Patents Examined by John S. Chu
  • Patent number: 11994799
    Abstract: A negative resist composition is provided comprising a base polymer and an acid generator in the form of a sulfonium salt consisting of a sulfonate anion having a maleimide group and a cation having a polymerizable double bond. The resist composition adapted for organic solvent development exhibits a high resolution and improved LWR or CDU.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: May 28, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Jun Hatakeyama
  • Patent number: 11977333
    Abstract: A single layer process is utilized to reduce swing effect interference and reflection during imaging of a photoresist. An anti-reflective additive is added to a photoresist, wherein the anti-reflective additive has a dye portion and a reactive portion. Upon dispensing the reactive portion will react with underlying structures to form an anti-reflective coating between the underlying structure and a remainder of the photoresist. During imaging, the anti-reflective coating will either absorb the energy, preventing it from being reflected, or else modify the optical path of reflection, thereby helping to reduce interference caused by the reflected energy.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hung-Jui Kuo, Hsing-Chieh Lee, Ming-Tan Lee
  • Patent number: 11977329
    Abstract: A photosensitive composition including a quantum dot dispersion, a reactive compound having at least two thiol groups, a photopolymerizable monomer having a carbon-carbon double bond, and a photoinitiator, wherein the quantum dot dispersion includes a carboxylic acid group-containing polymer and a quantum dot dispersed in the carboxylic acid group containing polymer, and wherein the carboxylic acid group-containing polymer includes a copolymer of a monomer combination including a first monomer having a carboxylic acid group and a carbon-carbon double bond and a second monomer having a carbon-carbon double bond and a hydrophobic moiety and not having a carboxylic acid group.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: May 7, 2024
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO, LTD.
    Inventors: Shang Hyeun Park, Hojeong Paek, Eun Joo Jang, Shin Ae Jun
  • Patent number: 11976170
    Abstract: The present invention provides a polybenzoxazole precursor, which comprises a structure of formula (I): wherein the definitions of Y, Z, R1, i, j, and V are provided herein. By means of the polybenzoxazole precursor, the resin composition of the present invention is able to form a film with high frequency characteristics and high contrast.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: May 7, 2024
    Assignee: MICROCOSM TECHNOLOGY CO., LTD.
    Inventors: Steve Lien-chung Hsu, Yu-Ching Lin, Yu-Chiao Shih, Hou-Chieh Cheng
  • Patent number: 11971660
    Abstract: A cross-linked polymer including a structure wherein at least a portion of phenolic hydroxyl groups in the polymer is protected by a group represented by the following formula (1): wherein R1 represents an alkyl group having 1 to 5 carbons and n represents an integer from 1 to 5; and * represents a bond part of the phenolic hydroxyl group to a residue other than a hydrogen atom, and a structure wherein at least a portion of phenolic hydroxyl groups in the polymer is protected by a group represented by the following formula (2): wherein R2 represents a divalent saturated hydrocarbon group having 2 to 17 carbons, containing an aromatic ring; and * represents a bond part of the phenolic hydroxyl group to a residue other than a hydrogen atom, and the polymers are cross-linked to each other.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: April 30, 2024
    Assignee: Maruzen Petrochemical Co., Ltd.
    Inventors: Tomohiro Masukawa, Masataka Nojima
  • Patent number: 11966162
    Abstract: A photoresist composition includes a photoactive compound and a polymer. The polymer has a polymer backbone including one or more groups selected from: The polymer backbone includes at least one group selected from B, C-1, or C-2, wherein ALG is an acid labile group, and X is a linking group.
    Type: Grant
    Filed: May 22, 2023
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tzu-Yang Lin, Ching-Yu Chang, Chin-Hsiang Lin
  • Patent number: 11966164
    Abstract: A method produces a semiconductor device, the method having a step of transferring an underlayer by employing a resist underlayer film-forming composition containing a hydrolysis condensate prepared through hydrolysis and condensation of a hydrolyzable silane in a non-alcoholic solvent in the presence of a strong acid, followed by a step (G) of removing the patterned resist film, the patterned resist underlayer film, and/or particles with a sulfuric acid-hydrogen peroxide mixture (SPM) prepared by mixing of aqueous hydrogen peroxide with sulfuric acid and/or an ammonia-hydrogen peroxide mixture (SC1) prepared by mixing of aqueous hydrogen peroxide with aqueous ammonia, wherein: the hydrolyzable silane contains a hydrolyzable silane of the following Formula (1): R1aR2bSi(R3)4?(a+b)??Formula (1) (wherein R1 is an organic group having a primary amino group, a secondary amino group, or a tertiary amino group and is bonded to a silicon atom via an Si—C bond).
