Abstract: A circuit board has a main board with a base material of insulating material, at least one metal base copper clad laminate, and each metal base copper clad laminate is provided with at least one component and a pin connected with the main board. The circuit board and the driving power supply with the circuit board have simple structure and low manufacturing cost, and are convenient for automatic manufacturing. The power device can be directly mounted on the metal substrate through the automation equipment, so that the metal substrate can realize the function of the heat sink, thereby improving the production efficiency and reducing the process quality hidden danger; at the same time, the grounding problem of the metal substrate is solved, and the EMC problem is avoided.

Abstract: A signal transmission circuit packaging structure is disclosed. The signal transmission circuit packaging structure includes a body, a main circuit unit, power pins, input pins, output pins, control pins and ground pins. The main circuit unit is arranged in the center of the body. The power pins are arranged in the center of the body. The input pins are arranged at a first side of the body and are electrically connected to the main circuit unit. The output pins are arranged at a side of the body opposite to the first side and are electrically connected to the main circuit unit. The control pins are arranged at a second side of the body and are electrically connected to the main circuit unit. The ground pins are arranged at corners of the body to separate the input pins, the output pins and the control pins.

Abstract: The purpose of the present disclosure is to provide electro-conductive particles and a signal-transmitting connector having same, wherein the electro-conductive particles are improved to prevent the phenomenon of irregular scrub between the electro-conductive particles and to have improved signal delivery characteristics. Electro-conductive particles according to the present disclosure are provided on a signal-transmitting connector having multiple electroconductive portions supported by an insulating portion made of an elastic insulating material to be spaced apart from each other such that the signal-transmitting connector can be connected to an electronic component and can transmit electric signals.

Abstract: According to one embodiment, a flexible substrate includes flexible insulating base material, conductive lines, a support body and a coating layer. The conductive lines are provided on the insulating base material. The support body supports the insulating base material. The coating layer covers the insulating base material and the support body. The conductive lines include scanning lines and signal lines. The scanning lines extend in a first direction and are arranged side by side in a second direction intersecting the first direction. The signal lines extend in the second direction and are arranged side by side in the first direction. The support body and the coating layer have a through hole in a region enclosed by two adjacent scanning lines and two adjacent signal lines.

Abstract: A substrate having an electronic component embedded therein includes first and second insulating layers including first and second cavities, respectively, first and second electronic components disposed within the first and second cavities, respectively, a first adhesive layer disposed between the first and second insulating layers, and a connection member penetrating through at least a portion of the first adhesive layer. One end and the other end of the connection member are connected to the first and second electronic components, respectively.

Abstract: An inhomogeneous dielectric medium high-speed signal trace system includes a first and second ground layer. A first dielectric layer is located adjacent the first ground layer. A second dielectric layer has a different dielectric constant and a greater thickness than the first dielectric layer, and is located between the first dielectric layer and the second ground layer. A first differential trace pair is located between the first dielectric layer and the second dielectric layer, and includes a trace spacing that is less than or equal to a thickness of the first dielectric layer. The first different trace pair transmit signals and, in response, produces a magnetic field, and the trace spacing prevents a magnetic field strength of the magnetic field from exceeding a magnetic field strength threshold at a second differential trace pair that is located adjacent the first differential trace pair.

Abstract: A flexible printed circuit board includes: a substrate; and a circuit pattern disposed on the substrate, wherein the substrate includes a chip mounting region, and the circuit pattern includes a wiring portion and a pad portion, wherein the circuit pattern includes: a first circuit pattern including a first-first pad portion disposed inside the chip mounting region, a first-second pad portion disposed outside the chip mounting region, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and extending in a first direction based on the chip mounting region; a second circuit pattern including a second-first pad portion disposed inside the chip mounting region, a second-second pad portion disposed outside the chip mounting region, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and extending in a second direction; and a third circuit pattern including a plurality of third pad portions disposed inside the ch

Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.

Abstract: A molded interconnect device that comprises a substrate and conductive elements disposed on the substrate is provided. The substrate comprising a polymer composition containing a polymer matrix that includes a thermotropic liquid crystalline polymer and from about 10 parts to about 80 parts by weight of a mineral filler per 100 parts by weight of the polymer matrix. The mineral filler has an average diameter of about 25 micrometers or less. The polymer composition contains copper in an amount of about 1,000 parts per million or less and chromium in an amount of about 2,000 parts per million or less, and further exhibits a surface resistivity of about 1×1014 ohm or more.

Abstract: An electronic device is provided. The device comprises a singulated carrier portion, a substrate molded onto the singulated carrier portion, and conductive traces disposed on the substrate. The substrate comprises a polymer composition that includes an aromatic polymer and an electrically conductive filler, wherein the polymer composition exhibits a surface resistivity of from about 1×1012 ohms to about 1×1018 ohms as determined in accordance with ASTM D257-14.

