Patents Examined by John B Freal
-
Patent number: 11452201Abstract: To provide an electronic device and a connecting component which have a shield function and which enable downsizing. The electronic device includes: a substrate having a first substrate portion and a second substrate portion that is arranged at a position facing the first substrate portion; a plurality of potential wirings which are connected to the first substrate portion and to the second substrate portion and which have an arbitrary potential; and a plurality of signal wirings which are connected to the first substrate portion and to the second substrate portion and to which a signal is supplied. The first substrate portion has a mounting region of an electronic component on a side of a surface facing the second substrate portion. The plurality of potential wirings are arranged outside of the mounting region.Type: GrantFiled: September 5, 2019Date of Patent: September 20, 2022Assignee: SONY CORPORATIONInventors: Keiichi Hirano, Akihiro Horii, Yoshiyuki Nomura, Keiji Niina, Kosuke Sakazume
-
Patent number: 11430250Abstract: According to one embodiment, a sensor includes a panel. The panel includes a cell having a detection surface and a non-detection surface, and a support substrate formed of resin and bonded to the non-detection surface of the cell. The cell includes an insulating substrate formed of resin and having a first surface and a second surface, a first protective layer facing the second surface of the insulating substrate, and a sensor electrode disposed between the insulating substrate and the first protective layer. A thickness of the support substrate is greater than a thickness of the insulating substrate, and is greater than a thickness of the first protective layer.Type: GrantFiled: December 1, 2020Date of Patent: August 30, 2022Assignee: Japan Display Inc.Inventor: Kenshi Tada
-
Patent number: 11425815Abstract: A load adaptive device includes a substrate, a first electrode, a second electrode, and a passive element. The substrate is configured with a first conductor and a second conductor, and the surface area of the first conductor and/or the surface area of the second conductor are at least 15 mm2. The distance between the center of the first conductor and the center of the second conductor is at least 9 mm. The first electrode, the second electrode and the passive element are disposed on the substrate. The first electrode is electrically connected to the first conductor. Two terminals of the passive element are electrically connected to the second conductor and the second electrode, respectively. In addition, a hand-made circuit module includes the load adaptive device and a hand-made loop. A part of the hand-made loop is consisted of a hand-bonded conductive tape.Type: GrantFiled: February 5, 2021Date of Patent: August 23, 2022Assignee: AIDMICS BIOTECHNOLOGY (HK) CO., LIMITEDInventor: Chang-Ching Yeh
-
Patent number: 11425818Abstract: The disclosure provides an electronic device, including a base, a flexible substrate, and a plurality of wires. The base has an active area and a peripheral area. The flexible substrate is disposed on the peripheral area and the base. The plurality of wires are disposed on the base and the flexible substrate. The plurality of wires extend from the active area to the peripheral area, and the peripheral area partially overlaps the frame portion. The plurality of wires extend along the frame portion to the extension portion. And the flexible substrate is provided between the plurality of wires and the base. The electronic device in the disclosure is conducive to providing smaller wire pitch, reducing the difficulty in connecting the electronic device and the leads of an external circuit board.Type: GrantFiled: February 5, 2021Date of Patent: August 23, 2022Assignee: Innolux CorporationInventors: Chialung Wu, Wen-Chieh Lin, Chia Chun Yang
-
Patent number: 11425814Abstract: A hinge assembly configured for attachment to two objects is described herein. The hinge assembly includes: a flexible circuit board having planar conductive circuitry and including at least one preformed undulation in a region of the flexible circuit board, wherein the at least one undulation is configured to allow the flexible circuit board to bend at the region; and a plurality of plated-through holes defined by the flexible circuit board, wherein the holes are configured to allow attachment of the flexible circuit board to the two objects, wherein the flexible circuit board is configured to movably and electrically connect the two objects.Type: GrantFiled: February 2, 2021Date of Patent: August 23, 2022Assignee: Rosemount Aerospace Inc.Inventors: Kirantu Madhava, Nouduri Phani Srinivas, Ramesh Achutha Rao
-
Patent number: 11412612Abstract: Methods and structures are provided for implementing embedded wire repair for printed circuit board (PCB) constructs. A repair wire layer is provided within the PCB stack with reference planes on opposite sides of the repair wire layer. When a repair connection is required, an appropriate plated through hole (PTH) is drilled to form the repair connection using the repair wire layer.Type: GrantFiled: July 11, 2019Date of Patent: August 9, 2022Assignee: International Business Machines CorporationInventors: Samuel Connor, Stuart B. Benefield, Matthew S. Doyle, Joseph Kuczynski, Jonathan Jackson
-
Patent number: 11406014Abstract: In an electrical connection device in which a adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.Type: GrantFiled: January 26, 2021Date of Patent: August 2, 2022Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Junya Sato, Ryosuke Mitsui, Yoshiaki Yamabayashi, Atsushi Tanaka
-
Patent number: 11395918Abstract: Devices and methods for remotely monitoring and treating wounds or wound infections are disclosed. A device can include a multi-layered, flexible substrate having a dressing layer positioned on a wound side of the substrate, and a flexible printed circuit board layer positioned on an electronics side of the substrate that is opposite the wound side of the dressing layer. A plurality of electrodes can be electrically coupled to the flexible printed circuit board. A plurality of temperature sensors can be electrically coupled to the flexible printed circuit board. Systems including the described devices are also disclosed.Type: GrantFiled: August 23, 2019Date of Patent: July 26, 2022Assignees: United States Government as Represented by the Department of Veterans Affairs, Case Western Reserve UniversityInventors: Kath M. Bogie, Christian A. Zorman