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: April 23, 2024
    Assignee: NISSAN CHEMICAL CORPORATION
    Inventors: Wataru Shibayama, Hayato Hattori, Ken Ishibashi, Makoto Nakajima
  • Patent number: 11966160
    Abstract: A radiation-sensitive resin composition includes: an onium salt compound represented by formula (1?); a resin including a structural unit having an acid-dissociable group; and a solvent. EA is a substituted or unsubstituted (?+?)-valent organic group having 1 to 40 carbon atoms; Z+ is a monovalent radiation-sensitive onium cation; and ? and ? are each independently 1 or 2.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: April 23, 2024
    Assignee: JSR CORPORATION
    Inventor: Ryuichi Nemoto
  • Patent number: 11966161
    Abstract: A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A? represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 23, 2024
    Assignee: JSR CORPORATION
    Inventors: Takuhiro Taniguchi, Katsuaki Nishikori, Hayato Namai, Kazuya Kiriyama, Ken Maruyama
  • Patent number: 11960206
    Abstract: A photoresist composition, including an acid-sensitive polymer and photoacid generator compound having Formula (I): wherein, EWG, Y, R, and M+ are the same as described in the specification.
    Type: Grant
    Filed: December 6, 2022
    Date of Patent: April 16, 2024
    Assignee: ROHM AND HASS ELECTRONIC MATERIALS LLC
    Inventors: Emad Aqad, William Williams, III, James F. Cameron
  • Patent number: 11960207
    Abstract: Provided are a resist composition that can improve coatability (coating film formability) with respect to a substrate in spin coating and close adherence of a resist film and that can form a good pattern, and a resist film in which a good pattern is formed. The resist composition contains a polymer, a solvent, and an aromatic vinyl monomer, and has a content of the aromatic vinyl monomer relative to the polymer of not less than 10 mass ppm and not more than 30,000 mass ppm.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: April 16, 2024
    Assignee: ZEON CORPORATION
    Inventor: Manabu Hoshino
  • Patent number: 11947258
    Abstract: A monomer has the structure wherein R is an organic group comprising a polymerizable carbon-carbon double bond or carbon-carbon triple bond; X and Y are independently at each occurrence hydrogen or a non-hydrogen substituent; EWG1 and EWG2 are independently at each occurrence an electron-withdrawing group; p is 0, 1, 2, 3, or 4; n is 1, 2, 3, or 4; and M+ is an organic cation. A polymer prepared from monomer is useful as a component of a photoresist composition.
    Type: Grant
    Filed: February 24, 2023
    Date of Patent: April 2, 2024
    Assignee: ROHM AND HASS ELECTRONIC MATERIALS LLC
    Inventors: Emad Aqad, James W. Thackeray, James F. Cameron
  • Patent number: 11934099
    Abstract: A resist composition containing a resin component (A1) having a constitutional unit (a01) and a constitutional unit (a02) derived from compounds each represented by General Formulae (a01-1) and (a02-1), a compound (B1) represented by General Formula (b1), and a compound represented by General Formula (d1-1) or a compound represented by General Formula (d1-2), in the formulae, Ct represents a tertiary carbon atom, a carbon atom at an ?-position of Ct constitutes a carbon-carbon unsaturated bond, Wa02 represents an aromatic hydrocarbon group, and Rb1 represents hydrocarbon group, where a fluorine atom is not contained
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: March 19, 2024
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yoichi Hori, Yosuke Suzuki
  • Patent number: 11934101
    Abstract: A method of forming a photoresist pattern includes forming a photoresist layer including a photoresist composition over a substrate. The photoresist composition includes metal particles and a thermally stable ligand attached to the metal particles. The thermally stable ligand includes branched or unbranched, cyclic or non-cyclic, C1-C7 alkyl groups or C1-C7 fluoroalkyl groups. The C1-C7 alkyl or C1-C7 fluoroalkyl groups include one or more of —CF3, —SH, —OH, ?O, —S—, —P—, —PO2, —C(?O)SH, —C(?O)OH, —C(?O)O—, —O—, —N—, —C(?O)NH, —SO2OH, —SO2SH, —SOH, or —SO2—. The photoresist layer is selectively exposed to actinic radiation, and the photoresist layer is developed to form a pattern in the photoresist layer. In an embodiment, the method includes heating the photoresist layer before selectively exposing the photoresist layer to actinic radiation.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: An-Ren Zi, Ching-Yu Chang
  • Patent number: 11921424
