Patents Examined by Jorge L Salazar, Jr.
  • Patent number: 11575363
    Abstract: RF filtering circuitry comprises a first node, a second node, and a series signal path between the first node and the second node. A number of acoustic resonators are coupled to one or more of the first node and the second node via the series signal path. A first one of the acoustic resonators is associated with a first quality factor and a first electromechanical coupling coefficient. A second one of the acoustic resonators is associated with a second quality factor and a second electromechanical coupling coefficient. The first quality factor is different from the second quality factor and the first electromechanical coupling coefficient is different from the second electromechanical coupling coefficient.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: February 7, 2023
    Assignee: Qorvo US, Inc.
    Inventors: Alfred Gimenez, Wolfgang Heeren, Gernot Fattinger, Mudar Al-Joumayly
  • Patent number: 11563417
    Abstract: An acoustic resonator includes: a substrate; a resonant region including a first electrode, a piezoelectric layer, and a second electrode disposed on the substrate, and a reflective layer disposed along a periphery of the resonant region; and a connection electrode extending from the second electrode. The reflective layer includes a second section disposed between the resonant region and the connection electrode, and a first section, and a cross-sectional area of the first section is different than a cross-sectional area of the second section.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: January 24, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Hun Jeong, Sang Uk Son, Won Han, Jong Woon Kim
  • Patent number: 11563413
    Abstract: When a thick frequency adjustment metal film of a tuning fork-type vibration piece is irradiated with a beam on a wafer for frequency coarse adjustment, projections are possibly formed on a roughened end of the frequency adjustment metal film. Such projections are pressurized and pushed down not to chip off under any impact, so that the risk of frequency fluctuations is suppressed.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: January 24, 2023
    Assignee: DAISHINKU CORPORATION
    Inventor: Hiroaki Yamashita
  • Patent number: 11558034
    Abstract: An acoustic resonator filter is provided. The acoustic resonator filter includes a rear filter electrically connected between a front port and a rear port, through which a radio frequency (RF) signal passes, the rear filter including at least one film bulk acoustic resonator (FBAR); and a front filter electrically connected between the front port and the rear filter and including at least one solidly mounted resonator (SMR).
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: January 17, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Han, Yoon Sok Park, Tae Kyung Lee, Hwa Sun Lee
  • Patent number: 11558025
    Abstract: A bulk-acoustic wave resonator includes: a first electrode; a piezoelectric layer at least partially disposed on an upper portion of the first electrode; and a second electrode disposed to cover at least a portion of the piezoelectric layer. The second electrode includes a frame disposed at an edge of an active region of the bulk-acoustic wave resonator, and the first electrode, the piezoelectric layer and the second electrode are disposed to overlap one another at the edge of the active region. The frame includes a wall disposed at the edge of the active region and a trench formed on an internal side of the wall. An internal boundary line of the trench has a concave-convex shape in a plane parallel to an upper surface of the frame.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: January 17, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Hoon Ryou, Sang Uk Son, Sung Wook Kim, Won Han, Dae Hun Jeong, Sang Heon Han
  • Patent number: 11558028
    Abstract: A filter module includes an inductor, a filter including first wiring, and second wiring between the inductor and the first wiring and being a direct-current floating potential. The inductor and the first wiring are magnetically coupled, the inductor and the second wiring are magnetically coupled, and the first wiring and the second wiring are capacitively coupled.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: January 17, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Akira Noguchi
  • Patent number: 11552614
    Abstract: A laterally excited bulk acoustic wave device is disclosed. The laterally excited bulk acoustic wave device can include a first solid acoustic mirror, a second solid acoustic mirror, a piezoelectric layer that is positioned between the first solid acoustic mirror and the second solid acoustic mirror, an interdigital transducer electrode on the piezoelectric layer, and a support substrate arranged to dissipate heat associated with the bulk acoustic wave. The interdigital transducer electrode is arranged to laterally excite a bulk acoustic wave. The first solid acoustic mirror and the second solid acoustic mirror are arranged to confine acoustic energy of the bulk acoustic wave. The first solid acoustic mirror is positioned on the support substrate.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: January 10, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Joshua James Caron, Rei Goto
  • Patent number: 11528007
    Abstract: Disclosed is a Bulk Acoustic Wave (BAW) filter structure with a conductive bridge forming an electrical loop with an electrode for reduced electrical losses. In exemplary aspects disclosed herein, the BAW filter structure includes a transducer with electrodes, a piezoelectric layer between the electrodes, and at least one conductive bridge offset from at least a portion of one of the electrodes by an insulating volume. The conductive bridge forms a first electrical loop between a medial end and a distal end of the electrode. Such a configuration reduces electrical resistance, heat resistance, and/or ohmic losses for improved electrical loss of the BAW filter structure.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: December 13, 2022
    Assignee: Qorvo US, Inc.
