Abstract: An advanced substrate rotation device is provided. A substrate rotation device is disclosed. The substrate rotation device includes an outer cylinder, an inner cylinder positioned inside the outer cylinder, a motor for rotating the inner cylinder, a magnetic bearing for magnetically levitating the inner cylinder, and a substrate holder disposed on the inner cylinder. The motor is a radial motor including a motor stator mounted on the outer cylinder, and a motor rotor mounted on the inner cylinder. The magnetic bearing is a radial magnetic bearing including a magnetic bearing stator mounted on the outer cylinder, and a magnetic bearing rotor mounted on the inner cylinder. The magnetic bearing is configured to magnetically levitate the inner cylinder with an attractive force between the magnetic bearing stator and the magnetic bearing rotor.

Abstract: A processing apparatus includes: a selection section that selects two or more components from a plurality of components including a holding table, a processing unit, a robot, a temporary placing unit, a carrying-in mechanism, a cleaning unit, and a carrying-out mechanism; and a control unit that handles a workpiece at part of routes that correspond to the components selected by the selection section, of the routes for passage of the workpiece at the time of processing the workpiece full-automatically by use of the plurality of components.

Abstract: A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid delivery arm and a second fluid delivery arm disposed over the polishing pad to dispense liquid, such as a polishing fluid or water. The first fluid delivery arm is disposed over at least 50% of the radius of the polishing pad, while the second fluid delivery arm is disposed over less than 50% of the radius of the polishing pad. The second fluid delivery arm is configured to dispense either a polishing fluid or a water onto the polishing pad to effect the polishing rate at the edge of the substrate.

Abstract: A method of conditioning a polishing pad includes receiving information on a roughness of the polishing pad from a first sensor. The method further includes conditioning the polishing pad using a conditioner. The method further includes detecting the roughness of the polishing pad following the conditioning. The method further includes repeating the conditioning in response to the detected roughness of the polishing pad being outside of a threshold roughness range.

Abstract: The present invention relates to a floor treatment apparatus (1) and method for treating a floor.

Abstract: A method cuts semiconductor wafers. The method includes: cutting a semiconductor ingot into a workpiece; and sawing the workpiece into slices using a wire grid having a fixed abrasive grain wire, while moving workpiece towards the wire grid. At a first contact of the workpiece with the wire grid, an initial cutting speed is less than 2 mm/min, coolant flow is less than 0.1 l/h and a wire speed is greater than 20 m/s. The workpiece is then guided through the wire grid until a first cutting depth is reached, and then the coolant flow is increased to at least 2000 l/h. The cutting speed is reduced to less than 70% of the initial cutting speed between the first contact of the workpiece with the wire grid up to a cutting depth of half a diameter of the cylinder, and is then increased.

Abstract: A method of operating a chemical mechanical planarization (CMP) tool includes attaching a polishing pad to a first surface of a platen of the CMP tool using a glue; removing the polishing pad from the platen, wherein after removing the polishing pad, residue portions of the glue remain on the first surface of the platen; identifying locations of the residue portions of the glue on the first surface of the platen using a fluorescent material; and removing the residue portions of the glue from the first surface of the platen.

Abstract: A dust collecting treatment apparatus is connected to a dry type polishing apparatus, sucks dust-containing air from the dry type polishing apparatus, and separates the dust and the air from each other. The apparatus includes a cylindrical main body connected to the dry type polishing apparatus; a suction box disposed on an upper plate of the cylindrical main body, a suction source connected to the suction box through a ventilating duct, a filter unit that includes a flange section supported on the upper plate of the cylindrical main body, a pipe formed integrally with the flange section and formed of a plurality of minute holes, and a filter formed of a water-soluble material and externally fitted to the pipe in a detachable manner. The filter is disposed inside the cylindrical main body. A water jet nozzle is disposed inside the suction box and jets water into the filter unit.

Abstract: A polishing assembly for polishing of silicon wafers includes a polishing pad, a polishing head assembly, a temperature sensor, and a controller. The polishing head assembly holds a silicon wafer to position the silicon wafer in contact with the polishing pad. The polishing head assembly selectively varies a removal profile of the silicon wafer. The temperature sensor collects thermal data from a portion of the polishing pad. The controller is communicatively coupled to the polishing head assembly and the temperature sensor. The controller receives the thermal data from the temperature sensor and operates the polishing head assembly to selectively vary the removal profile of the silicon wafer based at least in part on the thermal data.

Abstract: The method generally involves the steps of filling the cavities in a production tool each with an individual abrasive particle. Aligning a filled production tool and a resin coated backing for transfer of the abrasive particles to the resin coated backing. Transferring the abrasive particles from the cavities onto the resin coated backing and removing the production tool from the aligned position with the resin coated backing. Thereafter the resin layer is cured, a size coat is applied and cured and the coated abrasive article is converted to sheet, disk, or belt form by suitable converting equipment.

