Abstract: Before formation of gate insulating films, an oblique ion implantation of oxygen into opposing sidewalls of trenches, from a top of an oxide film mask is performed, forming oxygen ion-implanted layers in surface regions of the sidewalls. A peak position of oxygen concentration distribution of the oxygen ion-implanted layers is inside the oxide film mask. After removal of the oxide film mask, HTO films constituting the gate insulating films are formed. During deposition of the HTO films, excess carbon occurring at the start of the deposition of the HTO films and in the gate insulating films reacts with oxygen in the oxygen ion-implanted layers, thereby becoming an oxocarbon and being desorbed. The oxygen ion-implanted layers have a thickness in a direction orthogonal to the sidewalls at most half of the thickness of the gate insulating films, and an oxygen concentration higher than any other portion of the semiconductor substrate.

Abstract: An integrated circuit (IC) structure includes a substrate having several regions, several semiconductor devices formed at the substrate and respectively within the regions, and an ultra-deep (UD) trench isolation structure formed in the substrate. The substrate has a top surface and a bottom surface oppositely, and the UD trench isolation structure formed in the substrate surrounds peripheries of each of the regions for structurally and physically isolating the semiconductor devices within different regions. The UD trench isolation structure penetrates the substrate by extending from the top surface of the substrate to the bottom surface of the substrate.

Abstract: Methods for forming contacts to source/drain regions and gate electrodes in low- and high-voltage devices and devices formed by the same are disclosed. In an embodiment a device includes a first channel region in a substrate adjacent a first source/drain region; a first gate over the first channel region; a second channel region in the substrate adjacent a second source/drain region, a top surface of the second channel region being below a top surface of the first channel region; a second gate over the second channel region; an ILD over the first gate and the second gate; a first contact extending through the ILD and coupled to the first source/drain region; and a second contact extending through the ILD, coupled to the second source/drain region, and having a width greater a width of the first contact and a height greater than a height of the first contact.

Abstract: A device includes a transistor, an insulating structure, a buried conductive line, and a buried via. The transistor is above a substrate and includes a source/drain region and a source/drain contact above the source/drain region. The insulating structure is above the substrate and laterally surrounds the transistor. The buried conductive line is in the insulating structure and spaced apart from the transistor. The buried via is in the insulating structure and interconnects the transistor and the buried conductive line. A height of the buried conductive line is greater than a height of the source/drain contact.

Abstract: A method (200) of fabricating a semiconductor device includes etching (205) a group of trenches in a semiconductor surface layer of a substrate. The group of trenches includes an outermost trench that has a first width and remaining trenches of the group of trenches have a second width that is less than the first width. The outermost trench is formed at an edge of the group of trenches. A dielectric liner is formed (210) in the group of trenches and the dielectric liner is etched (215) in an upper portion of the group of trenches to remove a partial thickness of the dielectric liner. A full thickness of the dielectric liner is maintained in a lower portion of the group of trenches. The group of trenches is filled (220) with a polysilicon layer.

Abstract: According to one embodiment, a semiconductor device includes a first electrode, a semiconductor layer, a first conductive part, a second conductive part, and a second electrode. The semiconductor layer includes a first semiconductor region, a second semiconductor region, and a third semiconductor region. The first semiconductor region is electrically connected to the first electrode. The second semiconductor region is provided on the first semiconductor region. The third semiconductor region is provided on the second semiconductor region. The first conductive part includes a buried electrode provided in the first semiconductor region with a first insulator interposed. The second conductive part includes a gate electrode provided on the buried electrode with a second insulator interposed. The first conductive part is electrically connected to the second conductive part. An electrical resistance of the first conductive part is greater than an electrical resistance of the second conductive part.

Abstract: A semiconductor device includes an HBT; emitter wiring which is connected to an emitter electrode of the HBT and covers the HBT; a passivation film having an opening on the HBT in plan view; a UBM layer which is connected to the emitter wiring through the opening and made of a refractory metal with a thickness of 300 nm or more; and a pillar bump which is arranged on the UBM layer and includes a metal post and a solder layer. The UBM layer serves as a stress relaxation layer, thereby relaxing stress on the HBT due to a difference in thermal expansion coefficient between a GaAs-based material of each layer constituting the HBT and the pillar bump.

Abstract: The present invention provides a chip component that achieves outstanding LC characteristics. The present invention provides a chip component (1), including: a substrate (12); an inorganic insulating layer (13), formed on the substrate (12); an organic insulating layer (14), formed on the inorganic insulating layer (13); and an LC circuit (6), including a first capacitor (C1) formed in the inorganic insulating layer (13), and a first inductor (L1) formed, in a manner of being electrically connected to the first capacitor (C1), in the organic insulating layer (14).

Abstract: A method includes providing a structure having a substrate, a first dielectric layer over the substrate, one or more semiconductor channel layers over the first dielectric layer and connecting a first source/drain (S/D) feature and a second S/D feature, and a gate structure engaging the one or more semiconductor channel layers; etching the substrate from the backside of the structure to form a first trench exposing the first S/D feature and a second trench exposing the second S/D feature; forming an S/D contact in the first trench; etching at least a portion of the first dielectric layer resulting in a portion of the S/D contact protruding from the first dielectric layer at the backside of the structure; and depositing a seal layer over the S/D contact, wherein the seal layer caps an air gap between the gate structure and the seal layer.

