Patents Examined by Jerry Rahll
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Patent number: 12724215Abstract: A process of formation of an optical fiber termination includes intentionally introducing gas vent gaps within the optical fiber termination, as a result of which fabrication process related mechanical stresses in the termination are greatly or at least substantially reduced. Optical fiber terminations formed with such process. Methodologies of using such optical fiber terminations.Type: GrantFiled: March 6, 2024Date of Patent: September 1, 2026Assignee: Cyclone Biosciences, LLCInventor: Stephen E. Griffin
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Patent number: 12724271Abstract: A display subsystem for a virtual image generation system for use by an end user comprises a planar waveguide apparatus, an optical fiber, at least one light source configured for emitting light from a distal end of the optical fiber, and a collimation element mounted to a distal end of the optical fiber for collimating light from the optical fiber. The virtual image generation system further comprises a mechanical drive assembly to which the optical fiber is mounted to the drive assembly. The mechanical drive assembly is configured for displacing the distal end of the optical fiber, along with the collimation element, in accordance with a scan pattern. The virtual image generation system further comprises an optical waveguide input apparatus configured for directing the collimated light from the collimation element down the planar waveguide apparatus, such that the planar waveguide apparatus displays image frames to the end user.Type: GrantFiled: January 11, 2024Date of Patent: September 1, 2026Assignee: Magic Leap, Inc.Inventors: Brian T. Schowengerdt, Lionel Ernest Edwin, Ivan Yeoh, Aaron Mark Schuelke, William Hudson Welch, John Graham Macnamara
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Patent number: 12717087Abstract: A photonic device including a substrate and a structure. The structure includes a support, an optical resonator fixed to the support, and a portion of a waveguide optically coupled to the resonator and fixed to the support. The structure is suspended above the substrate. The portion of the waveguide and the resonator are arranged on a same side of the support. The support is a first portion of a layer. A second portion of the layer is fixed to the substrate. The support is mechanically coupled to the second portion of the layer.Type: GrantFiled: December 4, 2023Date of Patent: August 25, 2026Assignee: Commissariat à l'Énergie Atomique et aux Énergies AlternativesInventors: Guillaume Jourdan, Marc Gely
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Patent number: 12710607Abstract: A method includes forming a first redistribution structure on a first substrate; forming a waveguide structure on a second substrate, wherein the waveguide structure includes waveguides; bonding the waveguide structure to the redistribution structure using dielectric-to-dielectric bonding; removing the second substrate; forming a second redistribution structure on the waveguide structure; and connecting a photonic package to the second redistribution structure, wherein the photonic package is optically coupled to the waveguides.Type: GrantFiled: June 5, 2023Date of Patent: August 18, 2026Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chen-Hua Yu, Jiun Yi Wu
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Patent number: 12704686Abstract: A dust cap is particularly constructed for capping an adapter of the type that receives connectors terminating two optical fibers in respective ferrules. In one instance an optical connector may be received in one end of the adapter and the dust cap may be received in another end of the adapter, opposite the connector. The dust cap is at least partially translucent or transparent, and constructed so that light passing from one ferrule of the optical connector is preferentially directed toward a first location of the dust cap and light, and light passing from the other ferrule of the optical connector is preferentially directed toward a second location of the dust cap that is spaced from the first location.Type: GrantFiled: March 26, 2024Date of Patent: August 11, 2026Assignee: Senko Advanced Components, Inc.Inventors: Jimmy Chang, Siu Kei Ma, Kazuyoshi Takano
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Patent number: 12704677Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic structure, an alignment component and a light transmission element. The photonic structure includes an optical I/O. The alignment component includes a through hole extending through the alignment component and aligned with the optical I/O of the photonic structure. The light transmission element entirely fills the through hole of the alignment component.Type: GrantFiled: April 14, 2023Date of Patent: August 11, 2026Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Chun-Yen Ting, Hung-Chun Kuo, Jung Jui Kang, Chiu-Wen Lee, Shih-Yuan Sun
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Patent number: 12699242Abstract: A photonic integrated circuit (PIC) chip has an empty area and includes a grating coupler array, a photodetector array, an optical modulator module, a plurality of optical waveguides, and a plurality of bonding pads. The photodetector array is configured to transform a light signal from the grating coupler array into an electrical signal. The optical modulator module is configured to modulate a light beam from the grating coupler array such that light with a specific wavelength in the light beam is output from the grating coupler array. The optical modulator module and the photodetector array are coupled with the grating coupler array through the optical waveguides. The bonding pads are electrically connected to the optical modulator module and the photodetector array. The grating coupler array, the photodetector array, the optical modulator module, the optical waveguides, and the bonding pads are disposed around the empty area.Type: GrantFiled: October 25, 2023Date of Patent: August 4, 2026Assignee: Wistron CorporationInventors: Ching Pao Sun, Cheng Hung Lu, Guan Fu Lu
