Patents Examined by Kam F. Lee
  • Patent number: 5618611
    Abstract: The present invention provides a method for metallizing a ceramic surface comprising a ferrite through a surface reduction treatment. A ceramic surface comprising a ferrite is heated. At least a portion of the ferrite is contacted with a gaseous reducing agent to create a metallic region by removing oxygen from the ferrite. The surface is cooled and, optionally, post-treated to enhance adhesion of the metallic region. Typical gaseous reducing agents are hydrogen, forming gas, and ammonia while typical ferrites are nickel-zinc ferrites and manganese-zinc ferrites. To form patterned regions, portions of the substrate are masked or portions of the reduced layer are removed.
    Type: Grant
    Filed: April 25, 1995
    Date of Patent: April 8, 1997
    Assignee: Lucent Technologies Inc.
    Inventors: Sungho Jin, Henry H. Law, Thomas H. Tiefel, Te-Sung Wu
  • Patent number: 5547740
    Abstract: A flip chip integrated circuit device (110) is provided having a surface, a perimeter, and solder bumps (112) located on the surface. At least one solder bump (112), and preferably a plurality of solder bumps (112), are spaced apart from the perimeter of the device (110). Electrically conductive runners (118) extend from the perimeter of the device (110) to each of those solder bumps (112) that are spaced apart from the perimeter, so as to electrically interconnect the solder bumps (112) to a point, such as a pad (116), at the perimeter. As a result, not all of the solder bumps (112) employed by the device (110) need be accommodated at the perimeter of the device (110), such that the size and number of the solder bumps (112) does not dictate the size of the device (110).
    Type: Grant
    Filed: March 23, 1995
    Date of Patent: August 20, 1996
    Assignee: Delco Electronics Corporation
    Inventors: William D. Higdon, Susan A. Mack, Ralph E. Cornell
  • Patent number: 5540977
    Abstract: A microelectronic component has a substrate on which a layer structure and at least two contact structures are arranged. The layer structure and the contact structures are electrically connected to one another but are electrically insulated from the substrate. The layer structure is formed by one layer of individual elements that are electrically connected to one another via quantum-mechanical tunnel contacts.
    Type: Grant
    Filed: December 29, 1994
    Date of Patent: July 30, 1996
    Assignee: Siemens Aktiengesellschaft
    Inventors: Thomas Vogelsang, Wolfgang Roesner
  • Patent number: 5536579
    Abstract: A multi-layer electronic circuit package including at least one electrically conductive plane, a first organic polymeric dielectric material having a first optical absorbency to an ablating wavelength of laser light, and a second organic polymeric dielectric material having a second optical absorbency to the ablating wavelength of laser light. The first material dielectric material absorbs wavelengths of light that are not the same as wavelengths of light that are absorbed by the second dielectric material. A first layer of the first or the second organic polymeric materials overlays at least one surface of the at least one electrically conductive plane and a second layer of the other of the first and second organic polymeric materials overlays the first layer.
    Type: Grant
    Filed: June 2, 1994
    Date of Patent: July 16, 1996
    Assignee: International Business Machines Corporation
    Inventors: Charles R. Davis, Frank D. Egitto, Eugene R. Skarvinko
  • Patent number: 5534348
    Abstract: The present invention provides hollow borosilicate microspheres having a mean particle size between 15 and 20 microns, and a true density below 0.25 g/cc. The invention also provides a method for making such microspheres comprising spray drying a solution of sodium silicate and sodium borate in a spray tower to form a precursor, milling the precursor, and heating the crushed precursor to a temperature in excess of 600.degree. F. to form hollow borosilicate microspheres.
    Type: Grant
    Filed: March 28, 1995
    Date of Patent: July 9, 1996
    Assignee: PQ Corporation
    Inventors: J. Stanley Miller, Reginald Thompson
  • Patent number: 5532070
    Abstract: It is to establish a solder precoated conductor circuit substrate capable of conducting the fine pitch mounting and being excellent in the productivity and a technique of producing the same. In the solder precoated conductor circuit substrate, the solder layer formed on the conductor for the connection of electronic component is constituted with Sn thin film layer formed by Cu-Sn substitution reaction based on, for example, the Cu complex formation of thiourea and a Pb-coated Sn layer formed by covering at least a part of Sn crystal grains formed through Sn unhomogeneous reaction based on selective precipitation on Sn with Pb through Sn-Pb substitution reaction based on ionization tendency, in which the solder layer is desirably heated and melted and thereafter cooled to form an alloy layer.
    Type: Grant
    Filed: December 30, 1994
    Date of Patent: July 2, 1996
    Assignee: Ibiden Co., Ltd.