    Inventors: Yazid Yusuf, Mohammad J. Modarres-Zadeh, Andreas Tag, Paul Stokes, Robert Aigner, Gernot Fattinger
  • Patent number: 11522514
    Abstract: Piston mode Lamb wave resonators are disclosed. A piston mode Lamb wave resonator can include a piezoelectric layer, such as an aluminum nitride layer, and an interdigital transducer on the piezoelectric layer. The piston mode Lamb wave resonator has an active region and a border region, in which the border region has a velocity with a lower magnitude than a velocity of the active region. The border region can suppress a transverse mode.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: December 6, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jie Zou, Jiansong Liu, Gong Bin Tang, Chih-Ming Lin, Chun Sing Lam
  • Patent number: 11522516
    Abstract: An apparatus is disclosed for a surface-acoustic-wave filter using lithium niobate (LiNbO3). In an example aspect, the apparatus includes at least one surface-acoustic-wave filter including an electrode structure, a substrate layer, and a piezoelectric layer disposed between the electrode structure and the substrate layer. The piezoelectric layer includes lithium niobate material configured to enable propagation of an acoustic wave across its planar surface in a direction along a first filter axis. A second filter axis is along the planar surface and perpendicular to the first filter axis. A third filter axis is normal to the planar surface. An orientation of the first, second, and third filter axes is relative to a crystalline structure of the lithium niobate material as defined by Euler angles ?, ?, and ?. A value of ? has a range approximately from ?70° to ?55° or at least one symmetrical equivalent.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: December 6, 2022
    Assignee: RF360 EUROPE GMBH
    Inventors: Ulrike Monika Roesler, Ingo Bleyl
  • Patent number: 11509279
    Abstract: Acoustic resonator devices and filters. An acoustic resonator includes a substrate having a surface and a lithium niobate plate. A back surface of the lithium niobate plate is attached the substrate except for a portion of the lithium niobate plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on a front surface of the lithium niobate plate such that interleaved fingers of the IDT are disposed on the diaphragm. The IDT and the lithium niobate plate configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the diaphragm. Euler angles of the lithium niobate plate are [0°, ?, 0°], where ? is greater than or equal to 40° and less than or equal to 70°.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: November 22, 2022
    Assignee: Resonant Inc.