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Patent number: 12699229Abstract: The present disclosure relates to a distribution cable assembly that has various features to enable flexible configurations to accommodate various data center configurations.Type: GrantFiled: December 20, 2023Date of Patent: August 4, 2026Assignee: CORNING RESEARCH & DEVELOPMENT CORPORATIONInventors: Lan Bo, Songhua Cao, Ke Jiang, Xu Li, Wei Liu, Peiyou Xiong, Wei Zhang, Shun Sheng Zhou
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Patent number: 12693474Abstract: An optical coupler includes: light input ports on a first side surface; monitoring light output ports on a second side surface; one light output port on a third side surface; and multimode-interference-type optical coupling parts, a first multimode-interference coupling part is connected to a first light-input-side waveguide on the input side, and to a first monitoring-light-output-side waveguide and a first connecting waveguide on the output side, the second multimode-interference coupling part is connected to a second light-input-side waveguide and the first connecting waveguide on the input side, and to a second monitoring-light-output-side waveguide and a second connecting waveguide on the output side, and the third multimode-interference coupling part is connected to a third light-input-side waveguide and the second connecting waveguide on the input side, and connected to a third monitoring-light-output-side waveguide and a light-output-port-connected waveguide on the output side, and the monitoring-lighType: GrantFiled: December 14, 2023Date of Patent: July 28, 2026Assignee: TDK CORPORATIONInventors: Yasuhiro Takagi, Hiroki Hara, Atsushi Shimura, Hajime Utsunomiya, Jiro Yoshinari
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Patent number: 12693470Abstract: A hollow core photonic crystal fiber (PCF) including an outer cladding region and seven hollow tubes surrounded by the outer cladding region. Each of the hollow tubes is fused to the outer cladding to form a ring defining an inner cladding region and a hollow core region surrounded by the inner cladding region. The hollow tubes are not touching each other but are arranged with distance to adjacent hollow tubes. The hollow tubes each have an average outer diameter d2 and an average inner diameter dl, wherein d1/d2 is equal to or larger than about 0.8. Also, a laser system.Type: GrantFiled: October 23, 2025Date of Patent: July 28, 2026Assignee: NKT PHOTONICS A/SInventors: Jens Kristian Lyngsøe, Christian Jakobsen, Mattia Michieletto
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Patent number: 12687685Abstract: An optical module includes: a casing in which light is propagated; a heating portion; a device arranged inside the casing and configured to change, when heated, characteristics of the light propagated inside the casing; and a first member thermally connected to the heating portion and the device, the first member including a hollow arranged in a heat transfer path from the heating portion to the device and configured to prevent convective heat transmission to an inside of the casing.Type: GrantFiled: November 28, 2022Date of Patent: July 21, 2026Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Kazuya Nagashima, Atsushi Izawa, Atsushi Kaji, Go Kobayashi
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Patent number: 12687679Abstract: A system for maintaining relative orientation of optical fibers in an array is provided. Fibers extend parallel and include a first fiber and an adjacent fiber. The system includes a fiber holder with alignment holes configured to receive stripped fiber sections. The alignment holes extend from the first surface to the second surface, and the alignment holes include a first alignment hole configured to receive a stripped fiber section of the first fiber and an adjacent alignment hole configured to receive a stripped fiber section of the adjacent fiber. The fiber holder has a wall separating the first alignment hole and the adjacent alignment hole that permits rotation of the stripped fiber section of the adjacent fiber in the adjacent alignment hole without causing rotation of the stripped fiber section of the first fiber in the first alignment hole.Type: GrantFiled: January 24, 2023Date of Patent: July 21, 2026Assignee: CORNING RESEARCH & DEVELOPMENT CORPORATIONInventors: Douglas Llewellyn Butler, Jeffrey Scott Clark, David Evan Robinson, James Scott Sutherland
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Patent number: 12687676Abstract: An optical chip includes a chip area located on a wafer, and an optical circuit arranged in the chip area. The optical chip includes a first waveguide that is connected to a first operational fiber, a second waveguide, and a first coupler that includes a first port that is connected to the first waveguide and the second waveguide and a second port that is connected to the optical circuit. Furthermore, the optical chip includes a first trench that is formed on a surface of the chip area, that is connected to the second waveguide, and in which a first test purpose fiber is inserted.Type: GrantFiled: July 28, 2023Date of Patent: July 21, 2026Assignee: FUJITSU OPTICAL COMPONENTS LIMITEDInventor: Masaki Sugiyama
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Patent number: 12687680Abstract: An adapter for a fiber-optic plug is disclosed, the adapter configured to be received in a port of a fiber-optic apparatus, the adapter comprising: a first opening proximate a first end of the adapter, the first opening configured to receive a multifiber fiber optic connector; a second opening proximate a second end of the adapter, the second opening configured to receive a hardened multifiber connector; an adapter body extending longitudinally between the first end of the adapter and the second end of the adapter and defining an internal cavity therethrough, the adapter body comprising: a first engagement mechanism at the first end of the adapter for engaging with the port of the fiber-optic apparatus; a second engagement mechanism between the first end of the adapter and the second end of the adapter for engaging with the multifiber fiber optic connector; a third engagement mechanism at the second end of the adapter for engaging with a hardened multifiber connector; a locating feature for locating the hardeType: GrantFiled: October 27, 2023Date of Patent: July 21, 2026Assignee: CORNING RESEARCH & DEVELOPMENT CORPORATIONInventors: Aurélien Julien Alexandre Macoin, Gordon Mueller-Schlomka
