Abstract: A CMOS type semiconductor image sensor module wherein a pixel aperture ratio is improved, chip use efficiency is improved and furthermore, simultaneous shutter operation by all the pixels is made possible, and a method for manufacturing such semiconductor image sensor module are provided. The semiconductor image sensor module is provided by stacking a first semiconductor chip, which has an image sensor wherein a plurality of pixels composed of a photoelectric conversion element and a transistor are arranged, and a second semiconductor chip, which has an A/D converter array. Preferably, the semiconductor image sensor module is provided by stacking a third semiconductor chip having a memory element array. Furthermore, the semiconductor image sensor module is provided by stacking the first semiconductor chip having the image sensor and a fourth semiconductor chip having an analog nonvolatile memory array.

Abstract: A circuit includes a pixel structure having a photo sensitive element and a read transistor. The read transistor includes a first load path terminal coupled to the photo sensitive element, and a second load path terminal coupled to a voltage bus. The circuit also includes a first transistor having a third load path terminal coupled to a power supply node, and a fourth load path terminal configured to be coupled to a current source. The circuit further includes a first control switch coupled between the voltage bus and the fourth load path terminal of the first transistor.

Abstract: A HDR CTIA pixel which provides automatic gain selection, and spatial and temporal coherence. The pixel comprises an input node for connection to a photocurrent, and an output node. The pixel includes a CTIA which comprises a “high gain” integration capacitor and a first reset switch connected between the input and output nodes, a “low gain” integration capacitor connected between the input node and a first node, a second reset switch connected between the first node and the output node, and a first FET connected across the second reset switch. In operation, the first FET is off during the reset phase, and is conditionally turned on during or after the integration phase. The CTIA also includes an amplifier having an inverting input connected to the input node and an output connected to the output node. The pixel can be operated in “static low-gain control” and “dynamic low-gain control” modes.

Abstract: In one example embodiment, an optoelectronic assembly includes an electronic substrate, a transparent component coupled on a first side of the electronic substrate, and a first component coupled to a second side of the electronic substrate opposite the first side. The electronic substrate, the transparent component, and the first component may define a hermetically sealed enclosure. A laser array or a receiver array may be mechanically coupled to the transparent component inside of the enclosure and oriented to transmit or receive optical signals through the transparent component. The laser array or the receiver array may be electrically coupled to the electronic substrate. A second component may be positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second component and the transparent component.

Abstract: Disclosed are an electronic device and a method of controlling the same. An electronic device includes: a camera; a sensor module; and a processor, wherein the processor is configured to determine at least one of a movement of the electronic device and a movement of an object in images acquired by the camera, determine, based on the movement of the electronic device or the movement of the object, an output period for light outputted by the sensor module, and determine depth information of the images based on reflected light corresponding to the outputted light received by the camera.

Abstract: An imaging device may have an array of image sensor pixels each having a photodiode and a floating diffusion node. Each image sensor pixel in the array may also include a dual conversion gain switch and a dual conversion gain capacitor that allows the image sensor pixel to operate in a low conversion gain mode during which the switch is turned on to share charge between the floating diffusion node and the dual conversion gain capacitor, and a high conversion gain mode in which the switch is turned off. During integration, the photodiode may generate more charge than can be held at the floating diffusion node. A buried channel may be provided beneath the dual conversion gain switch to provide a path along which the excess charge can be shared between the floating diffusion node and the dual conversion gain capacitor even when the dual conversion gain switch is off.

Abstract: A method and system for optoelectronic receivers utilizing waveguide heterojunction phototransistors (HPTs) integrated in a wafer are disclosed and may include receiving optical signals via optical fibers operably coupled to a top surface of the chip. Electrical signals may be generated utilizing HPTs that detect the optical signals. The electrical signals may be amplified via voltage amplifiers, or transimpedance amplifiers, the outputs of which may be utilized to bias the HPTs by a feedback network. The optical signals may be coupled into opposite ends of the HPTs. A collector of the HPTs may comprise a silicon layer and a germanium layer, a base may comprise a silicon germanium alloy with germanium composition ranging from 70% to 100%, and an emitter including crystalline or poly Si or SiGe. The optical signals may be demodulated by communicating a mixer signal to a base terminal of the HPTs.

Abstract: A device for detecting light includes a photoreceptor array that is sensitive to the visible light spectrum and has a first wavelength sensor, a second wavelength sensor, and a third wavelength sensor. The first wavelength sensor has a first peak sensitivity at a first wavelength. The second wavelength sensor has a second peak sensitivity at a second wavelength. The third wavelength sensor has a third peak sensitivity at a third wavelength. The first wavelength sensor has a first base sensitivity at least 30% of the first peak sensitivity at the second wavelength and third wavelength. The second wavelength sensor has a second base sensitivity at least 30% of the second peak sensitivity at the first wavelength and third wavelength. The third wavelength sensor has a third base sensitivity at least 30% of the third peak sensitivity at the first wavelength and second wavelength.

Abstract: A time-resolving sensor includes a single-photon avalanche diode (SPAD), a logic circuit and differential time-to-charge converter (DTCC) circuit. The SPAD is responsive to a shutter signal to generate an output signal based on detecting an incident photon. The logic circuit generates first and second enable signals. The DTCC includes a capacitor device, first and second switching devices, and an output circuit. The first switching device is responsive to the first enable signal to transfer a charge on the capacitor device to the first floating diffusion. The second switching device is responsive to the second enable signal to transfer a remaining charge on the capacitor device to the second floating diffusion. The output circuit outputs a first voltage that is based on the first charge on the first floating diffusion and a second voltage that is based on the second charge on the second floating diffusion.

