Patents Examined by John S. Chu
  • Patent number: 11573490
    Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises a nonpolar organic solvent, thereby suppressing the reactivity of the epoxy group in the composition to reduce the production of diol compounds. When a cured film is prepared from the composition, an appropriate level of developability can be maintained to further enhance the pattern adhesiveness, resolution, and sensitivity. Further, since the composition of the present invention has a small difference in the film retention rates at room temperature and low temperatures, the composition may have stable stability over time.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: February 7, 2023
    Inventors: Ji Ung Kim, Geun Huh, Ju-Young Jung, JinKyu Im, Yeonok Kim
  • Patent number: 11572430
    Abstract: The present invention employs a compound represented by the following formula (1) and/or a resin comprising the compound as a constituent: wherein R1 is a 2n-valent group of 1 to 60 carbon atoms or a single bond; R2 to R5 are each independently a linear, branched, or cyclic alkyl group of 1 to 10 carbon atoms, an aryl group of 6 to 10 carbon atoms, an alkenyl group of 2 to 10 carbon atoms, an alkoxy group of 1 to 30 carbon atoms, a halogen atom, a thiol group, a hydroxy group, or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group, provided that at least one selected from R2 to R5 is a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group; m2 and m3 are each independently an integer of 0 to 8; m4 and m5 are each independently an integer of 0 to 9, provided that m2, m3, m4, and m5 are not 0 at the same time; n is an integer of 1 to 4; and p2 to p5 are each independently an integer of 0 to 2.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: February 7, 2023
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takumi Toida, Youko Shimizu, Takashi Makinoshima, Takashi Sato, Masatoshi Echigo
  • Patent number: 11572442
    Abstract: Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1): wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms; X1 to X3 represent any of —CO2—, —CONRX1—, —O—, —NRX1—, —S—, —SO2—, —SO3— and —SO2NRX1— and may be the same as or different from each other, provided that RX1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L1 and L2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: February 7, 2023
    Assignees: International Business Machines Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Dmitry Zubarev, Hiroyuki Urano, Katsuya Takemura, Masashi Iio, Kazuya Honda, Yoshio Kawai
  • Patent number: 11561472
    Abstract: A radiation sensitive composition including a siloxane polymer exhibiting phenoplast crosslinking reactivity as a base resin, which is excellent in resolution and can be used as a radiation sensitive composition capable of allowing a pattern having a desired-shape to be formed with sufficient precision. A radiation sensitive composition including as a silane, a hydrolyzable silane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof; and a photoacid generator, in which the hydrolyzable silane includes hydrolyzable silanes of Formula (1) R1aR2bSi(R3)4-(a+b)??Formula (1) wherein R1 is an organic group of Formula (1-2) and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R3 is a hydrolyzable group; and Formula (2) R7cR8dSi(R9)4-(c+d)??Formula (2) wherein R7 is an organic group of Formula (2-1) and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R9 is a hydrolyzable group.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: January 24, 2023
    Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Makoto Nakajima, Kenji Takase, Satoshi Takeda, Wataru Shibayama
  • Patent number: 11561471
    Abstract: A photoresist composition comprising: a resin which has a structural unit represented by formula (I): wherein R1 represents a hydrogen atom, a halogen atom, or a C1 to C6 alkyl group which optionally has a halogen atom, and R2 represents a C1 to C42 hydrocarbon group which optionally has a substituent; an alkali-soluble resin; an acid generator; and a solvent.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: January 24, 2023
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masako Sugihara, Takashi Nishimura, Hiromu Sakamoto
  • Patent number: 11561470
    Abstract: The invention aims to provide a cured film that is high in sensitivity, able to form a pattern having a small-tapered shape after a development step and after a heat curing step, helpful to depress the difference in the width of patterned openings between before and after the heat curing step, and high in light-shielding capability and also aims to provide a negative type photosensitive resin composition that serves for the production thereof.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: January 24, 2023
