward a first location of the dust cap and light, and light passing from the other ferrule of the optical connector is preferentially directed toward a second location of the dust cap that is spaced from the first location.

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic structure, an alignment component and a light transmission element. The photonic structure includes an optical I/O. The alignment component includes a through hole extending through the alignment component and aligned with the optical I/O of the photonic structure. The light transmission element entirely fills the through hole of the alignment component.

Abstract: A photonic integrated circuit (PIC) chip has an empty area and includes a grating coupler array, a photodetector array, an optical modulator module, a plurality of optical waveguides, and a plurality of bonding pads. The photodetector array is configured to transform a light signal from the grating coupler array into an electrical signal. The optical modulator module is configured to modulate a light beam from the grating coupler array such that light with a specific wavelength in the light beam is output from the grating coupler array. The optical modulator module and the photodetector array are coupled with the grating coupler array through the optical waveguides. The bonding pads are electrically connected to the optical modulator module and the photodetector array. The grating coupler array, the photodetector array, the optical modulator module, the optical waveguides, and the bonding pads are disposed around the empty area.

Abstract: The present disclosure relates to a distribution cable assembly that has various features to enable flexible configurations to accommodate various data center configurations.

Abstract: An optical coupler includes: light input ports on a first side surface; monitoring light output ports on a second side surface; one light output port on a third side surface; and multimode-interference-type optical coupling parts, a first multimode-interference coupling part is connected to a first light-input-side waveguide on the input side, and to a first monitoring-light-output-side waveguide and a first connecting waveguide on the output side, the second multimode-interference coupling part is connected to a second light-input-side waveguide and the first connecting waveguide on the input side, and to a second monitoring-light-output-side waveguide and a second connecting waveguide on the output side, and the third multimode-interference coupling part is connected to a third light-input-side waveguide and the second connecting waveguide on the input side, and connected to a third monitoring-light-output-side waveguide and a light-output-port-connected waveguide on the output side, and the monitoring-ligh

Abstract: A hollow core photonic crystal fiber (PCF) including an outer cladding region and seven hollow tubes surrounded by the outer cladding region. Each of the hollow tubes is fused to the outer cladding to form a ring defining an inner cladding region and a hollow core region surrounded by the inner cladding region. The hollow tubes are not touching each other but are arranged with distance to adjacent hollow tubes. The hollow tubes each have an average outer diameter d2 and an average inner diameter dl, wherein d1/d2 is equal to or larger than about 0.8. Also, a laser system.

Abstract: An optical module includes: a casing in which light is propagated; a heating portion; a device arranged inside the casing and configured to change, when heated, characteristics of the light propagated inside the casing; and a first member thermally connected to the heating portion and the device, the first member including a hollow arranged in a heat transfer path from the heating portion to the device and configured to prevent convective heat transmission to an inside of the casing.

Abstract: A system for maintaining relative orientation of optical fibers in an array is provided. Fibers extend parallel and include a first fiber and an adjacent fiber. The system includes a fiber holder with alignment holes configured to receive stripped fiber sections. The alignment holes extend from the first surface to the second surface, and the alignment holes include a first alignment hole configured to receive a stripped fiber section of the first fiber and an adjacent alignment hole configured to receive a stripped fiber section of the adjacent fiber. The fiber holder has a wall separating the first alignment hole and the adjacent alignment hole that permits rotation of the stripped fiber section of the adjacent fiber in the adjacent alignment hole without causing rotation of the stripped fiber section of the first fiber in the first alignment hole.

Abstract: An optical chip includes a chip area located on a wafer, and an optical circuit arranged in the chip area. The optical chip includes a first waveguide that is connected to a first operational fiber, a second waveguide, and a first coupler that includes a first port that is connected to the first waveguide and the second waveguide and a second port that is connected to the optical circuit. Furthermore, the optical chip includes a first trench that is formed on a surface of the chip area, that is connected to the second waveguide, and in which a first test purpose fiber is inserted.

Abstract: An adapter for a fiber-optic plug is disclosed, the adapter configured to be received in a port of a fiber-optic apparatus, the adapter comprising: a first opening proximate a first end of the adapter, the first opening configured to receive a multifiber fiber optic connector; a second opening proximate a second end of the adapter, the second opening configured to receive a hardened multifiber connector; an adapter body extending longitudinally between the first end of the adapter and the second end of the adapter and defining an internal cavity therethrough, the adapter body comprising: a first engagement mechanism at the first end of the adapter for engaging with the port of the fiber-optic apparatus; a second engagement mechanism between the first end of the adapter and the second end of the adapter for engaging with the multifiber fiber optic connector; a third engagement mechanism at the second end of the adapter for engaging with a hardened multifiber connector; a locating feature for locating the harde

Abstract: An electro-optical chip assembly includes a silicon baseplate and an electro-optical chip. The electro-optical chip has a silicon substrate that is fusion bonded to the silicon baseplate. The electro-optical chip is manufactured separate from the silicon baseplate before fusion bonding of the silicon substrate of the electro-optical chip to the silicon baseplate.

