Abstract: Example embodiments relate to multilayer integrated photonic structures. An example multilayer integrated photonic structure includes a propagation region formed in a first photonic layer. The propagation region includes a plurality of waveguides and a slab region in which the plurality of waveguides terminates. The multilayer integrated photonic structure also includes an outcoupling structure formed in a second photonic layer on top of the first photonic layer. The outcoupling structure is configured to couple light into and out of the multilayer integrated photonic structure. Additionally, the multilayer integrated photonic structure includes a reflector configured to optically couple the slab region of the first photonic layer and the second photonic layer. The reflector includes a first reflector element included in the slab region of the first photonic layer and a second reflector element included in the second photonic layer.

Abstract: A method and system of compensating for body deformation during image acquisition or external beam treatment includes acquiring image data of a body and peak wavelength data from a plurality of fiber Bragg gratings (FBGs) disposed on the body aligned along a predetermined coordinate system on the body, such as a cartesian coordinate system. The method further comprises detecting effective shifts of the Bragg wavelengths of the FBGs caused by body deformation during image acquisition, and controlling the movement of the body through a cavity in a scanning device and controlling the acquisition of the image data or external beam treatment during body deformation based on the effective shifts of the Bragg wavelengths of the FBGs.

Abstract: An optical coupling system for coupling a light source to a photonic integrated circuit (PIC) comprises a multimode coupler configured to receive an input optical signal of a first mode. The multimode coupler triggers one or more higher-order modes from the input optical signal of the first mode. The optical coupling system also includes a mode de-multiplexer and an optical combiner. The mode de-multiplexer transfers the input optical signal of the first mode and one or more optical signals of the triggered one or more higher-order modes to respective output optical signals of the first mode. The optical combiner combines the respective output optical signals to produce a single output signal of the first mode.

Abstract: Multiport assemblies comprising one or more optical ports for receiving an external optical fiber connector for making an optical connection along with useful mounting features for securing the multiport assembly are disclosed. The multiport assembly comprises a mounting member having an aperture and a standoff that is coupled to a shell. The standoff extends outward from a lower surface of the shell to allow easy mounting to irregular surfaces. In another embodiment, the multiport assembly may comprise a second mounting member with an aperture and standoff that is received in a rear shell aperture to inhibit damage to the multiport assembly if a fastener is over-tightened during mounting. In further embodiments, the multiport assembly may comprise a dust plug having a locking feature and a keying port that is received in an optical port for inhibiting dirt, dust or debris from entering when the optical port is not in use.

Abstract: An optical connector for optically coupling optical transmission members to each other includes a first optical portion, a second optical portion, and a groove extending in one direction for disposing the optical transmission member in such a way that at least part of the end surface of the optical transmission member contacts the first optical portion. In the optical connector, in a cross section including the axis of the groove and an optical path between the first optical portion and the second optical portion, the angle between a surface of the first optical portion contacting the end surface of the optical transmission member and the axis of the groove is less than 90°.

Abstract: An optical device includes a first waveguide, having parallel first and second faces and parallel third and fourth faces forming a rectangular cross-section, that guides light by four-fold internal reflection and is associated with a coupling-out configuration that couples light out of the first waveguide into a second waveguide. The first or second face is subdivided into first and second regions having different optical characteristics. The optical device also includes a coupling-in configuration having a surface that transmits light into the first waveguide. The surface is deployed in association with a portion of the third or fourth face adjoining the second region such that an edge associated with the surface trims an input collimated image in a first dimension, and a boundary between the first and second regions trims the input collimated image in a second dimension to produce a trimmed collimated image that advances by four-fold internal reflection.

Abstract: A resin composition for coating an optical fiber comprises: a base resin containing a photopolymerizable compound and a photopolymerization initiator; and hydrophobic inorganic oxide particles, wherein the photopolymerizable compound comprises urethane (meth)acrylate and aliphatic epoxy (meth)acrylate, and the content of the aliphatic epoxy (meth)acrylate is 1.0% by mass or more and 45% by mass or less based on the total amount of the photopolymerizable compound.

Abstract: A method and system for an optical package assembly is disclosed. According to one example, the optical package assembly includes a photonic integrated circuit (PIC) chip, at least one fiber coupled to the PIC chip, a fiber lid plate disposed on at least a portion of the at least one fiber, and a cover plate having a surface coupled to the PIC chip and the fiber lid plate.

Abstract: A ferrule can be assembled in the field. A ferrule collar has a non-circular, in particular polygonal outer contour. A corresponding coding region of a ferrule housing is arranged in a portion of a contact chamber on a cable-connection side and has a non-circular, in particular polygonal cross section, in which the ferrule collar is held with a form fit over the entire spring displacement path. The ferrule spring acts on the ferrule collar over the entire displacement path. As a result, the ferrule is secured against rotation about its axis by a high holding force, which makes it easier for a fibre-optic cable to be screwed on. The structural form is particularly well-suited for use in a plug-in connector module.