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yugo Tanigaki, Kazuto Miyoshi
  • Patent number: 11556056
    Abstract: A salt represented by formula (I): wherein Q1 and Q2 each independently represent a fluorine atom or a C1 to C6 perfluoroalkyl group, R1 and R2 each independently represent a hydrogen atom, a fluorine atom or a C1 to C6 perfluoroalkyl group, z represents an integer of 0 to 6, X1 represents *—O—, *—CO—O— or *—O—CO—, * represents a binding site to CR1R2 or CQ1Q2, L1 represents a C1 to C6 alkanediyl group, R3 represents a C5 to C18 alicyclic hydrocarbon group in which a hydrogen atom may be replaced by a hydroxy group, and in which a methylene group may be replaced by an oxygen atom or a carbonyl group, and which alicyclic hydrocarbon group may have a cyclic ketal structure optionally having a fluorine atom; and Z+ represents an organic cation.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: January 17, 2023
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Yukako Anryu, Mitsuyoshi Ochiai, Koji Ichikawa
  • Patent number: 11550217
    Abstract: A photoresist composition, including an acid-sensitive polymer and photoacid generator compound having Formula (I): wherein, EWG, Y, R, and M+ are the same as described in the specification.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: January 10, 2023
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Emad Aqad, William Williams, III, James F. Cameron
  • Patent number: 11550218
    Abstract: A salt capable of producing a resist pattern with excellent line edge roughness is represented by formula (I): wherein, R1 represents —(X1—O)o—R5, and o represents an integer of 0 to 6, R5 represents a hydrocarbon group having 1 to 12 carbon atoms, X1 represents a divalent hydrocarbon group having 2 to 12 carbon atoms, R2 represents an alkyl group having 1 to 12 carbon atoms or the like, I represents an integer of 0 to 3, and when I is 2 or more, a plurality of R2 may be the same or different from each other, R3 and R4 each represent a hydrogen atom or the like, m and n each represent 1 or 2, X0 represents a single bond, —CH2—, —O— or —S—, and R6 and R7 each represent an alkyl group having 1 to 4 carbon atoms which has a fluorine atom or the like.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: January 10, 2023
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Yukako Anryu, Koji Ichikawa
  • Patent number: 11550219
    Abstract: Disclosed are a salt represented by formula (I), and a method for producing the salt, and a quencher and a resist composition comprising the same: wherein R1 and R2 each represent a hydrocarbon group, and —CH2— included in the hydrocarbon group may be replaced by —O— or —CO—; R3, R4 and R5 each represent a halogen atom, an alkyl fluoride group or a hydrocarbon group, and —CH2— included in the hydrocarbon group may be replaced by —O— or —CO—; m3 represents an integer of 0 to 2, and when m3 is 2, two R3 may be the same or different from each other; and m4 and m5 represent an integer of 0 to 5, and when m4 and/or m5 is/are 2 or more, a plurality of R4 and/or a plurality of R5 may be the same or different from each other.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: January 10, 2023
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Katsuhiro Komuro, Yuki Takahashi, Koji Ichikawa
  • Patent number: 11543749
    Abstract: The present invention provides a resist composition which has sufficient resistant to a plating treatment and is capable of forming a resist pattern with high accuracy. The present invention also provides a method for producing a resist pattern using the resist composition, and a method for producing a plated molded article using the resist pattern. The present invention relates to a resist composition comprising a compound (I) having a quinone diazide sulfonyl group, a resin comprising a structural unit having an acid-labile group (A1), an alkali-soluble resin (A2) and an acid generator (B); a method for producing a resist pattern using the resist composition; and a method for producing a plated molded article using the resist pattern.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: January 3, 2023
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masako Sugihara, Takashi Nishimura, Junji Nakanishi
  • Patent number: 11531268