Abstract: Variations in a thermal structure for an open cavity photonic integrated circuit (OCPIC) having an MRR. The structure includes an air trench in fluid communication with an air cavity that is located under the MRR. The air trench is a gap/opening in the oxide that encircles at least a portion of the MRR and extends outward radially therefrom, with a consistent width, to a diameter D1. An oxide cladding is not removed in areas that are used for metal traces and routing. The structure is characterized by straight walls along the air trench. The structure has a lower diameter D2, measured at a bottom/floor of the air cavity. In various embodiments, D2 is substantially equal to D1.

Abstract: Optical devices including an optical splitter and a duplex optical connector are disclosed. In one embodiment, an optical device includes an optical splitter having an input, a network output, and a pass-through output, wherein the optical splitter is configured to split an input signal received at the input into a network optical signal at the network output and a pass-through output signal at the pass-through output. The optical device further includes a duplex connector having an input connection point and a pass-through connection point, an input waveguide optically coupling the input connection point to the input of the optical splitter, and a pass-through waveguide optically coupling the pass-through connection point to the pass-through output of the optical splitter.

Abstract: An embodiment photonic device may include a dielectric waveguide having a core portion, a cladding portion, and a first photonic coupler. The first photonic coupler may include a first dielectric pillar formed at a first surface of the cladding portion and optically coupled to the core portion, and a first dielectric cap optically coupled to the first dielectric pillar. Each of the first dielectric pillar and the first dielectric cap may include a polymer material that is transparent to infrared radiation such that radiation incident on the first dielectric cap from the core portion is focused by the first dielectric cap to a beam width that is smaller than a width of the core portion of the dielectric waveguide. Some embodiments may include a second photonic coupler having a second dielectric pillar optically coupled to the core portion, and a second dielectric cap optically coupled to the second dielectric pillar.

Abstract: [Problem] To provide a multi-fiber optical connector ferrule that has low connection loss even when optical wiring is mounted on a substrate. [Solution] This multi-fiber optical connector ferrule: is obtained by molding a resin composition that includes polyphenylene sulfide; and has optical fiber insertion holes 103 and a guide hole 102 for guide pin insertion. The dimensional variation of the multi-fiber optical connector ferrule when heated at 260° C. is no more than 0.1%. The multi-fiber optical connector ferrule is a high-density optical connector having at least eight optical fiber insertion holes provided therein. The optical fiber insertion holes have an internal diameter of 127 ?m and are provided at a pitch of no more than 250 ?m.

Abstract: An integrated photonics arrayed waveguide multiplexing/demultiplexing device is disclosed. The device includes an array of waveguides having an incident light waveguide section including a phase correcting region, a transmitted light waveguide section, a tunable reflector, wherein each pair of consecutive waveguides in the array includes a coupler. The coupler configured to combine light from the transmitted light waveguide sections, determine therefrom an optical phase difference between the two consecutive waveguides, and wherein the couplers are further configured to determine therefrom a change in optical path length required for each of two consecutive waveguides to reach a predetermined optical phase difference, and wherein each phase correcting region is configured to apply the change to correct the optical path length of the respective waveguide.

Abstract: An electronic device includes a first transducer, a second transducer and a bridging component. The second transducer is spaced apart from the first transducer. The bridging component is configured for lateral optical-signal coupling with the first transducer and the second transducer.

Abstract: Optical fibers containing wet-spun multi-layer hydrogel cladding with ionic-crosslinked polysaccharides are provided. Optical fibers can be formed with step- or gradient-index architectures, fusion splicing, and facile rare-earth ion doping. Plasmonic nanoparticles, functionalized light-sensitive quantum dots, or particles can be incorporated into the fiber core to generate a resonance light shift upon the presence and binding of molecular biotargets for biosensor applications. The integration of plasmonic hydrogel fibers with medical swabs provides for rapid detection of pathogens such as severe acute respiratory syndrome coronavirus 2 (SARS-COV-2). The inclusion of living cells allows for the non-invasive digitalization and quantification of complex biological responses such as cancer proliferative invasion and discovery of anti-cancer drug susceptibility thresholds.

Abstract: A heat dissipater assembly for an optical module for a telecommunications unit. The heat dissipater assembly includes a heat dissipater, a first connector portion coupled to the dissipater body and a second connector portion coupled to the dissipater body. The heat dissipater has a dissipater body including a recess for receiving the optical module, such that the optical module is in thermal communication with the dissipater body, and one or more heat dissipation structures configured to dissipate heat from the optical module into an environment around the heat dissipater. The optical connector is optically connected to the optical module received within the recess. The second connector portion is configured to be coupled to the telecommunications unit. The heat dissipater assembly further includes an electrical extender. The electrical extender is configured to be partially received within the heat dissipater.

Abstract: An optical fiber connector includes a lower plate having a plurality of optical fiber alignment structures. First and second guide element alignment structures are formed in the lower plate. A plurality of optical fibers are respectively disposed in the plurality of optical fiber alignment structures. First and second guide elements are respectively disposed within the first and second guide element alignment structures so as to extend outside of a periphery of the lower plate. A cover plate is secured to the lower plate to hold the plurality of optical fibers within the plurality of optical fiber alignment structures. An upper plate is disposed over each of the cover plate, the first guide element, and the second guide element. The upper plate is secured to the lower plate to hold the first and second guide elements within the first and second guide element alignment structures, respectively.