Abstract: A shot processing apparatus including: a cabinet with a processing chamber formed therein, the processing chamber allowing a workpiece to be conveyed thereinto; a ejecting mechanism ejecting a shot media to a hole of the workpiece; and a conveyance device conveying the workpiece between a preparation position for the workpiece and the cabinet, wherein the conveyance device includes a plate-like rotary table provided to be rotatable about a rotation axis, being provided with a conveyor for moving the workpiece on an upper surface of the rotary table, and allowing the plurality of workpieces to be arranged thereon, the rotary table connects the conveyor to the preparation position and the cabinet at a predetermined rotational position, and the shot processing apparatus has an inspection area for inspecting a state of the hole of the workpiece, between the preparation position and the rotation axis of the rotary table.

Abstract: A method of chemical mechanical polishing includes bringing a substrate having a conductive layer disposed over a semiconductor wafer into contact with a polishing pad, generating relative motion between the substrate and the polishing pad, monitoring the substrate with an in-situ electromagnetic induction monitoring system as the conductive layer is polished to generate a sequence of signal values that depend on a thickness of the conductive layer, determining a sequence of thickness values for the conductive layer based on the sequence of signal values, and at least partially compensating for a contribution of conductivity of the semiconductor wafer to the signal values.

Abstract: A carrier head for a polishing system includes a housing, a flexible membrane, a first plurality of pressure supply lines, a second plurality of pressure supply lines, and a valve assembly. The flexible membrane defines a multiplicity of independently pressurizable chambers. The valve assembly has a multiplicity of valves with each respective valve of the multiplicity of valves coupled to a respective pressure chamber from the multiplicity of independently pressurizable chambers. Each respective valve is configured to selectively couple the respective pressure chamber to one pressure supply line from a pair of pressure supply lines that include a pressure supply line from the first plurality of pressure supply lines and a pressure supply line from the second plurality of pressure supply lines.

Abstract: In one embodiment, a fluid delivery apparatus includes a vessel body having a first chamber and a second chamber disposed therein, a plurality of first delivery lines fluidly coupled to the first chamber, a dispense nozzle fluidly coupled to the second chamber, a second delivery line fluidly coupled to the second chamber, and a valve disposed between the first and second chambers. Here, fluid communication between the first chamber and the second chamber is controlled by the valve disposed therebetween. Polishing fluid components are flowed into the first chamber through the plurality of first delivery lines fluidly coupled thereto to form a batch of polishing fluid. Once formed, the batch of polishing fluid is transferred to the second chamber by opening the valve.

Abstract: A sanding device for sanding a workpiece. The sanding device includes a sanding block. The sanding block includes a right triangular block having a triangular base and a rectangular block having a rectangular base. The rectangular block may be affixed to a side surface of the right triangular block. The sanding block includes sanding block base surfaces having the triangular base abutting the rectangular base along a straight edge. The sanding block base surfaces include an abrasive surface and an engagement surface opposite the abrasive surface. The engagement surface includes a hand-shaped recess extending from the engagement surface towards the abrasive surface. The hand-shaped recess includes a thumb-shaped recess in the triangular base of the engagement surface and at least one non-thumb-shaped recess in the rectangular base of the engagement surface.

Abstract: Provided is a double-sided polishing method of a wafer in which the wafer, which has been set in a wafer loading hole of the carrier, is compressed and held along with the carrier with an upper platen and a lower platen and the upper platen and the lower platen are rotated while supplying slurry to the wafer. The method includes: previously measuring an inclination value of a main surface of each of a plurality of carriers in the vicinity of the edge of the wafer loading hole; selecting, from among the plurality of carriers, those for which the inclination value is equal to or smaller than a threshold based on the measurement results of the inclination value; and applying the double-sided polishing to a wafer using the selected carrier.

Abstract: A method of manufacturing a hexagonal Group-III nitride semiconductor plate crystal using a crystal cutting wire. where the hexagonal semiconductor crystal has one principal face on one side and another principal face on an opposite side, and the hexagonal semiconductor crystal is cut by causing the crystal cutting wire to move so as to (i) divide the one principal face and the another principal face and (ii) satisfy conditions of Expressions (A) and (B): 25°<??90°??Expression (A); and ?=90°±5°??Expression (B) where ? represents an angle formed by a c axis of the hexagonal Group-III nitride semiconductor crystal and a normal line of a crystal face cut out by the wire, and ? represents an angle formed by a reference axis, which is obtained by perpendicularly projecting the c axis of the hexagonal Group-III nitride semiconductor crystal to the crystal face cut out by the wire, and a cutting direction.

Abstract: A grinding equipment includes: a frame which has a central shaft disposed collinearly to one side of the polishing wheel and rotates about the central shaft; a plurality of seating portions which are disposed on the upper side of the frame, each have a space formed in the central portion thereof, seat a workpiece on the upper surfaces thereof, and are arranged radially from the central shaft of the frame; a plurality of vacuum portions which are disposed in the central portions of the plurality of seating portions respectively, seat the workpiece on the upper surfaces thereof, and each have a plurality of flow channels so as to secure the workpiece by suctioning air through the flow channels; and a control unit for controlling the rotation of the frame.

Abstract: A chemical mechanical planarization apparatus includes a multi-zone platen comprising a plurality of individually controlled concentric toroids. The rotation direction, rotation speed, applied force, relative height, and temperature of each concentric toroid is individually controlled. Concentric polishing pads are affixed to an upper surface of each of the individually controlled concentric toroids. The chemical mechanical planarization apparatus includes a single central slurry source or includes individual slurry sources for each individually controlled concentric toroid.