    Abstract: The present invention provides a positive photoresist composition having excellent storage stability, sensitivity, developing properties, plating resistance, and heat resistance. More specifically, a specific dissolution inhibitor in the form of an oligomer having the same repeating unit structure as the resin contained in the photoresist composition is applied to said composition.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: December 20, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Min Young Lim, Tae Seob Lee, Ji Hye Kim
  • Patent number: 11526078
    Abstract: A photosensitive resin composition comprising (A) a silicone resin comprising recurring units having formula (a1) and recurring units having formula (b1), (B) a filler, and (C) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which can be processed into a fine pattern in thick film form, has improved film properties like crack resistance, and is reliable as protective film.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: December 13, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hitoshi Maruyama, Kazunori Kondo
  • Patent number: 11518731
    Abstract: A method for producing a fluorine-containing compound represented by General formula (1), wherein X represents a halogen atom or an alkoxy group, R1 represents a hydrogen atom or a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, Rf1 and Rf2 are each independently a fluorinated alkoxy group, and n represents an integer of 0 or more.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: December 6, 2022
    Assignee: NIKON CORPORATION
    Inventors: Kazuo Yamaguchi, Yusuke Kawakami
  • Patent number: 11506979
    Abstract: Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising a condensate and/or hydrolyzate of a polymer comprising as polymerized units one or more first unsaturated monomers having a condensable silicon-containing moiety, wherein the condensable silicon-containing moiety is pendent to the polymer backbone, and one or more condensable silicon monomers are provided.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: November 22, 2022
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Li Cui, Paul J. LaBeaume, Charlotte A. Cutler, Suzanne M. Coley, Shintaro Yamada, James F. Cameron, William Williams
  • Patent number: 11487201
    Abstract: A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) a photopolymerization initiator; and (D) a solvent.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: November 1, 2022
    Assignee: HD MicroSystems, Ltd.
    Inventors: Etsuharu Tsuchiya, Tetsuya Enomoto, Takashi Kawamori, Nobuyuki Saito, Yukari Koibuchi, Atsutaro Yoshizawa, Akira Asada
  • Patent number: 11487203
    Abstract: Monomers and polymers are provided that comprise a carbon alicyclic group or heteroalicyclic group that comprises 1) one or more acid-labile ring substituents and 2) one or more ether or thioether ring substituents. Photoresists that comprise such polymers also are provided.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: November 1, 2022
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
    Inventors: Eui Hyun Ryu, Myung-Yeol Kim, Woo-Hyung Lee, Haemi Jeong, Kwang-Hwyi Im
  • Patent number: 11487204
    Abstract: To provide a resist material that can form a film with high smoothness and uniformity and has high patterning performance, such as resolution, a resist material is provided that contains a calixarene compound (A) with a molecular structure represented by the following structural formula (1) and a resin component (B); wherein R1 denotes a perfluoroalkyl group or a structural moiety with a perfluoroalkyl group; R2 denotes a hydrogen atom, a polar group, a polymerizable group, or a structural moiety with a polar group or a polymerizable group; R3 denotes a hydrogen atom, an aliphatic hydrocarbon group that optionally has a substituent, or an aryl group that optionally has a substituent; n denotes an integer in the range of 2 to 10; and * denotes a bonding point with an aromatic ring.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: November 1, 2022
    Assignee: DIC Corporation
    Inventors: Tomoyuki Imada, Shinya Yamamoto, Masanori Miyamoto
  • Patent number: 11480878
    Abstract: In one preferred embodiment, polymers are provided that comprise a structure of the following Formula (I): Photoresists that comprises such polymers also are provided.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: October 25, 2022
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
    Inventors: Eui Hyun Ryu, Min Kyung Jang, Jung Woo Kim, Kwang-Mo Choi, Hyun Jeon, Woo-Hyung Lee, Myung-Yeol Kim
  • Patent number: 11480877
    Abstract: The present invention is a compound represented by the following general formula (1).
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: October 25, 2022
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takumi Toida, Masatoshi Echigo, Takashi Sato, Youko Shimizu