Abstract: This invention is that of high temperature polyamides containing the hexafluoroisopropylidene group. The high temperature polyamides of the invention and photo or radiation sensitizers provide improved high temperature positive resists which can be developed in aqueous alkaline developer and thermally anneal to form heat resistant, polyoxazole relief structures suitable for use in microelectronic and printing applications. The positive photoresists of the invention have improved solubility in coating solvents and improved photospeed. The polyamides of the invention can be prepared by conventional condensation reactions; e.g. the condensation of a diamine and diacid chloride. In addition the polyamides of this invention provide high temperature protective coatings with superior adhesion properties in applications other than the photoresist area.

Abstract: An aqueous alkali developable photoresist composition consists of (a) a carboxyl group-containing polymeric binder, (b) 1-15% by weight of a photoinitiator based on the binder, (c) 20-100% by weight based on the binder, of a photo reactive monomer or oligomer containing at least two ethylenically unsaturated double bonds, and (d) 0.05-5% by weight based on the binder of a weak alkali soluble or dispersible thiol compound represented by(X).sub.a R--SH).sub.bwhere a, b are integers equal to or greater than 1, R is an organic moiety of molecular weight less than 500, and X is a carboxyl group-containing moiety or hydrophilic organic polymeric segment with less than 100 repeating unit.

Abstract: A process for the formation of a negative resist pattern, comprising preparing a mixture consisting of water-soluble polymeric material having at least one hydroxyl group with a photoacid generator capable of releasing an acid upon radiation exposure, coating a solution of the resist material onto a substrate to form a resist layer, exposing layer to patterned radiation, heating the exposed resist layer in the presence of an acid as a catalyst to remove water, and developing resist layer with water to remove unexposed areas to form a resist pattern on the substrate.

Abstract: A novel copolymer containing a plurality of first and second monomer units having the following general formulas (I) and (II), respectively: ##STR1## wherein R.sub.1 stands for hydrogen or methyl and Ar stands for an aryl, ##STR2## wherein R.sub.2 stands for hydrogen or methyl and X stands for -CH.sub.2 CH.sub.2 -, -CH.sub.2 CH(OH)CH.sub.2 - or -CH.sub.2 CH(CH.sub.2 OH)- and Y stands for o- or p-chlorophenyl, the molar ratio of the first monomer unit to the second monomer unit being 94:6 to 98:2. The copolymer becomes insoluble to a developing liquid when exposed to high energy radiations and is used for forming resist pattern on a silicon wafer or the like substrate.

Abstract: A UV curable, aqueous alkaline developable solder mask composition having tenting capabilities includes a thermal free radical initiator capable of generating free radicals with heat, and a polyunsaturated compound capable of being thermally cross-linked by the free radicals to provide a substantially fully cured solder mask coating.

Abstract: A radiation sensitive plate is provided with a discontinuous covering layer to improve vacuum drawdown. The covering layer is produced by dissolving the material which is to form the covering layer in a solvent so as to form a solution having a conductivity of from 10.sup.3 to 10.sup.9 pSm.sup.-1. The solution is then directed towards the plate while providing a potential of at least 5 kV between the solution and the plate. The potential is the sole disruptive force in the liquid and draws the liquid into ligaments and disrupts the ligaments to form drops of substantially equal size which are then deposited on the plate.

Abstract: This invention relates to carbazole diazonium salts which are used in pre-polymer or polymer compositions as sources of photoinitiated strong acids in such developments as imaging films where strong acids are needed to effect polymerization of the film or to remove protective groups.

Abstract: The developer solution of the invention is suitable for use to develop a positive-working resist composition comprising an alkali-soluble novolac resin and a naphthoquinone diazide compound and capable of giving a patterned image of the resist layer with a high contrast and increasing the effective depth of focus. The characteristic ingredient in the inventive developer solution is an alkali-soluble organic cyclic nitrogen compound such as N-hydroxyethyl piperazine, N-methyl-4-piperidone, 1,3-dimethyl-2-imidazolidinone and the like added in a specified concentration to a conventional developer solution containing tetramethyl ammonium hydroxide or choline as the water-soluble alkaline compound.

Abstract: The present invention relates to a negative photoresist essentially comprising(a) at least one solid, film-folrming polyphenol,(b) at least one polyfunctional epoxy resin and/or one polyfunctional vinyl ether compound, each of which can be dissolved, in the uncured state, in aqueous alkaline media with salt formation,(c) at least one cationic photoinitiator for component (b) and(d) customary additives, if desired.Components (a) and (b) can also be combined in one molecule. The resist can be developed in aqueous alkaline media.

