Abstract: An optical receptacle includes a first optical surface, a second optical surface, and an annular first cylindrical part disposed to surround a second central axis of the second optical surface. The first cylindrical part includes a first inner surface with a circular shape in a cross section perpendicular to the second central axis, and a second inner surface disposed on a second optical surface side than the first inner surface and provided with a circular shape in the cross section perpendicular to the second central axis. A diameter of the first inner surface is greater than a diameter of the second inner surface, and a length of the second inner surface in a direction along the second central axis is 0.5 to 4.0 mm.

Abstract: An optical rotary joint includes a first annular portion and a second annular portion configured to rotate with respect to each other. Optical receivers on a receiver face of the second annular portion receive from optical transmit beam launchers on an emitter face of the first annular portion. The transmit beam launchers transmit optical signals to the optical receivers as the second annular portion rotates with respect to the first annular portion.

Abstract: Fiber optic connectors, cable assemblies and methods for making the same are disclosed. In one embodiment, the optical connector comprises a housing and a ferrule. The housing comprises a longitudinal passageway between a rear end and a front end, and, a part of the rear portion of the housing comprises a round cross-section and a part of the front portion of the housing comprises a non-round cross-section with a transition region disposed between the rear portion and the front portion.

Abstract: The present invention relates to a rapid optical fiber link restoration solution rapidly deployed by pulling, blowing, jetting or hanging in an aerial, on-ground, underground or inside a duct includes an optical fiber connector and an optical fiber cable. The optical fiber connector is connected at both ends of the optical fiber cable. Particularly, the optical fiber cable is dielectric and has a tensile strength 2500 N and a crush resistance of 2000 N/100 mm. Moreover, the optical fiber connector has water resistance for 1.5 meters of water-head for a maximum period of 30 minutes.

Abstract: Configurations for an optical splitter are disclosed. The optical splitter may include an input waveguide, a free propagation region, and an array of output waveguides. The input waveguide may be sufficiently narrow that the light in the free propagation region may diffract and provide the same optical intensity at far field angles across a wide wavelength range. The input waveguide may have a high V number in a vertical dimension and a low V number in a horizontal dimension. Because all of the wavelengths of light diffract at the same angle in the free propagation region, once the light reaches the output waveguides, the light may have similar optical power at each of the output waveguides. Additionally, the output waveguides may vary in width and spacing to mitigate the non-uniform optical power distribution of the phase front of light.

Abstract: An optical fiber connector is provided. A receptacle has an angled interior surface that acts to guide an optical fiber into the correct position as a jack is inserted into the receptacle.

Abstract: The present disclosure provides a connection assembly, a cable plug and a cable assembly. The connection assembly comprises: a core base, configured to fix an end of a cable and comprising a first clamping portion; and a first fixing member, arranged with at least one second clamping portion and defining a first recess in an axial direction; wherein the first recess is configured to laterally accommodate a first portion of the cable different from the end of the cable, and the at least one second clamping portion is configured to fix the core base by directly or indirectly cooperating with the first clamping portion.

Abstract: A light coupling element including a groove and a light redirecting member is described. The groove is for receiving and aligning an optical waveguide and incudes an open front end and a back end. The light redirecting member includes an input side for receiving light from an optical waveguide received and supported in the groove and a light redirecting side for changing a direction of light received from the input side. The groove may include a bottom surface extending between the front and back ends of the groove and including a raised bottom surface portion raised upwardly relative to an unraised bottom surface portion. The unraised bottom surface portion of the bottom surface may be disposed between the raised bottom surface portion of the bottom surface and the input side of the light redirecting member. Optical coupling assemblies including the light coupling element and an optical waveguide are described.

Abstract: A semiconductor laser device is provided. The semiconductor laser device includes: a substrate having a first facet; a guiding layer having a second facet through which an output light is configured to be emitted; a bottom dielectric layer between the substrate and the guiding layer; and a top dielectric layer on the guiding layer. The second facet is at an angle relative to the first facet.

Abstract: Disclosed are disinfecting covers for optical-fiber connectors. For example, a male disinfecting cover can include a plug, a bore of the plug, an absorbent disposed in the bore, and a disinfectant absorbed by the absorbent. The plug is configured to insert into a receptacle of a female optical-fiber connector. A female disinfecting cover can include a body, a receptacle in the body, an absorbent disposed in the receptacle, and a disinfectant absorbed by the absorbent. The receptacle is configured to accept a male optical-fiber connector. Whether the disinfecting cover is male or female, the absorbent is configured to contact the ferrule and the optical fiber disposed of the optical-fiber connector. Methods can include at least a method of using the male or female disinfecting cover.

