Abstract: A polishing-pad laminated structure which allows for easy alignment of a through-hole of a polishing pad with a sensor head installed in a polishing table is disclosed. The polishing-pad laminated structure includes a polishing pad and a release sheet. The polishing pad has a through-hole located at a position corresponding to a position of a sensor head disposed in the polishing table. The release sheet covers an adhesive surface of the polishing pad. The release sheet is divided into at least a first release sheet and a second release sheet. The first release sheet has a surface area smaller than a surface area of the second release sheet.

Abstract: Apparatus with a rotationally drivable receptacle for a grinding tool to be tested, wherein the apparatus comprises: an optical testing apparatus arranged such that the grinding tool, while being rotatably driven, is at least partially irradiated by light emanating from an emitter of the testing apparatus, and that at least a portion of the light from the grinding tool is reflectable in the direction towards a sensor of the testing apparatus, wherein the sensor is adapted to provide test information, a computing device which is designed for processing the test information in order to determine a 3-dimensional vector model of the grinding tool from macroscopic basic information, a memory in which a target vector model is stored, a computing device which is designed for comparing the vector model with the target vector model in order to enable the determination of deviations between the vector models.

Abstract: A mower reel grinding system a plurality of mower unit types, including a grinding wheel shaft, the grinding wheel shaft at a fixed position in an x-y plane. A mounting plate includes a number of predetermined fixed mounting positions on the mounting plate, each predetermined fixed mounting positions corresponding to at least one type of mower unit of the plurality of mower unit types, a mounting bracket to receive a mower unit, the mounting bracket selectively moveable to the predetermined fixed position corresponding to the mower unit type to be received thereby, and a pivot point about which the mounting plate rotates to adjust a position of the mounting bracket in the x-y plane relative to the grinding wheel shaft.

Abstract: A system for sanding a surface includes a sanding tool, a robotic manipulator to move the sanding tool relative to the surface, and a control unit operatively coupled with the sanding tool and the robotic manipulator. The control unit is operable to: (1) move the sanding tool to a sanding position relative to the surface in which an abrasive surface is in contact with the surface and a sanding force is approximately normal to the surface; (2) set one or more sanding parameters corresponding to a model material removal rate; (3) monitor one or more of the sanding parameters; (4) determine an actual material removal rate, based on one or more of the sanding parameters being monitored; and (5) modify one or more of the sanding parameters until the actual material removal rate is approximately equal to the model material removal rate.

Abstract: A first and a second substrate polishing apparatus and are provided with a film thickness sensor for measuring a film thickness of layer to be polished and polish the layer by pressing the substrate against a polishing pad. The first substrate polishing apparatus outputs difference between output value of the film thickness sensor when an underlayer is exposed and output value of the film thickness sensor when the substrate is not present, as a first offset value. The second substrate polishing apparatus has a storage unit that stores information of the first offset value, an output correction unit that corrects the output value from the film thickness sensor based on the first offset value, and an end point detection unit that outputs control signal indicating end point of substrate polishing when measured value of the film thickness of the layer calculated based on the corrected output value reaches target value.

Abstract: The present disclosure relates to a grinding head for a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a grinding head comprises a lower casing member, comprising a lower support and an upwardly extending edge portion, and an upper casing member, comprising an upper cover and a downwardly extending edge portion, wherein the upper casing member is joinable to the lower casing member by causing axially distal portions of the edge portions to bear on each other.

Abstract: The adverse effects associated with high temperatures and warpage of parts of a shot blaster are ameliorated by providing a telescoping sleeve and valve mount and an orifice adaptor to regulate the area of the flow path from a shot reservoir to a metering valve.

Abstract: A silicon wafer single-side polishing method that can significantly improve the stepped minute defect occurrence rate is provided. The silicon wafer single-side polishing method comprises: a first polishing step of performing polishing on one side of a silicon wafer under a first polishing condition; and a second polishing step of performing polishing on the silicon wafer under a second polishing condition in which at least one of an applied pressure and a relative speed in the first polishing condition is changed, after the first polishing step, wherein a polishing rate ratio according to the first polishing condition is higher than a polishing rate ratio according to the second polishing condition.

Abstract: An abrasive head with inserted jet for cleaning/removing material surfaces and splitting/cutting materials by a liquid beam enriched with solid abrasive particles to extend the tool lifetime by eliminating damage to the liquid jet's aperture by the abrasive, avoid degrading the abrasive inside the tool and increase the cutting power and flow efficiency.

Abstract: A rotary radial wire brush made of an annular center disc hub having 32 holes circumferentially spaced apart two radially offset distances from a center about which the brush rotates with a brush wire formed of between 22 and 34 filaments or bristles providing increased material removal rates during a longer useful operating life. A preferred brush has a hub with radially outermost openings larger in size than radially innermost openings causing the brush wire anchored by its twist knot thereto to be more flexible and extend farther radially outwardly than a shorter stiffer more aggressive wire produced by anchoring via a longer twist knot to radially innermost openings. Such a construction produces a rotary brush of the invention with brush wires of alternating flexible and aggressive construction increasing surface finish and material removal rates while having increased brush life.

