Abstract: A fire-resistant plenum-type electrical cable is provided that is insulated with an inner layer of a fluorocarbon containing polymer in contact with a surrounding electrical conductor, and an outer layer of abrasion-resistant polyvinyl chloride surrounding the inner fluorocarbon containing polymer layer. The inner layer of fluorocarbon containing polymer may be foamed.
Abstract: A structural laminate of rigid layers separated by very thin layers of vius fluid. The viscous fluid adheres to the confronting surfaces of adjacent rigid layers and is maintained in layered alignment within the laminate to ordinarily prevent flexural vibration and provide vibration overdampening to cope with flexural deforming forces.
Type:
Grant
Filed:
September 4, 1990
Date of Patent:
October 24, 1995
Assignee:
The United States of America as represented by the Secretary of the Navy
Inventors:
Lawrence T. Kabacoff, Chak-Pan Wong, Arthur E. Clark
Abstract: Metal/polymer laminates prepared from essentially insoluble anionomeric polymer film layer with catalytic metal, e.g. palladium, exchanged into surface acid groups which can be reduced to provide catalytic metal clusters for catalyzing electroless deposition of metal which is resistant to removal by adhesive tape. Anionomeric polymer films are coated from solutions, emulsions or dispersions of sulfonated or carboxylated polyesters or sulfonated, phosphonated or carboxylated perfluorocarbon polymer, dried and heat treated, e.g. at 120.degree.-180.degree. C., to render the coating insoluble.
Abstract: A microwave magnetic material body for use in a microwave non-reciprocal circuit element, is constructed by sintering a laminated body obtained by laminating a plurality of magnetic sheets.
Abstract: A method of producing a dielectric ceramic composition is disclosed which includes the steps of: preparing a main ceramic composition comprising BaO, TiO.sub.2 and RE.sub.2 O.sub.3 (where RE represents at least one rare earth metal) as major components; calcining a mixture of starting materials which give the main ceramic composition, at a temperature of 1050.degree. C. or higher, to provide a calcined mixture; finely pulverizing the calcined mixture to provide a calcined ceramic powder having an average grain size of not larger than 0.8 .mu.m; and adding, as at least a part of a secondary component, a B.sub.2 O.sub.3 powder or a glass powder containing B.sub.2 O.sub.3, to the main ceramic composition. Also disclosed are a dielectric resonator and dielectric filter using such a dielectric ceramic composition as produced according to the above method, and a method of producing such a dielectric resonator or filter.
Abstract: A sintered ceramic composite comprising 35 to 80 wt. % of aluminum nitride, 2 to 60 wt. % of boron nitride, 0.1 to 25 wt. % of an oxide of magnesium, 0.5 to 20 wt. % of at least one of rare earth oxides including yttrium oxide as an optional component and 25 wt. % or less of aluminum oxide as an optional component is disclosed.
Abstract: An electromagnetic wave reflection-preventing material having a structure formed by successively laminating (A) an electromagnetic have reflecting metallic material layer, if needed, (B) a substrate layer, (C) a resin layer containing a powder of at least one selected from ferrite, carbon, metal powder and an electrically conductive metallic oxide, and, if needed, a good dielectric material, if needed, (D) a supporting film layer, and (E) a pattern coating layer prepared in the form of a geometrical pattern, containing a metal powder and having a volume resistivity of 10.sup.-3 to 10.sup.10 .OMEGA..multidot.
Abstract: An electromagnetic wave reflection-preventing material having a structure formed by successively laminating (A) an electromagnetic wave reflecting material layer, if needed, (B) a supporting layer, (C) a resin layer, if needed, (D) a supporting layer, and (E) a metallic pattern layer prepared by arranging at least one of a pattern unit comprising a geometrical pattern formed by use of a continuous metallic band, or comprising a multi-figured structure formed by combining a plurality of band-shaped metallic figures so as not to contact with each other; and an electromagnetic wave reflection-preventing method by use of the electromagnetic wave reflection-preventing material.
Abstract: A composite electronic part includes a dielectric ceramic portion consisting of a Pb group dielectric material. Inside the dielectric ceramic portion, an internal electrode constituting a portion of a capacitor is formed. The dielectric ceramic portion is bonded to a magnetic ceramic portion consisting of a Ni--Zn group ferrite material by an intermediate layer consisting of a ceramic material containing Pb, Ni, Fe and Nb as main components. Inside the magnetic ceramic portion, an internal electrode constituting a portion of an inductor is formed. Furthermore, at end portions of the dielectric ceramic portion, intermediate layer and magnetic ceramic portion, a plurality of external electrodes consisting of, for example, Ag are formed, and connected to the predetermined internal electrodes.