Abstract: This invention relates to an image reproduction process, more particularly a color proofing process, which utilizes a peel-apart photosensitive element comprising a strippable coversheet, a photohardenable layer, an elastomeric layer, and a support, to produce a positive image of the transparency on the coversheet and a negative image of the transparency on the elastomeric layer.

Abstract: There is disclosed an image forming method which comprises forming an image portion by exposing and developing an image forming material having a light-sensitive composition, and transferring only the image portion onto an image receiving material with the non-image portion of the image receiving material being exposed, wherein the light-sensitive composition contains:(1) at least one selected from:(a) o-quinonediazide compounds; and(b) compositions containing both of a photoacid generating agent and a compound having at least one bond decomposable with the acid; and(2) a polymeric compound having a structure unit represented by the following formula in the molecular structure:CH.sub.2 --CH(OCOR)--wherein R represents an alkyl group having 1 to 17 carbon atoms.

Abstract: A positive-working radiation-sensitive composition is described, which comprises a binder which is insoluble in water and soluble or swellable in organic solvents and in aqueous-alkaline solutions, a compound which forms a strong acid upon irradiation, and a compound of the general formula ##STR1## wherein R denotes an alkyl group which may be substituted andR.sub.1 and R.sub.2 are identical or different and denote alkyl groups containing 1 to 6 carbon atoms.The composition is suitable for use in the production of radiation-sensitive recording materials such as printing plates or photoresists and is characterized by increased flexibility and good overdevelopment resistance.

Abstract: A heat-sensitive recording material comprising a support having provided thereon a heat-sensitive recording layer which comprises (a) a diazo compound, (b) a coupling component which forms a coloration by coupling with the diazo compound, and (c) a basic substance having a structural unit represented by Formula (I): ##STR1##

Abstract: A multicolor recording material having on one side of a support at least two layers capable of producing colors different from each other in hue through respective color-producing reactions, which further has an interlayer constituted by a water-soluble polyanionic polymer having gelled through the interaction with a polycation between every adjacent two of said color-producing layers to prevent migration of ingredients from one color-producing layer to another.

Abstract: Organometal-containing polymers having side chains of the formula I ##STR1## in which, for example, M is Si, X is O, R.sup.1 and R.sup.2 are hydrogen and R.sup.4 to R.sup.6 are each methyl and which have an average molecular weight between 1,000 and 1,000,000, are suitable for the preparation of dry-developable photoresists, such as are required for the generation of structured images, in particular in microelectronics.

Abstract: A method for storing photosensitive donor media comprising the step of: placing said donor media in an air and humidity occlusive vessel; establishing an internal atmosphere in said vessel, said internal atmosphere containing about 1 to 5% oxygen and about 40 to 60% humidity; and sealing said donor media in said vessel.

Abstract: This invention relates to positive working color proofing sheet construction which, upon exposure to an actinic radiation source through a screened image, can accuratley reprouce said image. The construction is useful as a color proofing film which can be employed to accurately predict the image quality from a lithographic printing process. The image is produced by forming a composite of a receiver base, diazo or diazide layer, photopolymerizable layer and cover sheet. Upon imagewise exposure, a positive image appears on the receiver base after dry peel apart development.

Abstract: Holographic photopolymer compositions having fluorinated binders are provided that produce excellent reflection holograms when holographically imaged.

Abstract: The present invention is concerned with a printing plate of which image formation is done by photoirradiation, having a front side covered waith a peelable or removable protective layer which contains a photofading material. The printing plate is safe against fogging to light and can be used under ordinary illumination.

Abstract: A photosensitive thermosetting resin composition, comprising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, (D) a finely powdered epoxy compound containing at least two epoxy groups in the molecular unit thereof and exhibiting sparing solubility in the diluent to be used, and optionally (E) a curing agent for epoxy resin, excels in developing property and sensitivity and enjoys a long shelf life.By subjecting this photosensitive thermosetting resin composition to coating, exposure, development, and postcuring, there can be formed a solder resist pattern which excels in adhesion, insulation resistance, resistance to electrolytic corrosion, resistance to soldering temperature, resistance to chemicals, and resistance to plating.