Abstract: Various examples are provided for tunable radio frequency (RF) filtering. In one example, a RF multiband filter includes a Lyot filter including a tunable birefringence loop including a circulator and a polarization controller (PC) and a phase modulator (PM). The Lyot filter can generate an optical comb based at least in part upon a received optical signal and a polarization rotation angle of the polarization controller. The phase modulator (PM) can generate a modulated tap signal by modulating the optical comb by a RF input signal.

Abstract: A position sensor employing silicon photodiodes formed from trapezoidal chips mounted on a printed circuit board detects angular positions of a rotor shaft within a galvanometer-based optical scanner.

Abstract: Various examples are provided for highly reconfigurable multiband radio frequency (RF) filters. The multiband RF filters can be continuously tunable. In one example, a multiband RF filter includes a Lyot loop filter that can generate an optical comb using an input optical signal from a tunable Mach-Zehnder interferometer (MZI), a birefringent device, and a polarization rotation angle of a polarization controller. The tunable MZI can include a tunable delay line that can adjust comb spacing of the optical comb. In another example, a multiband RF filter includes a second MZI in series with a first MZI. The second MZI can generate a second tunable output signal from a first tunable output signal from the first MZI. In another example, the multiband RF filter can include a third MZI in series with the second MZI. The third MZI can generate a third tunable output signal from the second tunable output signal.

Abstract: A light-receiving optical system includes a rotating mirror configured to rotate around a rotation axis and having a reflection plane arranged at an angle with the rotation axis; an imaging optical system having an optical axis that coincides with the rotation axis; a multifocal Fresnel lens having sections formed concentrically around the optical axis; and light-receiving elements, wherein the imaging optical system is configured such that rays of light that enter the rotating mirror are converged onto one of the sections depending on an angle of the rays with the optical axis, and the multifocal Fresnel lens is configured such that the rays reach one of the light-receiving elements, which corresponds to the one of the sections so that a light-receiving element that the rays reach is determined depending on the angle of the rays with the optical axis independently of a rotational position of the rotating mirror.

Abstract: An action recognition system is illustrated. The action recognition system has an annular body, at least one light emitting unit, at least one light sensing unit and an action recognition module. The annular body is worn on a movable part of a user. One end of the light emitting unit is exposed on an inner side of the annular body, wherein the light emitting unit emits a first light beam illuminating at least a portion of the movable part. One end of the light sensing unit is exposed on the inner side of the annular body. The light sensing unit operatively senses a second light beam reflected by the at least portion of the movable part and generates a light sensing signal. The action recognition module is configured to operatively determine an action of the user according to the light sensing signal.

Abstract: An image sensor module includes a circuit board, an image sensor, and a turning prism. The circuit board has first and second side sections each extending in a respective plane transverse to a plane of a center section to define a module interior volume. The image sensor has a bottom plane mounted on an inner face of the circuit board within the module interior volume. The turning prism has a mounting surface secured to a top plane of the image sensor. An electronic component arrangement is operatively mounted on the inner face of the circuit board between the image sensor and a circuit board rearward end. A number of wires providing power and data connections to the circuit board are operatively connected to contacts located on the circuit board in the interior volume between the electronic component arrangement and the circuit board rearward end.

Abstract: An optical transceiver module is disclosed having a housing that includes at least a first housing portion and a second housing portion, each of the first and second housing portions including a base portion having at least one sidewall extending therefrom that defines a compartment. The first housing portion is configured to couple to the second housing portion to form a cavity therebetween. A transmitter optical subassembly (TOSA) arrangement coupled to the base portion of the first housing portion and is electrically coupled to a first flexible printed circuit (FPC). A receiver optical subassembly (ROSA) arrangement is coupled to the base portion of the second housing portion and is electrically coupled to a second FPC. A first shield coupled to at least one of the first housing portion or the second housing portion to reduce electromagnetic interference between the TOSA arrangement and the ROSA arrangement.

Abstract: The present invention provides a package structure of an optical apparatus which includes a substrate, a light emitting device, a light sensing device, and a light barrier member. The light emitting device is disposed on the substrate and electrically connected to the substrate. The light emitting device is for emitting light. The light sensing device is disposed on the substrate and is a chip scale package (CSP) device. The light sensing device is for receiving light reflected by an object. The light barrier member is disposed around a periphery of the light sensing device.

Abstract: For providing a reliable determination of the position of an object (1) regarding a relative movement between the object (1) and a path (2) an apparatus is provided comprising: a detector (3) attached to or integrated in the object (1), at least one marker (4) being located along the path (2), wherein the at least one marker (4) is detected by the detector (3) within its spatial detection range (5) for determining the position of the object (1) relative to the marker (4), characterized by generating means for providing a definable signal or signal sequence or graphic representation (7, 8) or graphic representation sequence, wherein said signal or signal sequence or graphic representation (7, 8) or graphic representation sequence is detected by the detector (3) within its spatial detection range (5), and by evaluating means (6) for verifying a coincidence or relationship of the provided signal or signal sequence or graphic representation (7, 8) or graphic representation sequence with corresponding data detecte

Abstract: The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. The light source is disposed adjacent to a surface of the carrier. The light detector is disposed adjacent to the surface of the carrier. The molding compound encapsulates the light source and the light detector, and includes at least one guiding structure. The lid is disposed between the light source and the light detector, and surrounds the light source and the light detector.

Abstract: A sensing module includes a high speed, linear image sensor and an optical unit facing the sensor. The unit includes an optical element having a curved surface and a covering on an outward surface of the optical element. The covering has a slit formed therein. The optical unit images a wide field of view onto a single pixel of the linear sensor, wherein light impinging normal to the slit, at any location along the slit, is imaged on a central pixel of the linear sensor while light impinging at a non-normal angle to the slit, at any location along the slit, is imaged on a non-central pixel of the linear sensor.