Abstract: A semiconductor device and a manufacturing method thereof are provided. The gate structure and the source and drain terminals are located in the insulating dielectric layer, and the source and drain terminals are located respectively at both opposite ends of the gate structure. The channel region is sandwiched between the gate structure and the source and drain terminals and surrounds the gate structure. The channel region extends between the source and drain terminals.

Abstract: In a method according to embodiments of the invention, a semiconductor structure including a III-nitride light emitting layer disposed between a p-type region and an n-type region is grown. The p-type region is buried within the semiconductor structure. A trench is formed in the semiconductor structure. The trench exposes the p-type region. After forming the trench, the semiconductor structure is annealed.

Abstract: A semiconductor device includes a source/drain region, a body region, a first gate structure, and a second gate structure. The source/drain region and the body region are in a substrate. The first and second gate structures are above the substrate. The source/drain region and the body region are on opposite sides of the first gate structure. The second gate structure is spaced apart from the first gate structure. The source/drain region, the body region, and the first gate structure are on a same side of the second gate structure.

Abstract: A semiconductor device includes a fin structure disposed over a substrate. The semiconductor device includes a first interfacial layer straddling the fin structure. The semiconductor device includes a gate dielectric layer extending along sidewalls of the fin structure. The semiconductor device includes a second interfacial layer overlaying a top surface of the fin structure. The semiconductor device includes a gate structure straddling the fin structure. The first interfacial layer and the gate dielectric layer are disposed between the sidewalls of the fin structure and the gate structure.

Abstract: A semiconductor device includes a first field effect transistor (FET) including a first gate dielectric layer and a first gate electrode. The first gate electrode includes a first lower metal layer and a first upper metal layer. The first lower metal layer includes a first underlying metal layer in contact with the first gate dielectric layer and a first bulk metal layer. A bottom of the first upper metal layer is in contact with an upper surface of the first underlying metal layer and an upper surface of the first bulk metal layer.

Abstract: A semiconductor device includes a Silicon-on-Insulator (SOI) substrate including a top device layer, a buried oxide (BOX) layer, and a bottom handle portion. A filled trench is lined with a trench dielectric layer that extends to at least the BOX layer, defining an inner and an outer portion of the device layer. A field effect transistor (FET) includes an inner portion, a source region having a source contact thereto and a drain region having a drain contact thereto, each doped a first doping type. A gate region has a gate contact that is separated from the inner portion by the trench dielectric. The source and drain region are separated by a body region doped a second doping type having a body contact.

Abstract: An object of the present disclosure is to provide a semiconductor device capable of lowering the threshold voltage without deteriorating the RBSOA tolerance and manufacturing variation. According to the present disclosure, the semiconductor device includes a drift layer of a first conductivity type, a carrier store layer of the first conductivity type, a base layer of a second conductivity type, an emitter layer of the first conductivity type provided on the first main surface side of the base layer, an active trench provided so as to extend through the emitter layer, the base layer, and the carrier store layer and reach the drift layer, a gate insulating film, a gate electrode, and a collector layer of the second conductivity type provided on a second main surface side of the drift layer, in which peak concentration of impurities in the base layer is 1.0E17 cm?3 or higher.

Abstract: A display device including a substrate, a first transistor, a second transistor, and a first capacitor electrode is provided. The first transistor is disposed above the substrate and includes a first semiconductor layer, a first gate electrode, and a first gate insulator layer. The first semiconductor layer includes a silicon semiconductor layer. The first gate electrode overlaps the first semiconductor layer. The first gate insulator layer is disposed between the first semiconductor layer and the first gate electrode. The second transistor is disposed above the substrate and includes a second semiconductor layer and a second gate electrode. The second semiconductor layer includes an oxide semiconductor layer. The second gate electrode overlaps the second semiconductor layer. The first capacitor electrode overlaps the second gate electrode. The first gate insulator is disposed above the first capacitor electrode.

Abstract: A microelectronic device comprises a conductive structure, a metal nitride material, and a metal silicide material. The conductive structure comprises a first portion having a first width, and a second portion under the first portion and extending into a semiconductive material. The second portion has a tapered profile defining additional widths varying from the first width at an upper boundary of the second portion to a second width less than the first width at a lower boundary of the second portion. The metal nitride material substantially surrounds outer surfaces of the first portion and the second portion of the conductive structure. The metal silicide material substantially covers outer surfaces of the metal nitride material within vertical boundaries of the second portion of the conductive structure. Related methods, memory devices, and electronic systems are also described.

Abstract: Disclosed are optimized contract structures and fabrication techniques thereof. At least one aspect includes a semiconductor die. The semiconductor die includes a substrate and a contact disposed within the substrate. The contact includes a first portion with a first vertical cross-section having a first cross-sectional area. The first vertical cross-section has a first width and a first height. The contact also includes a second portion with a second vertical cross-section having a second cross-sectional area less than the first cross-sectional area. The second vertical cross-section includes a lower portion having the first width and a second height less than the first height, and an upper portion disposed above the lower portion and having a second width less than the first width and having a third height less than the first height.

Abstract: Embodiments of the present disclosure provide a display substrate, a method for manufacturing a display substrate, and a display device. The method for manufacturing the display substrate includes: providing a seed layer on a first carrier substrate and forming a base substrate covering the seed layer; forming a first connection terminal on a side of the base substrate away from the first carrier substrate, the first connection terminal electrically connecting to the seed layer; removing the first carrier substrate to expose the seed layer; and forming a second connection terminal electrically connecting to the seed layer.