Abstract: A housing comprises a first housing with a first through-hole, a second housing with a second through-hole, a decoration part with a third through-hole, and a first breathable film. The first housing is disposed outside the second housing, and the decoration part is disposed on the first housing and covers the first through-hole. An orthographic projection of the third through-hole on the second housing is located outside an orthographic projection of the second through-hole on the second housing. A first gap exists between the decoration part and the second housing and is communicated with both the second through-hole and the third through-hole. The first breathable film is disposed on the second housing and covers the second through-hole.

Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.

Abstract: A patterned article includes a unitary polymeric layer and a plurality of electrically conductive elements embedded at least partially in the unitary polymeric layer. Each electrically conductive element includes a conductive seed layer having a top major surface and an opposite bottom major surface in direct contact with the unitary polymeric layer, and includes a metallic body disposed on the top major surface of the conductive seed layer. The metallic body has a bottom major surface and at least one sidewall. The bottom major surface contacts the conductive seed layer. Each sidewall is in direct contact with the unitary polymeric layer and extends from the bottom major surface of the metallic body toward or to, but not past, a top major surface of the unitary polymeric layer. The conductive elements may be electrically isolated from one another. Processes for making the patterned article are described.

Abstract: According to one embodiment, a flexible substrate includes an insulating base including a first surface and a second surface on an opposite side to the first surface, a wiring layer provided on the second surface side of the insulating base and a resin layer including a support located on the first surface side of the insulating base and a coating layer located on the second surface side of the insulating base, the resin layer including a first area and a second area in planar view, the resin layer having a first elastic modulus in the first area and a second elastic modulus in the second area, and the first elastic modulus being greater than the second elastic modulus.

Abstract: This electrical equipment device includes a housing storing an electronic component in an internal space thereof, and includes a vent hole through which an outside and an inside of the housing communicate with each other. The vent hole is formed inside a wall of the housing. One end side of the vent hole has a first opening communicating with the outside of the housing on a gravity-direction lower side. Another end side of the vent hole has a second opening communicating with the inside of the housing on a gravity-direction upper side. At the second opening, a waterproof vent film is provided to close the second opening.

Abstract: A substrate that enables increasing an allowable current value of a current path in a thickness direction of the substrate and narrowing spaces between multiple current paths, and the like are provided. To solve this subject, a substrate includes a sheet-shaped first base material (1) having a penetrating hole (1B) in the thickness direction and includes a second base material (2) fitted into the penetrating hole (1B). The second base material (2) includes multiple metal bodies (2B). The metal bodies (2B) penetrate in the thickness direction of the first base material (1) in a state of having an end exposed at each of a first surface and a second surface of the second base material (2) that face each other in the thickness direction.

Abstract: Disclosed power systems include an enclosure comprising a panel formed from a single sheet of metal. The panel comprises a first formed portion facing a first direction, a second formed portion facing a second direction opposite the first direction, and a center surface. The power system further includes an engine within the enclosure and a generator within the enclosure and configured to convert mechanical power from the engine to electrical power.

Abstract: A circuit board and an electronic device are provided. The circuit board includes a circuit board body (10) and a shielding film layer (11), and further includes a dielectric layer (12), where the dielectric layer (12) is arranged between the circuit board body (10) and the shielding film layer (11).

Abstract: A multilayer circuit board with an LC resonant circuit that has an electronic component package including the multilayer circuit board with the LC resonant circuit are provided. The multilayer circuit board with the LC resonant circuit configured by alternately laminating conductive layers and insulating resin layers on both sides of a core substrate includes a first set of wiring lines, a set of vias, and a second set of wiring lines. The first set of wiring lines configures both ends of the LC resonant circuit and is formed in a first one of the conductive layers. The set of vias extends through the insulating resin layers. The second set of wiring lines is connected to an input/output terminal of the LC resonant circuit and is formed in a second one of the conductive layers. The first set of wiring lines is connected to the second set of wiring lines.

Abstract: A printed circuit board includes: a first insulating layer; a first metal layer disposed on one surface of the first insulating layer; a second metal layer disposed on the other surface facing the one surface of the first insulating layer; a via penetrating through the first insulating layer to connect the first and second metal layers to each other; and a heterogeneous metal region disposed in at least one of an area in which the via is adjacent to the first insulating layer and an area in which the via is adjacent to the first metal layer, and including a material different from that of the via, wherein the heterogeneous metal region includes at least one of nickel (Ni), silicon (Si), and titanium (Ti).