    Inventor: Bryant Garcia
  • Patent number: 11502668
    Abstract: Multi-mode surface acoustic wave filters are disclosed. A multi-mode surface acoustic wave filter can include a plurality of interdigital transducer electrodes that are longitudinally coupled to each other and stepped acoustic reflectors on opposing sides of the plurality of interdigital transducer electrodes. The acoustic reflectors include acoustic reflector fingers with stepped lengths.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: November 15, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventor: Rei Goto
  • Patent number: 11496110
    Abstract: A micro-resonator includes a first electrode positioned on a piezoelectric plate at a first end of the piezoelectric plate, the first electrode including a first set of fingers and a second electrode positioned on the piezoelectric plate at a second end of the piezoelectric plate. The second electrode including a second set of fingers interdigitated with the first set of fingers with an overlapping distance without touching the first set of fingers, the overlapping distance being less than seven-tenths the length of one of the first set of fingers or the second set of fingers. At least one of the first end or the second end of the piezoelectric plate may define a curved shape.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: November 8, 2022
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Songbin Gong, Yong-Ha Song
  • Patent number: 11496114
    Abstract: A longitudinally coupled resonator elastic wave filter is disposed on a piezoelectric substrate. IDT electrodes include first and second busbars. An inorganic insulating layer is provided on at least one side in a direction perpendicular or substantially perpendicular to an elastic wave propagation direction to cover the first or second busbars, and a first wiring line is disposed on the inorganic insulating layer to extend in the elastic wave propagation direction. A second wiring line three-dimensionally crosses the first wiring line with the inorganic insulating layer interposed therebetween. The first wiring line is connected to busbars, which are connected to the same potential, by extending through the inorganic insulating layer.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: November 8, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takayuki Okude
  • Patent number: 11496113
    Abstract: A filter device has a substrate with a first cavity and a second cavity on a single die; and a bonding layer formed on the substrate but not spanning the first cavity or the second cavity. A piezoelectric plate is bonded to the bonding layer and spans the first and the second cavity. However, excess portions of piezoelectric plate are removed that extend a certain length past the perimeter of the first cavity and of the second cavity. Excess portions may be piezoelectric material that extends in the length and width direction past the perimeter of a cavity by more than between 2 and 25 percent of the cavity perimeter. An interdigital transducer (IDT) is on a front surface of the piezoelectric plate and having interleaved fingers over the first cavity.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: November 8, 2022
    Assignee: Resonant Inc.
    Inventor: Ventsislav Yantchev
  • Patent number: 11489513
    Abstract: Multi-mode surface acoustic wave filters are disclosed. A multi-mode surface acoustic wave filter can include a plurality of interdigital transducer electrodes that are longitudinally coupled to each other and acoustic reflectors on opposing sides of the plurality of interdigital transducer electrodes. The acoustic reflectors include acoustic reflector fingers arranged to suppress a spurious response due to shear horizontal mode of the multi-mode surface acoustic wave filter. For example, the acoustic reflector fingers can include stepped lengths and/or slanted pitches to suppress the spurious response due to shear horizontal mode.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: November 1, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventor: Rei Goto
  • Patent number: 11482983
    Abstract: An elastic wave device includes a support substrate made of silicon, a piezoelectric film disposed directly or indirectly on the support substrate, and an interdigital transducer electrode disposed on one surface of the piezoelectric film. A higher-order mode acoustic velocity of propagation through the piezoelectric film is equal or substantially equal to an acoustic velocity Vsi=(V1)1/2 of propagation through silicon or higher than the acoustic velocity Vsi, where Vsi is specified by V1 among solutions V1, V2, and V3 with respect to x derived from Ax3+Bx2+Cx+D=0.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: October 25, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hideki Iwamoto
  • Patent number: 11479460
    Abstract: MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: October 25, 2022
    Assignee: Stathera IP Holdings Inc.
    Inventors: Vamsy Chodavarapu, George Xereas
  • Patent number: 11482981
    Abstract: Acoustic resonators and filter devices. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A conductor pattern formed is formed on the front surface of the piezoelectric plate, including an interdigital transducer (IDT) with interleaved fingers of the IDT on the diaphragm. The substrate and the piezoelectric plate are the same material.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: October 25, 2022
    Assignee: Resonanat Inc.
    Inventors: Neal Fenzi, Robert Hammond, Patrick Turner, Bryant Garcia, Ryo Wakabayashi
  • Patent number: 11476831
    Abstract: A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer electrode that is disposed on a main surface of the piezoelectric substrate, a plurality of partition-support layers each of which is arranged in a region of the main surface surrounded by an outer periphery of the main surface, and a cover layer that is disposed above the plurality of partition-support layers and that covers the interdigital transducer electrode. The plurality of partition-support layers include a first partition-support layer and a second partition-support layer that are adjacent to each other, and a portion of the first partition-support layer and a portion of the second partition-support layer do not overlap each other when viewed from a second direction perpendicular or substantially perpendicular to a first direction in which the plurality of partition-support layers extend.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: October 18, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuhiko Hirano, Daisuke Sekiya