    Inventors: Shinji Takahashi, Toshihisa Tuchiya
  • Patent number: 5529829
    Abstract: The present invention provides metal/polymer composites including a plastic substrate having longitudinally extending conductive members, adapted to make bonded electrical connections to an array of closely spaced conductive terminal pads. In general terms, the metal/polymer composites include a thin, flexible sheet-like plastic substrate having a plurality of longitudinally extending, regularly spaced, metal pathways or members on one major surface thereof.
    Type: Grant
    Filed: February 23, 1995
    Date of Patent: June 25, 1996
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: David C. Koskenmaki, Clyde D. Calhoun
  • Patent number: 5529831
    Abstract: A thin film device comprising a substrate which is magnetic and has insulation property at least on the surface, coils formed spirally in a planar configuration on the substrate, a first interlayer insulation film formed to a portion excepting for the terminal portion of the coils and a magnetic material connection portion of the substrate, a magnetic film and a second interlayer insulation film formed successively on the first interlayer insulation film excepting for the terminal portions, and bump electrodes formed in connection with the terminal portions in which a crystallite material having a composition: Fe.sub.78 Ta.sub.10 C.sub.12 is used as the magnetic film. The thin film device can be formed an a reduced size and having a large inductance value. When the device is used as a noise filter, a cut-off frequency range can be lowered.
    Type: Grant
    Filed: December 2, 1994
    Date of Patent: June 25, 1996
    Assignee: Alps Electric Co., Ltd.
    Inventors: Satoshi Waga, Mitsuo Bitoh, Kazunari Takida, Kenji Shimizu, Kiyoshi Sasai, Yoshihiro Sudoh, Yoshinobu Kakihara
  • Patent number: 5527591
    Abstract: The present invention comprises an electrical contact having solid homogenous conductive particles on the contact surface. The particles are of greater hardness than that of the contact material to deform the contact material and cause breakage or fracture of the oxide or other contaminating layer, or to penetrate the contaminating layer. The particles are applied to the contact surface by a technique which results in the particles being intimately bonded to the contact surface, usually as a layer of particles. A preferable technique for such particle application is hypervelocity oxygen fuel spraying (HVOF) or plasma spraying, by which the particles are embedded on the contact surfaces to provide a substantially permanent interparticle bond between the applied particles and the contact material.
    Type: Grant
    Filed: December 2, 1994
    Date of Patent: June 18, 1996
    Assignee: Augat Inc.
    Inventors: David R. Crotzer, Gregory E. Dean
  • Patent number: 5527604
    Abstract: A metal base board comprising a metal plate, a circuit conductor section, and an insulating layer provided between the circuit conductor and the metal plate wherein the insulating layer comprises an organic insulating material with flaky inorganic fillers added therein and the flaky inorganic fillers are stacked in the insulating layer in a stratified state.
    Type: Grant
    Filed: March 23, 1995
    Date of Patent: June 18, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Satoru Hayashi
  • Patent number: 5525430
    Abstract: An optical shutter which responds to temperature may be caused to respond to an electrical current by placing a transparent conductor of electricity parallel to and in thermal contact with it, and by running an electrical current through the transparent conductor, such that the transparent conductor is resistively heated, and thereby heats the optical shutter. The above transparent conductor may be used simultaneously as a component of a transparent insulation. The electrical current may be controlled by a photosensor, a temperature sensor, a thermostat, and/or a manual switch.
    Type: Grant
    Filed: October 18, 1993
    Date of Patent: June 11, 1996
    Inventor: Day Chahroudi
  • Patent number: 5525401
    Abstract: A vehicle window comprising a relatively thin sheet of clear plastic material having opposed surfaces, an electrically operable defrosting grid adhered to one surface of the relatively thin sheet, and a relatively thick substrate layer of clear plastic material having opposed surfaces curved into a vehicle window configuration.
    Type: Grant
    Filed: October 24, 1994
    Date of Patent: June 11, 1996
    Assignee: Decoma International Inc.
    Inventor: Gerhard Hirmer
  • Patent number: 5525402
    Abstract: The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming layer; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
    Type: Grant
    Filed: February 24, 1995
    Date of Patent: June 11, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshifumi Nakamura, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Minehiro Itagaki, Kazuhiro Miura
  • Patent number: 5523174
    Abstract: Printed circuit board having excellent peel strength and conductance resistance is provided with a substrate, a resin insulating layer formed thereon and roughened at its surface, and a conductor formed thereon, in which at least a portion of the conductor is composed of an eutectic metal layer.
    Type: Grant
    Filed: April 10, 1995
    Date of Patent: June 4, 1996
    Assignee: Ibiden Co., Ltd.