Abstract: A wiring board includes a core layer having a first through hole formed therein, a magnetic resin filled inside the first through hole, a second through hole formed in the magnetic resin, and a plating film covering an inner wall surface of the second through hole. The plating film includes an electroless plating film, and an electrolytic plating film. The electroless plating film makes direct contact with an inner wall surface of the second through hole.

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; and a cavity formed in the first and second insulating layers; wherein the cavity includes a first portion formed in the second insulating layer; and a second portion formed in the first insulating layer; wherein the first portion has a first cross-sectional shape, and wherein the second part has a second cross-sectional shape different from the first cross-sectional shape.

Abstract: WELDED BOARD AND ELECTRICAL CABINET STRUCTURE presents a cabinet built with welded frames that use vertical and horizontal profiles, having an internal fastening wall with holes and cutouts to the fitting of a cage nut and an internal fastening tab, a side sealing surface, a front sealing surface and the isolation barrier, the structure being assembled with at least two welded frames, which are assembled in parallel and joined through four depth profiles, said depth profiles being joined directly to the welded frames vertices.

Abstract: The present disclosure discloses a substation frame comprising: a supporting assembly comprising at least two supporting posts arranged at intervals, the at least two supporting posts comprising one side supporting post at each end; a beam assembly comprising a beam provided between every two adjacent supporting posts; and a side wire attaching assembly provided on at least one side supporting post and positioned on a side of the side supporting post facing away from the beam.

Abstract: A flex circuit board can be used in transmitting signals in a quantum computing system. The flex circuit board can include at least one dielectric layer and at least one superconducting layer disposed on a surface of the at least one dielectric layer. The at least one superconducting layer can include a superconducting material. The superconducting material can be superconducting at a temperature less than about 3 kelvin. The flex circuit board can have at least one metal structure electroplated onto the at least one superconducting layer.

Abstract: A module for producing a housing, in particular a housing of the ‘flameproof enclosure’ protection type, is provided, wherein the housing surrounds an interior space suitable for accommodating components that can form ignition sources. The module establishes at least one module interior space, which is fluidically connected to the interior space of the housing via a connection opening. The module can be used to produce vented housings having different interior volumes.

Abstract: An electronic device includes a first component carrier having a first stack with at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure, a second component carrier having a second stack with at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and an intermediate structure including at least three staggered electrically conductive and coupled vertical interconnect elements in an at least partially dielectric sheet and being directly connected between the first component carrier and the second component carrier for electrically coupling the first component carrier with the second component carrier.

Abstract: A patterned conductive article 200 includes a substrate 210 including a unitary layer 210-1 and includes a micropattern of conductive traces 220 embedded at least partially in the unitary layer. Each conductive trace extends along a longitudinal direction (y-direction) of the conductive trace and includes a conductive seed layer 230 having a top major surface 232 and an opposite bottom major surface 234 in direct contact with the unitary layer; and a unitary conductive body 240 disposed on the top major surface of the conductive seed layer. The unitary conductive body and the conductive seed layer differ in at least one of composition or crystal morphology. The unitary conductive body has lateral sidewalls 242, 244 and at least a majority of a total area of the lateral sidewalls is in direct contact with the unitary layer.

Abstract: A wiring member includes: a plurality of wire-like transmission members; a sheet to which the plurality of wire-like transmission members are fixed to be arranged side by side; and a level difference absorption member provided on an outer side of the sheet, wherein the sheet includes a first sheet covering the plurality of wire-like transmission members from one side and a second sheet covering the plurality of wire-like transmission members from another side, the level difference absorption member is provided on an outer side of the second sheet, and the level difference absorption member is provided to be able to absorb a level difference caused by a level difference formed on an outer surface of the second sheet when an outer surface side of the level difference absorption member is vacuum-sucked.

Abstract: A three-dimensional (3D) printed circuit board (PCB) composite structure includes a PCB and a 3D printed composite structure. The printed circuit board includes a plurality of grooves milled in a surface of the PCB, and retaining walls of the 3D printed composite structure are deposited within the plurality of grooves in the surface of the PCB, to improve adhesion of the 3D printed composite structure to the PCB.