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Patent number: 12681245Abstract: An electro-optical chip assembly includes a silicon baseplate and an electro-optical chip. The electro-optical chip has a silicon substrate that is fusion bonded to the silicon baseplate. The electro-optical chip is manufactured separate from the silicon baseplate before fusion bonding of the silicon substrate of the electro-optical chip to the silicon baseplate.Type: GrantFiled: October 12, 2023Date of Patent: July 14, 2026Assignee: Ayar Labs, Inc.Inventors: Chong Zhang, Haiwei Lu, Steve Groothuis
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Patent number: 12681243Abstract: Variations in a thermal structure for an open cavity photonic integrated circuit (OCPIC) having an MRR. The structure includes an air trench in fluid communication with an air cavity that is located under the MRR. The air trench is a gap/opening in the oxide that encircles at least a portion of the MRR and extends outward radially therefrom, with a consistent width, to a diameter D1. An oxide cladding is not removed in areas that are used for metal traces and routing. The structure is characterized by straight walls along the air trench. The structure has a lower diameter D2, measured at a bottom/floor of the air cavity. In various embodiments, D2 is substantially equal to D1.Type: GrantFiled: April 20, 2022Date of Patent: July 14, 2026Assignee: Intel CorporationInventors: Chia-Pin Chiu, Omkar G. Karhade, Kaveh Hosseini
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Patent number: 12681238Abstract: Optical devices including an optical splitter and a duplex optical connector are disclosed. In one embodiment, an optical device includes an optical splitter having an input, a network output, and a pass-through output, wherein the optical splitter is configured to split an input signal received at the input into a network optical signal at the network output and a pass-through output signal at the pass-through output. The optical device further includes a duplex connector having an input connection point and a pass-through connection point, an input waveguide optically coupling the input connection point to the input of the optical splitter, and a pass-through waveguide optically coupling the pass-through connection point to the pass-through output of the optical splitter.Type: GrantFiled: April 26, 2023Date of Patent: July 14, 2026Assignee: CORNING RESEARCH & DEVELOPMENT CORPORATIONInventors: Michael De Jong, Carmi Shapira, Eric Stephan ten Have
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Patent number: 12674937Abstract: An embodiment photonic device may include a dielectric waveguide having a core portion, a cladding portion, and a first photonic coupler. The first photonic coupler may include a first dielectric pillar formed at a first surface of the cladding portion and optically coupled to the core portion, and a first dielectric cap optically coupled to the first dielectric pillar. Each of the first dielectric pillar and the first dielectric cap may include a polymer material that is transparent to infrared radiation such that radiation incident on the first dielectric cap from the core portion is focused by the first dielectric cap to a beam width that is smaller than a width of the core portion of the dielectric waveguide. Some embodiments may include a second photonic coupler having a second dielectric pillar optically coupled to the core portion, and a second dielectric cap optically coupled to the second dielectric pillar.Type: GrantFiled: January 2, 2024Date of Patent: July 7, 2026Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventor: Chen-Hua Yu
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Patent number: 12674943Abstract: [Problem] To provide a multi-fiber optical connector ferrule that has low connection loss even when optical wiring is mounted on a substrate. [Solution] This multi-fiber optical connector ferrule: is obtained by molding a resin composition that includes polyphenylene sulfide; and has optical fiber insertion holes 103 and a guide hole 102 for guide pin insertion. The dimensional variation of the multi-fiber optical connector ferrule when heated at 260° C. is no more than 0.1%. The multi-fiber optical connector ferrule is a high-density optical connector having at least eight optical fiber insertion holes provided therein. The optical fiber insertion holes have an internal diameter of 127 ?m and are provided at a pitch of no more than 250 ?m.Type: GrantFiled: June 8, 2022Date of Patent: July 7, 2026Assignee: HAKUSAN INC.Inventors: Moriaki Kobayashi, Shohei Ueno
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Patent number: 12669645Abstract: An integrated photonics arrayed waveguide multiplexing/demultiplexing device is disclosed. The device includes an array of waveguides having an incident light waveguide section including a phase correcting region, a transmitted light waveguide section, a tunable reflector, wherein each pair of consecutive waveguides in the array includes a coupler. The coupler configured to combine light from the transmitted light waveguide sections, determine therefrom an optical phase difference between the two consecutive waveguides, and wherein the couplers are further configured to determine therefrom a change in optical path length required for each of two consecutive waveguides to reach a predetermined optical phase difference, and wherein each phase correcting region is configured to apply the change to correct the optical path length of the respective waveguide.Type: GrantFiled: December 21, 2023Date of Patent: June 30, 2026Assignee: Imec vzwInventor: Bruno Figeys