Abstract: Embodiments of the present disclosure relate to a high performance backlight device with photonic integrated circuits. The backlight device includes a light source assembly, a multi-mode slab waveguide, and an out-coupling assembly. The light source assembly includes one or more light sources that generate light in accordance with emission instructions, and a de-speckling mechanism that conditions the generated light to mitigate speckle. The multi-mode slab waveguide in-couples the conditioned light and expands the in-coupled conditioned light in two dimensions to form a homogenous area of conditioned light within a region of the multi-mode slab waveguide. The out-coupling assembly out-couples the conditioned light from the region in a direction normal to the two dimensions, wherein a light modulation layer forms an image from the out-coupled conditioned light.

Abstract: An optical circuit includes one or more input waveguides, a plurality of output waveguides, and a reflector structure. At least a portion of the reflector structure forms an interface with the one or more input waveguides. The portion of the reflector structure has a smaller refractive index than the one or more input waveguides. An electrical circuit is electrically coupled to the optical circuit. The electrical circuit generates and sends different electrical signals to the reflector structure. In response to the reflector structure receiving the different electrical signals, a carrier concentration level at or near the interface or a temperature at or near the interface changes, such that incident radiation received from the one or more input waveguides is tunably reflected by the reflector structure into a targeted output waveguide of the plurality of output waveguides.

Abstract: A benchmark device and a method for evaluating a semiconductor wafer are provided. The benchmark device includes a first grating coupler, a second grating coupler and a waveguide. The waveguide has a least one bending section and is arranged in communication with the first grating coupler and the second grating coupler. The bending section comprises a first region having a first width and a first height, and a second region having a second width and a second height, wherein the first region is surrounded by the second region, and the second width decreases gradually from a first end of the bending section to a second end of the bending section.

Abstract: A light guide member (300) includes a boundary surface (304) configured to reflect image light guided to the boundary surface (304) and emit the image light outside the light guide member (300), an opposing surface (306) parallel to the boundary surface (304), the opposing surface (306) facing the boundary surface (304), a first inclined surface (305) having an inclination in which a distance between the first inclined surface (305) and the boundary surface (304) decreases in a guiding direction of the image light, and a second inclined surface (307) between the opposing surface (306) and the first inclined surface (305), the second inclined surface (307) inclined at a different angle with the first inclined surface (305) in the guiding direction.

Abstract: A self-aligned fabrication process for aligning photonic waveguide layers of a 3D photonic structure such that light may be efficiently transferred between the two layers is described. The self-aligned fabrication process comprises using a mask to pattern both photonic waveguide layers, such that they are aligned three-dimensionally via a single lithographic processing step, and thus fabricating a photonically coupled region of the 3D photonic structure. Selective etching may also be used to taper a given photonic waveguide layer for adiabatic coupling, and/or to produce other non-trivial geometric shapes in the photonic waveguide layers. Such 3D photonic structures may be fabricated for use in quantum memory devices, in which one of the photonic waveguide layers may host quantum memories and another photonic waveguide layer may interface with an optical fiber, such that light may be transferred between an optical fiber and respective ones of the quantum memories.

Abstract: A fiber-optic apparatus is disclosed, comprising a base; an optical splitter portion disposed on the base and configured to retain an optical splitter; a first fiber splicing portion, the first fiber splicing portion disposed on the base and configured to retain a plurality of optical fiber splices connecting to an optical splitter; and wherein the first fiber splicing portion is configured to retain a plurality of optical fiber splices such that an end of at least a first optical fiber splice is offset from an end of at least a second optical fiber splice in the direction of the depth of the apparatus.