Abstract: A substrate connection member according to various embodiments of the present invention can comprise a printed circuit board which has a plurality of layers that are stacked and which comprises a front surface, a rear surface, and a side surface encompassing the front surface and the rear surface. The printed circuit board can comprise: an opening part which encompasses a partial region of the printed circuit board and which is penetratingly formed from the front surface to the rear surface; at least one bridge connected between the partial region and the printed circuit board by crossing at least a portion of the opening part; and at least one through-hole wire formed in the partial region from the front surface to the rear surface, wherein the inner surface of the opening part and the side surface of the bridge can be formed from a conductive member. Other various embodiments, in addition to the embodiments disclosed in the present invention, are possible.

Abstract: A wiring substrate includes: a base material; a first through-hole and a second through-hole that are formed in the base material; magnetic material that is filled in the first through-hole; a third through-hole that is formed in the magnetic material; a first plating film that covers an inner wall surface of the third through-hole; and a second plating film that covers an inner wall surface of the second through-hole and the first plating film. The first plating film includes a first electroless plating film that is in contact with the inner wall surface of the third through-hole, and a first electrolytic plating film that is laminated on the first electroless plating film.

Abstract: A FPCB/FCCL replacing a tinned-copper welding strip as a photovoltaic module bus bar is a composite material including an insulating base material and a conductive layer, and the insulating base material is made from PI or PET, and the conductive layer is generally the copper foil. According to the present invention, when the flexible solar module adopts the FPCB/FCCL to replace the tinned-copper welding strip as the photovoltaic module bus bar, the product quality and product stability are greatly improved, and the FPCB/FCCL bus bar is also suitable for the double-glass solar module and the single-glass solar module. The copper foil of FPCB/FCCL may be integrated with circuits, or be the complete copper foil (without circuits), or the copper foil of FPCB/FCCL may simultaneously has the part with circuits and the part without circuits.

Abstract: A junction assembly is disclosed herein. The junction assembly includes a junction housing configured to support a phase bar assembly. A heatsink contacts at least a portion of the junction housing and a busbar is arranged adjacent to the junction housing. At least one fastener attaches the junction housing, the heatsink, and the busbar to each other. At least one heatsink seal is provided at an interface defined between the heatsink and the junction housing.

Abstract: A device includes a head having a material having a plurality of pores, wherein at least some of the pores from the plurality of pores each have a size that is smaller than a water molecule and larger than an air molecule such that the air molecules can pass through the pores and the water molecules are prevented from passing through the pores; and an elongated body extending from the head and having a thread on an outer surface thereof and having a conduit extending longitudinally through the elongated body to the head. The device is configured to fasten a first surface to a second surface using the thread of the elongated body.

Abstract: A resin substrate includes an insulating base material including opposing first and second main surfaces, at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction. The insulating base material is divided into first and second sections arranged in the X-axis direction. The first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region. A degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction.

Abstract: A duct-bank stub-up assembly includes a first pre-formed stub-up module that comprises a first plurality of conduits and a first encasing body. For each of the first conduits, a first end of the conduit provides a mating end on a mating side of the first encasing body and a second end of the conduit provides a mating end on a top surface of the first encasing body. The assembly further includes a second pre-formed stub-up module that comprises a second plurality of conduits and a second encasing body formed to have a stub-up section and a footer section. For each of the second conduits, a first conduit end provides a mating end on a mating side of the footer section and a second conduit end provides a mating end on a top surface of the stub-up section. The first module is positioned on the footer of the second module.

Abstract: A wiring board includes an insulating layer; an insulating oxide film that is formed by forming a film of metal oxide or semimetal oxide on a surface of the insulating layer; a seed layer that is made of metal and that is stacked on the insulating oxide film; and an electrode that is made of metal and that is formed on the seed layer, wherein the insulating oxide film and the seed layer are removed from an area not overlapping the electrode to expose the insulating layer.

Abstract: The present disclosure relates to a charging cable having a protective sleeve which extends to an extended position to protect the charging end of the cable. The protective sleeve may be retracted to a retracted position to reveal the charging end and allow the cable to be plugged into an electronic device. Various embodiments are disclosed in which the protective sleeve may be spring loaded by a single spring, by a plurality of springs, or it may be manually operated.

Abstract: A circuit board includes a first metal layer; a second metal layer that is arranged on the first metal layer; and a sealing resin with which a space between the first metal layer and the second metal layer is filled, wherein the second metal layer includes an electrode that protrudes from an upper surface of the sealing resin and that has an end face on which an electronic part is mountable; and an interlayer connector whose upper surface is exposed in a position lower than the end face of the electrode from the upper surface of the sealing resin and that makes contact with the first metal layer.