    Abstract: There are provided a photosensitive resin composition which can be applied to either a projection exposure or direct-write exposure machine without fine adjustment of the composition, and can form a resist pattern having an excellent cross-sectional shape in which an undercut in which the bottom portion of the resist pattern is hollowed and omission of the top of the resist pattern are less likely to occur, and a line width of an intermediate portion (central portion) and a deepest portion (bottom portion) in the depth direction of the cross section of the resist pattern is less likely to be larger than a line width of the surface portion (that is, linearity in the depth direction of the resist pattern contour is favorable), and which has excellent insulation reliability and crack resistance reliability, and a dry film using the same, a printed wiring board, and a printed wiring board manufacturing method.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: March 5, 2024
    Assignee: Hitachi Chemical Company, Ltd. (FIPAS)
    Inventors: Nobuhito Komuro, Yuta Daijima, Masayuki Kojima, Shinji Irizawa, Shinya Oosaki
  • Patent number: 11914301
    Abstract: A photoresist includes a polymer and a photoactive compound. The photoactive compound contains a sensitizer component. The photoactive compound contains an acid generator or a base molecular. The acid generator or the base molecular bonds the sensitizer component. The photoactive compound is within a polymer backbone. The sensitizer component is configured to absorb an EUV light to produce electrons.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chieh-Hsin Hsieh, Wei-Han Lai, Ching-Yu Chang
  • Patent number: 11914295
    Abstract: The present invention is a thermosetting silicon-containing material containing one or more of a repeating unit shown by the following general formula (Sx-1), a repeating unit shown by the following general formula (Sx-2), and a partial structure shown by the following general formula (Sx-3): where R1 represents an iodine-containing organic group; and R2 and R3 are each independently identical to R1, a hydrogen atom, or a monovalent organic group having 1 to 30 carbon atoms. This provides: a thermosetting silicon-containing material used for forming a resist underlayer film which is capable of contributing to sensitivity enhancement of an upper layer resist while keeping LWR thereof from degrading; a composition for forming a silicon-containing resist underlayer film, the composition containing the thermosetting silicon-containing material; and a patterning process using the composition.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: February 27, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu Ogihara, Tsukasa Watanabe, Yusuke Biyajima, Masahiro Kanayama, Ryo Mitsui
  • Patent number: 11906901
    Abstract: Alternating copolymers having hydrocarbon-substituted terminal units and repeat units each containing two different monomer units with extreme ultraviolet (EUV)-absorbing elements are disclosed. Alternating copolymers having organic terminal units and repeat units each containing a monomer unit with an EUV-absorbing element and an organic monomer unit are also disclosed. A process of forming a polymer resist, which includes providing an alternating copolymer having repeat units with at least one EUV-absorbing monomer unit and replacing end groups of the alternating copolymer with unreactive terminal units, is disclosed as well.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: February 20, 2024
    Assignee: International Business Machines Corporation
    Inventors: Dario Goldfarb, Ekmini Anuja De Silva, Jing Guo, Jennifer Church, Luciana Meli
  • Patent number: 11892773
    Abstract: A photosensitive resin composition, a patterning process performed using the photosensitive resin composition, a cured film formed by curing the pattern, and an electronic component having the cured film. The photosensitive resin composition includes a resin, a photosensitizer, a surfactant containing a structural unit represented by formula (1), and a solvent, where Y1 and Y2 each independently represent a hydrogen atom, a methyl group, a phenyl group, or a group represented by formula (2), at least one of Y1 and Y2 is a group represented by formula (2), R1 to R6 are monovalent hydrocarbon groups that may be the same or different and optionally contain a heteroatom, having 1 to 20 carbon atoms, “1” and “n” are each independently integers of 1 to 100, and “m” is an integer of 0 to 100.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: February 6, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki Urano, Masashi Iio, Katsuya Takemura
  • Patent number: 11892772
    Abstract: The present application relates to a binder resin including a compound represented by Formula 1-1 and a compound represented by the following Formula 1-2, a negative-type photosensitive resin composition, and a display device including a black bank formed by using the same.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: February 6, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Junhyun An, Hyunmin Park, Seongho Jeon, Minyoung Lim, Baekhwan Yang