Abstract: There is provided a method for fabricating an optical printed circuit board. The method includes preparing a first printed circuit board portion with an array of optical fibers attached thereon, assembling an optical fiber connector with the first printed circuit board portion such that the optical fiber connector is arranged at ends of the array of optical fibers, and attaching one or more second printed circuit board portions to the first printed circuit board portion to form an optical printed circuit board with the optical fiber connector embedded therein. The optical fiber connector includes an engagement mechanism arranged for engagement with an external optical device.

Abstract: A functionalized waveguide for a detector system includes an incoupling region of a main body that deflects only part of the radiation coming from an object to be detected and impinges on the front face such that the deflected part propagates as coupled-in radiation in the main body by reflections up to the decoupling region and impinges on the decoupling region. A decoupling region deflects at least part of the coupled-in radiation impinging thereon such that the deflected part exits the main body via the front or rear face to impinge on the detector system. The extent of the incoupling region in a second direction transverse to the first direction is greater than the extent of the decoupling region in the second direction. In the second direction, the incoupling region has at least two different diffractive incoupling structures which have a different deflection component in the second direction.

Abstract: The present disclosure relates to a distribution cable assembly that has various features to enable flexible configurations to accommodate various data center configurations.

Abstract: Various embodiments relate to an FTIR-based diffractive optical structure, and a waveguide device and an augmented reality display each including same. The augmented reality display may comprise: a projector configured to provide light related to an image; and a waveguide device for outputting at least a part of the light, wherein: the waveguide device comprises a waveguide and a diffractive optical structure disposed on one surface of the waveguide; and the diffractive optical structure comprises an expansion grating disposed at the one surface of the waveguide and an output grating disposed along the axis perpendicular to the one surface of the waveguide and overlapping at least a partial area of the expansion grating.

Abstract: The present disclosure relates to an electronic device that includes a waveguide, a plurality of transceiving portions over the waveguide, and a cavity between the waveguide and the transceiving portions and connecting the waveguide with the transceiving portions. The cavity is configured for resonating of an electromagnetic wave from the waveguide or the transceiving portions.

Abstract: An optical receptacle includes: a first optical surface configured to allow, to enter the optical receptacle, light emitted from the photoelectric conversion element package, or emit, toward the photoelectric conversion element package, light travelled inside the optical receptacle; a second optical surface configured to emit, toward the optical transmission member, the light travelled inside the optical receptacle, or allow, to enter the optical receptacle, light emitted from the optical transmission member; a cylindrical part configured to house at least a part of the photoelectric conversion element package such that the first optical surface and the photoelectric conversion element face each other; and a first groove part disposed at a periphery of the first optical surface.

Abstract: Devices, arrangements and methods for fixing telecommunications cables relative to a telecommunications closure. Features of the devices and arrangements can make more efficient use of an interior closure volume and enhance a closure's capabilities with respect to handling different types of telecommunications cables and optical fiber routing schemes.

Abstract: An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400° C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

Abstract: A package structure includes a circuit board, a package substrate, a fine metal L/S RDL-substrate, an electronic assembly, a photonic assembly, a heat dissipation assembly, and an optical fiber assembly. The package substrate is disposed on and electrically connected to the circuit board. The fine metal L/S RDL-substrate is disposed on and electrically connected to the package substrate. The electronic assembly includes an application specific integrated circuit (ASIC) assembly, an electronic integrated circuit (EIC) assembly, and a photonic integrated circuit (PIC) assembly which are respectively disposed on the fine metal L/S RDL-substrate and electrically connected to the package substrate by the fine metal L/S RDL-substrate. The heat dissipation assembly is disposed on the electronic assembly. The optical fiber assembly is disposed on the package substrate and electrically connected to the package substrate and the PIC assembly. A packaging method of the VCSEL array chip is presented.

Abstract: The present disclosure includes a method of securing a photonic component to a semiconductor chip, the method including forming a thermosonic bond between the semiconductor chip and a cap to fix the cap against the photonic component. The present disclosure also includes an apparatus including a semiconductor chip having a V-groove, an optical fiber in the V-groove, and a cap secured to the semiconductor chip through a bond including a metal bump, wherein the cap fixes the optical fiber in the V-groove.