Abstract: A fiber optic cable assembly includes a fiber optic cable and a fiber optic connector. The cable includes a jacket having an elongated transverse cross-sectional profile that defines a major axis and a minor axis. Strength components of the cable are anchored to the connector. The fiber optic connector includes a ferrule defining a major axis that is generally perpendicular to the major axis of the jacket and a minor axis that is generally perpendicular to the minor axis of the jacket. Certain types of connectors include a connector body defining a side opening that extends along a length of the connector body; a ferrule configured for lateral insertion into the connector body through the side opening; and a cover that mounts over the side opening after the ferrule has been inserted into the connector body through the side opening.

Abstract: Improved optical interconnects obtained by replacing one or more single core fibers with one or more multicore fibers. In some instances, at least one of the optical fibers is shaped.

Abstract: A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region.

Abstract: A transparent substrate has two parallel faces and guides collimated image light by internal reflection. A first set of internal surfaces is deployed within the substrate oblique to the parallel faces. A second set of internal surfaces is deployed within the substrate parallel to, interleaved and in overlapping relation with the first set of internal surfaces. Each of the internal surfaces of the first set includes a first coating having a first reflection characteristic to be at least partially reflective to at least a first subset of components of incident light. Each of the internal surfaces of the second set includes a second coating having a second reflection characteristic complementary to the first reflection characteristic to be at least partially reflective to at least a second subset of components of incident light. The sets of internal surfaces cooperate to reflect all components of light from the first and second subsets.

Abstract: A method for depositing silicon oxynitride film structures is provided that is used to form planar waveguides. These film structures are deposited on substrates and the combination of the substrate and the planar waveguide is used in the formation of optical interposers and subassemblies. The silicon oxynitride film structures are deposited using low thermal budget processes and hydrogen-free oxygen and hydrogen-free nitrogen precursors to produce planar waveguides that exhibit low losses for optical signals transmitted through the waveguide of 1 dB/cm or less. The silicon oxynitride film structures and substrate exhibit low stress levels of less than 20 MPa.

Abstract: A package structure comprises photonic dies and an interposer structure. Each photonic die includes a dielectric layer and a first grating coupler embedded in the dielectric layer. The interposer structure is disposed below the photonic dies. The interposer structure includes an oxide layer and a second grating coupler embedded in the oxide layer. The photonic dies are optically coupled through the first grating couplers of the photonic dies and the second grating coupler of the interposer structure.

Abstract: An optical isolator 10 according to the present disclosure includes a substrate 11 and an optical waveguide 12 provided on the substrate 11. The optical waveguide 12 includes a first end part 13, a plurality of second end parts 14 arranged in an array, and at least one branching part 18 located between the first end part 13 and the plurality of second end parts 14. The optical waveguide 12 has a portion having non-reciprocity and gives different non-reciprocal phase shift amounts between the first end part 13 and at least two of the second end parts 14.

Abstract: A multicore fiber includes: n pieces of first core regions in a circular shape with a radius r1 that are arranged about points P11 to P1n, and that has a first core portion and a first cladding portion; a second core region in a circular shape with a radius R1 that is arranged about the point a1, and that has a second core portion and a second cladding portion; and a cladding region that is formed on an outer circumferences of the first core region and the second core region. Further, abutting surfaces that are flat surfaces abutting on each other are formed in portions on the outer circumferences of the first core region and the second core region.

Abstract: The present invention relates to an optical fiber sensor for shape sensing, comprising an optical fiber having embedded therein a number of at least four fiber cores (1 to 6) arranged at a distance from a longitudinal center axis (0) of the optical fiber, the number of fiber cores (1 to 6) including a first subset of at least two fiber cores (1, 3, 5) and a second subset of at least two fiber cores (2, 4, 6), the fiber cores (2, 4, 6) of the second subset being arranged to provide a redundancy in a shape sensing measurement of the fiber sensor (12?). The fiber cores (1, 3, 5) of the first subset are distributed in azimuthal direction around the center axis (0) with respect to one another, and each fiber core (2) of the second subset is arranged in non-equidistantly fashion in azimuthal direction around the center axis (0) with respect to two neighboring fiber cores (1, 3) of the first subset.

Abstract: A large-scale single-photonics-based optical switching system that occupies an area larger than the maximum area of a standard step-and-repeat lithography reticle is disclosed. The system includes a plurality of identical switch blocks, each of is formed in a different reticle field that no larger than the maximum reticle size. Bus waveguides of laterally adjacent switch blocks are stitched together at lateral interfaces that include a second arrangement of waveguide ports that is common to all lateral interfaces. Bus waveguides of vertically adjacent switch blocks are stitched together at vertical interfaces that include a first arrangement of waveguide ports that is common to all vertical interfaces. In some embodiments, the lateral and vertical interfaces include waveguide ports having waveguide coupling regions that are configured to mitigate optical loss due to stitching error.

Abstract: A photonic integrated circuit, PIC, comprising a plurality of semiconductor layers on a substrate, the plurality of semiconductor layers forming a PIN or PN doping structure, the PIC comprising a waveguide arranged for conducting light waves; an optical element connected to the waveguide, wherein the optical element, in operation, is in reverse-bias mode, and wherein the optical element comprises a contact layer arranged for connecting to a voltage source; wherein the waveguide comprises conducting contacts proximal to the optical element, and wherein the PIC further comprises at least one isolation section arranged in between the optical element and the conducting contacts. Corresponding methods of operation of such a PIC are also presented herein.