Abstract: A loading device for a plunge-cut grinding machine for centerless external cylindrical grinding includes a receiving frame, a support body, and a displacement actuator. The receiving frame is open in a gravitational direction and is for receiving a blank workpiece to be machined. The support body forms a support base for the blank workpiece. The displacement actuator is for axially displacing the receiving frame relative to the support body and into a grinding gap of the plunge-cut grinding machine. The receiving frame includes a conveying stop on an axially facing end face. The conveying stop is for axially expelling a final workpiece arranged in the grinding gap.

Abstract: The present disclosure relates to a grinding head (1) for a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a grinding head (1) comprises a lower casing member (3), comprising a lower support (31) and an upwardly extending edge portion (32), and an upper casing number (2), comprising an upper cover (21) and a downwardly extending edge portion (22), wherein the upper casing member (2) is joinable to the lower casing member (3) by causing axially distal portions of the edge portions to bear on each other.

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, the platen having a recess, a flexible membrane in the recess, and an in-situ vibration monitoring system to generate a signal. The in-situ acoustic monitoring system includes a vibration sensor supported by the flexible membrane and positioned to couple to an underside of the polishing pad.

Abstract: There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.

Abstract: The present disclosure provides a carbide blade grinding forming processing production line, relates to the field of blade processing in forming, and provides a production line for grinding forming processing of a carbide blade with inscribed circular holes, which has functions of blade grinding forming processing, blade cleaning and drying and detection of external dimension of a formed blade, and has an automatic loading and uninstalling function. In most processing course of the blade, the cutter head is taken as a carrier, and an overturning device is configured to overturn a whole cutter die box, such that integral end surface overturning of the cutter head in the cutter die box after single end surface grinding is realized, and blade filling processes in different processing links are reduced.

Abstract: Embodiments of a high-speed rotatable workpiece abrasive polishing head are disclosed that allow flat surfaced hard material workpieces or sapphire or semiconductor wafers to be polished at high abrading speeds that can use water-mist cooled quick-change fixed abrasive island-type discs. Workpieces can be quickly attached with vacuum to a rotatable workpiece plate having a curved (e.g., spherical) bearing with an offset spherical center of rotation located at the workpiece abraded surface. Abrading contact there prevents lateral abrading friction forces from tilting workpieces and causing non-flat workpiece surfaces. The workpiece carrier plate can be rotationally driven by a floating drive shaft having a spherical spline head that contacts the workpiece carrier plate at a position close to the workpiece abraded surface to avoid tilting of the workpiece due to the shaft-applied workpiece rotation forces.

Abstract: A storage shield for a disc of an angle grinder is provided according to the present invention. The storage shield includes a first shield member and a second shield member. Each of the first and second shield members includes a front face, an opposing rear face positioned parallel to and a distance apart from the front face, an end wall that joins an upper edge of the front face to an upper edge of the rear face, and a front face opening between a lower edge of the front face and a lower edge of the rear face, and an opening in a center area of the front face at the lower edge thereof. A pivot hinge assembly pivotally connects a first end of the first shield member to a first end of the second shield member. Fastening means for affixing the storage shield and stored angle grinder to a worksite surface are affixed to the rear face of one of the first shield member or second shield member. A method of protecting a disc of an angle grinder when not in use is also provided. First, the storage shield is opened.

Abstract: In an automatic wet sanding apparatus including a paper peeling unit that has a clamping shaft and a clamping hook, an inclination angle of a leading end surface of the clamping hook is equal to an inclination angle of an outer circumferential surface of a cushion pad at the start of a paper peeling step. Thus, the leading end surface of the clamping hook comes into contact with an outer circumferential end of a disc at the same time as coming into contact with the outer circumferential surface of the cushion pad, so that the cushion pad is less likely to get caught due to deformation of the outer circumferential surface and its peripheral part of the cushion pad. It is therefore possible to appropriately remove the sandpaper from the cushion pad and stably perform the task of removing the sandpaper.

Abstract: A sharpening apparatus includes a base having a top surface with a channel or mounting rail. A clamping assembly is configured to be secured to base via the rail or channel. When installed, the clamping assembly includes a pair of jaws extending upward from the top of the base in opposed alignment with distal ends of each jaw adjustably spaced to grip a cutting implement. A guide rod has an end configured to be pivotably mounted to the base via the rail or channel and so that the rod's position along the base is adjustable by sliding movement along the rail or channel.

Abstract: An automatic floor-disinfection robot for floors of hospital rooms, including a moving device, a alarm and a disinfection device. The moving device is a disc-shaped robot, and includes a chassis moving mechanism, a support plate and a top plate arranged successively from bottom to top. The disinfection device includes a disinfection assembly and a baffle. The disinfection assembly includes a liquid supply mechanism, a liquid spray mechanism and a fan.