    Inventor: Masanori Tamaki
  • Patent number: 5520986
    Abstract: A non photographic method for making patterns in organic films comprising the sequential step:a) applying in predetermined pattern an imaging layer comprising an agent which is capable of changing the solubility of a solid organic polymer in at least one unpatterned layer laying in contact with solid imaging layer to form the compiled body on a substrate by screen printing with a screen having a plurality of apertures of polygon of which each side is recessed,b) drying the unpatterned layer fully or partially at a predetermined temperature to diffuse said solubility change agent from the imaging layer to the unpatterned dielectric layer(s) andc) removing the patterned imaging layer and the diffusion patterned areas of the unpatterned layer(s) which are both soluble in a predetermined eluant, by washing said compiled body with the predetermined eluant.
    Type: Grant
    Filed: December 27, 1994
    Date of Patent: May 28, 1996
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Carl B. Wang
  • Patent number: 5520976
    Abstract: The present invention contemplates a significant departure from known shielded enclosure designs by providing an enclosure for electronic modules, comprising walls made of composite material including conductive fibers for shielding the enclosure interior from electromagnetic radiation, and means for securely mounting at least one module inside the enclosure with a fastener means, the mounting means comprising composite material. The present invention further contemplates methods for making shielded enclosures and card guides for such enclosures that represent a significant improvement over known enclosure designs. This invention contemplates composite cold walls and composite fins. These composite fins and cold walls may be used alone or together in structures and enclosures which are useful in conducting heat.
    Type: Grant
    Filed: June 16, 1994
    Date of Patent: May 28, 1996
    Assignee: Simmonds Precision Products Inc.
    Inventors: William B. Giannetti, David G. Hess, Stuart J. McCord, Robert E. Rudd, III, Wei-Tei Shih
  • Patent number: 5514451
    Abstract: Conductive via fill inks for green tapes to be stacked and bonded to a support substrate, the glass used for the green tape having a firing temperature from 850.degree.-950.degree. C., wherein the glass used for the via fill ink has a glass transition temperature that is higher than that of the glass used to make the green tape, preferably does not crystallize at the maximum firing temperature of the green tape and comprises from 30-75 percent by volume of the glass-conductive metal powder mixture of the via fill ink. These conductive via fill inks will not shrink until the green tape shrinkage has commenced during firing of the composite circuit board and they will flow slightly during firing, forming good bonds to the glass in the walls of the vias, thereby ensuring good integrity of the vias and good connections to the circuitry on the fired ceramic multilayer circuit board.
    Type: Grant
    Filed: January 27, 1995
    Date of Patent: May 7, 1996
    Assignee: David Sarnoff Research Center, Inc.
    Inventors: Ananda H. Kumar, Barry J. Thaler, Ashok N. Prabhu, Ellen S. Tormey
  • Patent number: 5512360
    Abstract: The present invention relates to a fluoropolymeric substrate that is formed from at least one layer of porous, expanded polytetrafluoroethylene having a void volume of at least 50% and containing 15 to at most 40% by weight adhesive that is evenly distributed within the substrate to allow exterior surfaces of said substrate to be free of adhesive after bonding while forming a discontinuous internal layer of adhesive interrupted by the skeletal structure of the substrate.
    Type: Grant
    Filed: September 20, 1994
    Date of Patent: April 30, 1996
    Assignee: W. L. Gore & Associates, Inc.
    Inventor: David R. King
  • Patent number: 5512353
    Abstract: The ceramic substrate for electronic circuit of the present invention comprises a ceramic layer and a conductive layer which is patterned on the ceramic layer, wherein the conductive layer comprises copper or an alloy containing copper as its main component. The ceramic layer entirely comprises a complex oxide or an oxide solid solution containing copper element and at least one component excluding copper element. Moreover, the ceramic layer is insulated.
    Type: Grant
    Filed: June 20, 1994
    Date of Patent: April 30, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoichiro Yokotani, Hamae Ando, Koichi Kugimiya
  • Patent number: 5510199
    Abstract: A photocopy-resistant document which has a background pattern or logo which is printed with solvent-sensitive, dye based ink and a method of making such a document. The presence of this photocopy-resistant background pattern or logo makes it impossible for a would-be forger of a face-value note such as a bank check to duplicate the original document as a color photocopy. It also makes it impossible for a printing plate to be made based on a photocopy of the document. Besides being photocopy-resistant, the indicia printed with the solvent-sensitive ink are washed away when acetone or bleach solvent is applied to the surface of the document. A fluorescence material can also be added to the solvent-sensitive ink to make the indicia printed with the ink fluorescent under black light.
    Type: Grant
    Filed: June 6, 1994
    Date of Patent: April 23, 1996
    Assignee: Clarke American Checks, Inc.
    Inventor: J. Philip Martin