Abstract: An optical fiber connector comprises a multi-fiber ferrule having an array of grooves recessed relative to an upper surface of a medial portion thereof, wherein each groove has a depth greater than a maximum diameter of an uncoated fiber segment received therein, and is shaped such that an optical fiber received therein lacks contact with the groove over large arc length thereof (e.g., an arc spanning at least 120 or at least 150 degrees). A method for fabricating a multi-fiber connector with a multi-fiber ferrule includes flexing a medial portion of the ferrule into a non-linear configuration to expand an average width of at least some grooves defined in an upper surface of a medial portion thereof, receiving optical fibers in the grooves, pushing the fibers away from the bottom of each groove, and securing the optical fibers in the grooves.

Abstract: Some embodiments of the disclosure provides a substrate for optical fiber array and the disclosed substrate fixes the fiber by epoxy. In some embodiments, the substrate includes a main body, a first holding groove, and a second holding groove. The first holding groove is notched along a width direction of the main body for holding a stripped optical fiber by epoxy. The second holding groove is an arc-shaped groove and connected with the first holding groove. The second holding groove extends along a notching direction of the first holding groove for holding an unstripped optical fiber. In other embodiments, a groove is notched along a length direction of the main body to prevent epoxy overflow.

Abstract: A head-mounted display including an image generator, a projection lens, and a waveguide is provided. The image generator is configured to provide an image beam. The projection lens is disposed on a path of the image beam. The projection lens has an image side and an object side. The image generator is configured at the image side. The projection lens includes a first lens element and a lens element group. The lens element group is disposed between the image generator and the first lens element. A first central axis of the first lens element and a second central axis of the lens element group are not overlapped. The waveguide is disposed on the path of the image beam and located at the object side of the projection lens.

Abstract: This application provides a pre-connector and a communications device. The pre-connector includes a connector component and an outdoor component. The connector component includes a ferrule base and a ferrule that is slidable relative to the ferrule base. The ferrule base is configured to fasten the optical cable, and the ferrule is connected to an optical fiber that is of the optical cable and that is inserted into the ferrule base. In this way, the optical fiber can be connected to the communications device by using the ferrule. The outdoor component includes: a spindle that is sleeved on the ferrule base and that is fastened to the ferrule base; and a handle sleeve sleeved on the spindle. The outdoor component is used as a connecting piece to be detachably fastened and connected to the communications device, so as to provide a locking force used when the communications device is connected.

Abstract: An object of the present disclosure is to provide a method of laying an optical cable that is capable of laying and removing the optical cable in a stable place without civil engineering works. To achieve the above-mentioned object, a method of laying an optical cable according to the present disclosure includes laying the optical cable and two laying strips on a road surface or a wall surface so that the optical cable is sandwiched between side surfaces of the two laying strips.

Abstract: A multi-core optical amplifying fiber includes: core portions doped with a rare-earth element; an inner cladding portion; and an outer cladding portion. A mode field diameter of each core portion at a wavelength at which the rare-earth element performs optical amplification is 5 ?m to 11 ?m, a relative refractive-index difference of the maximum refractive index of each core portion with respect to the inner cladding portion is 0.35% to 2%, a core-to-core distance is set such that total inter-core crosstalk is ?40 dB/100 m or lower in an optical amplification wavelength band subjected to the optical amplification, a cladding thickness is smaller than a value obtained by adding the mode field diameter to a minimum value of the core-to-core distance, and a ratio of a total sectional area of the core portions to a sectional area of the inner cladding portion is 1.9% or more.

Abstract: This optical modulation element includes a first optical waveguide, a second optical waveguide, a first electrode for applying an electric field to the first optical waveguide, and a second electrode for applying an electric field to the second optical waveguide. The first optical waveguide and the second optical waveguide each include a ridge-shaped portion protruding from a first surface of a lithium niobate film. A first interaction length L1 that is a length of a part of the first electrode overlapping the first optical waveguide in a longitudinal direction is 0.9 mm or more and 20 mm or less. A second interaction length L2 that is a length of a part of the second electrode overlapping the second optical waveguide in the longitudinal direction is 0.9 mm or more and 20 mm or less.