-
Patent number: 11399431Abstract: Provided is a land for a surface mounted component that includes a plurality of land regions respectively having different width. Land regions included in the plurality of land regions are combined with one another with centers in a width direction aligned in order conforming to the widths and are jointed into one land. A cutout shape is provided in a center in the width direction on a side opposed to an adjacent or overlapping side of a land region having a larger width of adjacent or partially overlapping two land regions in the plurality of land regions joined into the one land.Type: GrantFiled: August 16, 2019Date of Patent: July 26, 2022Assignee: SONY CORPORATIONInventor: Norikimi Moriuchi
-
Patent number: 11382210Abstract: A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.Type: GrantFiled: December 17, 2020Date of Patent: July 5, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John R. Dangler, Arthur J Higby, Philipp K Buchling Rego, David Clifford Long, James Busby, Matthew Doyle, Edward N. Cohen, Michael Fisher, William Santiago-Fernandez
-
Patent number: 11380463Abstract: A superconducting coil according to the present disclosure includes: a substrate having a first surface and a second surface; a superconducting layer having a third surface and a fourth surface; respective stabilization layers; and respective protective layers. The second surface is opposite to the first surface. The fourth surface is opposite to the third surface. The superconducting layer is disposed on the substrate such that the third surface faces the second surface. The respective stabilization layers are disposed on the first surface and the fourth surface. The respective protective layers are disposed on the stabilization layers. Adhesion strength between each of the stabilization layers and each of the protective layers is lower than strength of the superconducting layer.Type: GrantFiled: February 14, 2017Date of Patent: July 5, 2022Assignee: Sumitomo Electric Industries, Ltd.Inventors: Takashi Yamaguchi, Tatsuoki Nagaishi, Masaya Konishi
-
Patent number: 11374387Abstract: The invention provides the system supporting variable speed drive comprising a three-sided service cabinet embodiment. The cabinet comprising two heat exchange circuits limited by the basic elements of the cabinet embodiment, the first of which is configured to interact with an external environment and with the second heat exchange circuit, wherein the second heat exchange circuit which is configured without an ability to interact with the external environment includes a sealed cell for installing power electronics and the cell for installing a power connection and the cell for installing a measurement equipment. The cabinet comprising a dust and moisture filter, a plate heat exchanger, and a moisture removal device. The cabinet may be assembled with joined end-to-end metal sheets with curved joined ends which form strengthening ribs.Type: GrantFiled: June 13, 2019Date of Patent: June 28, 2022Inventor: Dmytro Khachaturov
-
Patent number: 11322279Abstract: The present invention relates to a cable jacket comprising a random heterophasic propylene copolymer, wherein said copolymer comprises a matrix (M) being a random propylene copolymer (R-PP) and dispersed therein an elastomeric propylene copolymer (E), wherein the random propylene copolymer (R-PP) has a melt flow rate MFR2 (230° C./2.16 kg) of 0.1 to 10.0 g/10 min and wherein the elastomeric propylene copolymer (E) has a comonomer content in the range of 40.0 to 55.0 mol %, and wherein said copolymer has MFR2 (230° C.) in the range of from 0.5 to 15 g/10 min, flexural modulus below 400 MPa, and relaxation spectrum index (RSI) at 200° C. below 20.0. The present invention further relates to a telecommunication cable comprising said jacket.Type: GrantFiled: December 28, 2018Date of Patent: May 3, 2022Assignee: Borealis AGInventors: Åsa Wannerskog, Ola Fagrell
-
Patent number: 11315703Abstract: A weld nugget portion that is obtained by welding a central conductor of a wire and a receiving portion of a metal terminal is formed on the receiving portion that receives an end portion of the wire with the weld nugget portion expanding from a surface of the receiving portion along which the wire is disposed. An area ratio of a blowhole to a section of the weld nugget portion that is along an imaginary cut plane that is perpendicular to the surface of the receiving portion along which the wire is disposed is no less than 0% and no more than 8.4% (i.e., from 0% to 8.4%), preferably no less than 0% and no more than 1.3% (i.e., from 0% to 1.3%). A central axis of the central conductor of the wire in the weld nugget portion extends along the imaginary cut plane.Type: GrantFiled: September 15, 2020Date of Patent: April 26, 2022Assignee: Murata Manufacturing Co., Ltd.Inventors: Koji Onishi, Takashi Murakami, Akio Igarashi
-
Patent number: 11223190Abstract: An eddy current energy-dissipating spacer is mainly composed of a spacer frame, a conductor clamp and energy-dissipating elements. The eddy current energy-dissipating spacer not only provides the function of an ordinary spacer, but also reduces the vibration of the transmission lines; and at the same time, can effectively reduce the vibration of the transmission lines, especially the torsional vibration by adopting the eddy current and viscoelastic material for energy dissipation; improves the eddy current strength by adjusting the gear radius ratio, thus increasing the damping force; can adjust the damping parameters by adjusting the magnetic field strength of the permanent magnet; can produce long-term stable vibration reduction effect by adopting the permanent magnet to provide continuous magnetic field without additional external energy input; can effectively avoid the magnetic flux leakage of magnetic circuits by adopting the magnetic material.Type: GrantFiled: February 21, 2019Date of Patent: January 11, 2022Assignee: Dalian University of TechnologyInventors: Xing Fu, Hongnan Li, Wenlong Du