Abstract: The invention relates to a method for detecting, controlling and automatically compensating pressure in a polishing process, including: detecting a pressure between a polishing wheel and a polished workpiece by a detection shaft or a moment generated on the detection shaft, and outputting the detected pressure or moment to a controller; comparing the detected pressure or moment with a preset pressure or moment and determining whether there is a difference between them; calculating a compensation feeding amount based on the difference and outputting an adjustment signal to an adjustment shaft based on the compensation feeding amount; and moving the adjustment shaft correspondingly based on the adjustment signal so as to drive the polishing wheel or the polished workpiece to move correspondingly to adjust a relative position between the polishing wheel and the polished workpiece so that the difference keeps consistent.

Abstract: A polishing method capable of accurately determining a polishing end point of a substrate is disclosed. The method comprises: rotating a polishing table supporting a polishing pad; and polishing the substrate by pressing the substrate against a polishing surface of the polishing pad by a polishing head, wherein polishing the substrate includes: an oscillation polishing process of polishing the substrate while causing the polishing head to oscillate along the polishing surface; and a static polishing process of polishing the substrate with the oscillation of the polishing head stopped, the static polishing process is performed after the oscillation polishing process, and the static polishing process comprises determining a static polishing end point which is a point in time at which a rate of change of torque for rotating the polishing table has reached a change-rate threshold value.

Abstract: A polishing pad conditioning apparatus includes a base, a fiber, and a polymer protruding from a surface of the base and encompassing the fiber.

Abstract: A double-stringer rotary brush assembly formed of a pair of brush wire mounting hubs having sets of alternating radially staggered radially innermost and outermost brush wire tuft mounting holes having different hole sizes with brush wire tufts extending radially outwardly therefrom having at least one of (a) different lengths, (b) an offset trim, and/or (c) differently sized knots anchoring the tufts thereto. One hub can be angularly offset relative to the other hub angularly offsetting the holes of one hub relative to the other hub from being concentric. The tufts extending from one of the radially innermost and outermost holes are stiffer than the tufts extending from the other one of the radially innermost and outermost holes imparting to the brush assembly tufts having different surface finishing and abrasive removal characteristics.

Abstract: A method of connecting a ferrule to an optical fiber polishing fixture assembly comprises obtaining a fixture base to which a clamping assembly is operatively connected, positioning a lever in an unlocked position thereby creating a gap between first and second base portions, obtaining a fiber optic connector and cable assembly including a ferrule operatively connected to a cable, positioning the ferrule in a ferrule bore, and moving the lever from the unlocked position to a locked position thereby causing the first and second base portions to engage the fiber optic connector and cable assembly.

Abstract: A polishing method capable of accurately measuring a film thickness of a substrate, such as a wafer, by enhancing light intensity of a flash-light source, such as a xenon flash lamp is disclosed. The polishing method includes: while an optical sensor head is moving across a substrate, causing a flash-light source to emit light plural times in a first exposure time of a light detector to direct the light to the substrate via the optical sensor head, capturing reflected light from the substrate by the light detector via the optical sensor head, further causing the flash-light source to emit light plural times in a second exposure time of the light detector to direct the light to the substrate via the optical sensor head, and capturing reflected light from the substrate by the light detector via the optical sensor head; generating a spectrum of the reflected light; and detecting a surface state of the substrate from the spectrum.

Abstract: A device for grinding hard metal-tipped teeth of saw bands having a feed device for feeding a temporary workpiece in a timed manner where the temporary workpiece is formed from a plurality of saw bands that are parallel to one another, also having a clamping device that clamps the plurality of saw bands against one another, further having a grinding unit for simultaneously grinding a plurality of teeth, where the grinding unit has a grinding wheel having a plurality of grinding profiles, and a corresponding method.

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus comprises a polishing table; a polishing pad disposed on an upper surface of the polishing table; a conditioner including a conditioner head, a disk holder movably coupled to the conditioner head in a vertical direction, and a conditioning disk mounted to the disk holder and in contact with the polishing pad; and a thickness measuring unit of obtaining the thickness of the polishing pad from the relative moving distance of the disk holder with respect to the conditioner head, wherein the information of the relative moving distance is received from sensing unit.

Abstract: A polishing pad has a disk-shaped substrate and a polishing layer of which an upper surface side is adhered to the substrate. The polishing layer includes a plurality of through-holes which penetrate the polishing pad vertically and which are supplied with a polishing liquid, and a plurality of grooves which are formed on the lower surface side of the polishing pad and which are connected to the through-holes. The plurality of through-holes are formed such as to surround the center of the polishing layer, and the plurality of grooves are formed radially from the plurality of through-holes toward the outer periphery of the polishing layer.

Abstract: A CMP polishing apparatus for flattening a quadrate substrate is provided. A polishing apparatus for polishing a quadrate substrate is provided. The polishing apparatus includes a substrate holding portion configured to hold the quadrate substrate. The substrate holding portion includes a quadrate substrate supporting surface that supports the substrate, and an attachment mechanism that attaches a retainer member to be disposed at an outside of at least one corner portion of the substrate supporting surface.