Abstract: A semiconductor device includes a substrate; a holding member located on the substrate, the holding member including a module placement part and an opening arranged in a first direction; an optical module located in the module placement part and mounted on the substrate; and an optical fiber passing through the opening, the optical fiber being connected with the optical module. The holding member includes a first corner part and a second corner part. The opening is between the first corner part and the second corner part in a direction crossing the first direction. The first corner part and the second corner part are beveled.

Abstract: A rollable optical fiber ribbon utilizing low attenuation, bend insensitive fibers and cables incorporating such rollable ribbons are provided. The optical fibers are supported by a ribbon body, and the ribbon body is formed from a flexible material such that the optical fibers are reversibly movable from an unrolled position to a rolled position. The optical fibers have a large mode filed diameter, such as ?9 microns at 1310 nm facilitating low attenuation splicing/connectorization. The optical fibers are also highly bend insensitive, such as having a macrobend loss of ?0.5 dB/turn at 1550 nm for a mandrel diameter of 15 mm.

Abstract: Disclosed herein are waveguiding structures and methods of manufacturing waveguiding structures, a waveguiding structure comprising: a waveguiding layer comprising a first oxide layer, a second oxide layer adjacent to the first oxide layer, a third oxide layer adjacent to the second oxide layer on a side opposite from the first oxide layer, and an oxide strip adjacent to the second oxide layer and extending at least partially into the third oxide layer, wherein the first, second, and third oxide layer and oxide strip form a ridge waveguide; a fluid channel extending through at least a portion of the first, second, and third oxide layers and intersecting the ridge waveguide such that light carried by the ridge waveguide is incident on the fluid channel; and a cover layer affixed to the waveguiding layer and enclosing the fluid channel.

Abstract: A dual-layer coupling arrangement comprises a first coupling waveguide disposed within a photonic integrated circuit (at a position over an included optical signal waveguide) and a second coupling waveguide disposed above the first coupling waveguide. The first and second coupling waveguides are formed to exhibit splitter configurations that terminate as a pair arms separated by a distance suitable for creating beams that would coincide with a circular mode field of the core region of a coupling optical fiber. The vertical spacing between the first and second coupling waveguides is set so that the pairs of beams exiting from the terminating arms of the coupling waveguides coincide with a circular mode field.

Abstract: A transparent substrate has two parallel faces and guides collimated image light by internal reflection. A first set of internal surfaces is deployed within the substrate oblique to the parallel faces. A second set of internal surfaces is deployed within the substrate parallel to, interleaved and in overlapping relation with the first set of internal surfaces. Each of the internal surfaces of the first set includes a first coating having a first reflection characteristic to be at least partially reflective to at least a first subset of components of incident light. Each of the internal surfaces of the second set includes a second coating having a second reflection characteristic complementary to the first reflection characteristic to be at least partially reflective to at least a second subset of components of incident light. The sets of internal surfaces cooperate to reflect all components of light from the first and second subsets.

Abstract: A package includes a package substrate including an insulating layer having a trench and a package component bonded to the package substrate. The package component includes a redistribution structure, an optical die bonded to the redistribution structure, the optical die including an edge coupler near a first sidewall of the optical die, a dam structure on the redistribution structure near the first sidewall of the optical die, a first underfill between the optical die and the redistribution structure, an encapsulant encapsulating the optical die, and an optical glue in physical contact with the first sidewall of the optical die. The first underfill does not extend along the first sidewall of the optical die. The optical glue separates the dam structure from the encapsulant. The package further includes a second underfill between the insulating layer and the package component. The second underfill is partially disposed in the trench.

Abstract: A waveguide structure includes a substrate and a waveguide core coupled to the substrate and including a first material characterized by a first index of refraction and a first electro-optic coefficient. The waveguide structure also includes a first cladding layer at least partially surrounding the waveguide core and including a second material characterized by a second index of refraction less than the first index of refraction and a second electro-optic coefficient greater than the first electro-optic coefficient. The second cladding layer is coupled to the first cladding layer.