Abstract: A handheld belt sander with improved structure includes a main body having a rotating wheel and a mount. A support rod with a front roller is disposed on the mount. A support member with a rear roller is disposed on the mount. A tightened grinding belt encircles the rotating wheel, the front roller and the rear roller. A space is formed between the support rod and a part of the grinding belt between the front roller and the rear roller so that the grinding belt moves into the space after being pressed. Two side rollers are disposed on two sides of the support member to be adjacent to the grinding belt and are separated from the grinding belt by a gap in order to block the grinding belt from separating from the rear roller.

Abstract: A substrate polishing method capable of reducing an influence of variation in spectrum of reflected light from a substrate, such as a wafer, and determining an accurate film thickness is disclosed. The method includes: polishing a surface of a substrate by pressing the substrate against a polishing pad on a rotating polishing table; producing a spectrum of reflected light from the surface of the substrate each time the polishing table makes one rotation; creating a three-dimensional data containing a plurality of spectra arranged along polishing time; and determining a film thickness of the substrate based on the three-dimensional data.

Abstract: A magnetic element for strengthening a magnetic field formed in an object and an eddy current sensor using the magnetic field are provided. The eddy current sensor includes a bottom face portion which is a magnetic body, a magnetic core portion provided at the middle of the bottom face portion and a peripheral wall portion provided on the periphery of the bottom face portion. The eddy current sensor further includes an excitation coil disposed on an outer periphery of the magnetic core portion and capable of generating a magnetic field and an excitation coil disposed on an outer periphery of the peripheral wall portion and capable of generating a magnetic field.

Abstract: Diamond-containing articles such as composite materials shaped as some specific article, can be engineered such that bodies that contact the article only contact diamond. In an embodiment, the article may be in the form of equipment for handling semiconductor wafers such as vacuum or electrostatic chucks. In one embodiment, the diamond-containing article can be a composite of diamond particulate reinforcing a Si/SiC body such as reaction-bonded SiC. Lapping the diamond-reinforced RBSC body with progressively finer diamond grit removes some of the SiC/Si matrix material, leaving diamond particles of uniform height “standing proud” above the rest of the surface of the formed article. Further, if the diamond-containing article is sufficiently electrically conductive, it may be machinable using electrical discharge machining.

Abstract: A controller is provided for use in controlling a blade sharpening system that includes at least one grinding wheel operable to sharpen the blade. The controller includes a memory device, and a processor communicatively coupled to the memory device. The processor is configured to receive signals from at least one sensor, the at least one sensor operable to monitor rotation of the at least one grinding wheel. The processor is further configured to adjust a position of the at least one grinding wheel relative to the blade based on the received signals.

Abstract: A system for polishing a sample is provided. The system may comprise a motor. The system may also include a polishing element that is actuated by the motor. The system may also have a sample holder. The sample holder may hold a sample to be polished by the polishing element. In some examples, the sample holder has multiple degrees of movement in order to precisely polish, grind, or bevel the sample. In some examples, the system may further include an arm having a slurry dispenser, inlets for fluid, and a squeegee-like element to clean, wash, or brush off debris from the polishing element during a polishing process.

Abstract: A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.

Abstract: A polishing apparatus includes a rotatable head body having a pressing surface, a retainer ring configured to press a polishing surface while rotating together with the head body, a stationary ring, local load applying devices configured to apply a local load to the stationary ring, and a controller. The local load applying devices include a first pressing member and a second pressing member connected to the stationary ring. The first pressing member is disposed in the upstream side of the retainer ring in the traveling direction of the polishing surface, and the second pressing member is disposed in the downstream side. The controller calculates the inclination angle of the stationary ring based on a measured value of the height of at least one of the first pressing member and the second pressing member.

Abstract: A remotely operated abrasive blasting apparatus is provided. Systems incorporating the apparatus, and methods of treating surfaces using the apparatus and systems are also provided. The abrasive blasting apparatus eliminates the need for human operators to be present in the area being treated, and allows areas inaccessible to human operators to be treated.

Abstract: An automatic grinding machine with positioning effect has a body, at least two positioning sets, and a processing set. The body has a base, a grinding mount, a drive device, and a fixture. The base has a chamber. The at least two positioning sets are connected to the body and each positioning set has a displacement device and an optical module. The displacement device is mounted in the chamber. The optical module is disposed on the displacement device and is moved relative to the grinding mount by the drive device to position locations of the grinding mount and a probe card. The processing set is electrically connected to the drive device and the fixture of the body and the displacement device and the optical module of each positioning set, and has a computer control interface.

Abstract: A floor cleaning machine is provided. The floor cleaning machine includes a solution tank for a cleaning solution. A pre-canister sensor receives the cleaning solution and measures the concentration of any dissolved solids. A canister assembly receives a portion of the cleaning solution from the pre-canister sensor and dissolves portions of a solid chemical form into the cleaning solution thereby forming blended droplets. The canister assembly has a spray nozzle positioned vertically above the solid chemical form. A post-canister sensor receives a mixture of the cleaning solution from the pre-canister sensor and the blended droplets from the canister assembly. The post-canister sensor measures the concentration of any dissolved solids within the mixture of the cleaning solution from the pre-canister sensor and the blended droplets from the canister assembly. A comparison of the baseline and post-canister measurements outside of a desired range results in replacement of the solid chemical form.