Abstract: A device for cleaning semiconductor wafers with a cleaning liquid, includes a cleaning station with a plurality of rotating pairs of rollers which are arranged one behind another and to which the cleaning liquid is applied. Each pair of rollers is formed by a top roller and a bottom roller, and the semiconductor wafer is conveyed between the pairs of rollers. There is also a conveyor means for conveying the semiconductor wafer to and from the cleaning station. The conveyor means has a film of conveyor liquid which is provided by the conveyor and on which the semiconductor wafer is conveyed. A supplying container provides the cleaning liquid to the top rollers in the form of a falling liquid which migrates over the rollers. There is also a method for cleaning semiconductor wafers in which such a device is used.

Abstract: A magnetically coupled roller assembly is provided. A magnet is positioned on the roller and couples to a roller positioned on a drive assembly. The roller and driver are separated by a chamber wall and magnetically coupled therethrough. A shaft coupled to the roller may be positioned in a pocket formed in the chamber wall, and the roller and driver magnets may be axially offset so as to “pull” the roller toward the interior of the pocket.

Abstract: A dispenser for a dishwasher is proposed containing a housing 1 partially projecting in the installed condition through a door recess into the interior of the door of the automatic dishwasher and located partially within the wash area. The housing consists of two housing sections which preclude housing leaks into the interior of the door. This is achieved by providing an inner section located only partially within the interior of the door and projecting into the wash area, and an outer section located completely on the side of the wash area.

Abstract: A substrate treating apparatus and method can recover a substrate treating liquid such as a cleaning liquid in an efficient manner and positively avoid occurrences of treatment defects such as formation of cleaning spots, water marks and the like. A fixed upper plate and a fixed lower plate are disposed in opposition to each other so as to define a space therebetween. A substrate such as a semiconductor wafer is inserted into the space between the fixed upper and lower plates, supported there by a support and adapted to be rotated through rotation of the support. A substrate treating medium such as a cleaning liquid is introduced into the space to treat the substrate while the substrate is rotating. The treating medium after having treated the substrate is discharged from the space through a discharge passage which is defined between an outer peripheral surface of the support and an inner surface of a housing which covers the outer peripheral surface of the support.

Abstract: The pipe cleaning nozzle is designed for the removal of deposits (23) in vacuum toilet pipes, particularly such pipes in aircraft, ships and trains. Since pipes (10) of this type are often installed to follow narrow radii of curvature, a need exists for a pipe cleaning nozzle which has a small axial dimension. The nozzle head (12) comprises a convex front wall (16) and a concave rear wall (17). The connector piece (13) is partially sunk in the concave rear wall (17). The high-pressure jets (22) are discharged from the nozzle orifices (21) to split off the deposits. The overall length of the nozzle head (12) inclusive of the connector piece (13) is not larger than the outer diameter of the nozzle head.

Abstract: In a method and apparatus for cleaning filters, the cleaning is efficiently performed by selecting cleaning steps according to the degree of contamination of the filter media. The degree of contamination of the filter media is analyzed before the filter is carried into the cleaning apparatus. Filters with heavily contaminated filter media are subjected to pretreatment before the cleaning process is performed, and the filters with less contaminated filter media are directly subjected to the cleaning process. The cleaned filter is subjected to a restoration process before reuse.

Abstract: An apparatus for cleaning the interior of small diameter pipes. The apparatus has high-pressure rotary fluid distribution nozzles on a rotating bracket carried on a movable platform. The apparatus is self-centering within the pipe with ultra high-pressure fluid swivels and quick disconnect air and fluid supply fittings associated therewith.

Abstract: The apparatus has chuck pins 201 for chucking the wafer 1 and a cylindrical inner wheel 204 and a cylindrical outer wheel 203 to prevent the wafer from tilting or moving when fluid-treating the wafer by rotating it. The upper end of the chuck pin 201 is formed with a chuck groove 201a and a wafer release portion 201b. The lower end of the chuck pin 201 is formed with a gear 201e. The outer circumference of the inner wheel 204 is formed with a gear 205 and the inner circumference of the outer wheel 203 is formed with arc grooves 202. After the wafer 1 is placed on the wafer release portions 201b, the inner wheel 204 is rotated relative to the outer wheel 203 to spin the chuck pins 201 on their own axes to chuck the outer periphery of the wafer 1 with the chuck grooves 201a. Then the outer wheel 203 and the inner wheel 204 are rotated together to revolve the chuck pins 201 around their center, causing the wafer 1 chucked by the chuck pins 201 to rotate.