Abstract: Heating tiles have electrical resistance wires on their under surfaces which are covered with a non-conducting sheet, adjacent tiles being physically and electrically connected to provide any chosen area for heating such as the bottom of a bird cage, kennel or for heating blankets.
Abstract: A multipolar electrode lead, of the type used to deliver electrical energy in vivo to tissue as part of a system for medical electrotherapy, contains at least first and second conductors, with at least the first conductor being provided with an insulating coating which electrically separates the conductors from each other. The risk of the insulating coating being worn off and a short-circuit developing are reduced by forming the insulating coating of a material having a high electrical resistance and a resistance to abrasion.
Type:
Grant
Filed:
August 12, 1993
Date of Patent:
August 29, 1995
Assignee:
Siemens Aktiengesellschaft
Inventors:
Ulf Lindegren, Helmut Freller, Peter Lorenz
Abstract: A composite flexible substrate (100) is constituted with an inside flexible substrate (1) and an outside flexible substrate (2) having a zigzag-shaped part (Z.sub.1), and the outside flexible substrate (2) is superposed on the inside flexible substrate (1) and is fixed at both end parts of the inside flexible substrate (1) and the outside flexible substrate (2). When the inside flexible substrate (1) is longitudinally bent, the outside flexible substrate (2) is deformed due to stretching of the zigzag-shaped part (Z.sub.1) without irregularly deforming the inside flexible substrate.
Type:
Grant
Filed:
January 21, 1994
Date of Patent:
August 29, 1995
Assignee:
Matsushita Electric Industrial Co., Ltd.
Abstract: Interconnect or metallization structures for integrated circuits on semiconductor chips contain blocked conductor segments to limit atomic transport from one segment to another thus minimizing stress migration and electromigration damage. Since the blocked conductor segments prevent atomic transport between two neighboring segments, the total amount of atoms and vacancies available for hillock and void growth in a segment can be controlled by the length of the segment. The conductor segments are made of high electrical conductance metals, such as aluminum, copper or gold based alloys, and are separated by very short segments of a high melting temperature refractory metal or alloy. Because of their high melting temperatures, refractory metals or alloys suppress atomic transport. The interconnect structures can be fabricated by conventional lithographic and deposition techniques.
Type:
Grant
Filed:
March 11, 1994
Date of Patent:
August 8, 1995
Assignee:
Cornell Research Goundation, Inc.
Inventors:
Che-Yu Li, Peter Borgesen, Matt A. Korhonen
Abstract: In a ceramic multi-layer wiring board, a surface conductor layer is made of a copper-based material and an inner conductor in the ceramic multilayer is a non-copper metal having a melting point higher than a temperature at which the ceramic multilayer is fired, typically Ag. Cu and Ag form eutectic crystals when firing the surface conductor layer of Cu. This can be prevented by connecting the surface conductor layer and the inner conductor with Ag-Pd or a metal which is different from the materials of the surface wiring layer and the inner conductor and which does not form eutectic crystals with the material of the surface wiring layer at the temperature at which the surface wiring layer is fired.
Abstract: The invention relates to a parking card to operate a barrier for pay parking. To create a parking card which is of simple and robust construction the parking card has a peripheral border region with a radially outwardly tapering thickness.
Abstract: An anti-counterfeit latent image formation object for bills, bank notes, urity papers, credit cards, passports, valuable printing matters, and the like comprising a main body, a plurality projections and recesses means formed on the main body in such a manner as to exhibit various kinds of patterns, in which the various kinds of patterns comprise straight image lines forming a pattern, a relief pattern, or a combination of the pattern and the relief pattern; a plurality of straight lines printed on an upper surface of the projections and recesses at predetermined spaces, the straight lines being printed in different colors from that of the main body itself. The patterns consisting of letters, figures, etc. can be visually recognized only when the anti-counterfeit latent image formation object is viewed from an adequate angle. A method for making the anti-counterfeit latent image formation object is also disclosed.
Type:
Grant
Filed:
May 18, 1993
Date of Patent:
August 1, 1995
Assignee:
Director-General, Printing Bureau, Ministry of Finance, Japan
Abstract: The present invention provides a copper-clad laminate characterized in that an electrolytic copper foil on the glossy surface side of which a copper electrodeposit is formed, is bonded at its glossy surface side to one side or each of both sides of a substrate, which has a fine-pitch wiring (circuit) pattern and exhibits a high etching factor. The present invention further provides a copper-clad laminate which can be suitably employed in the production of such a printed wiring board.
Abstract: Flexible printed circuits comprising cobalt circuitry electrolessly deposited on an activated ink coating prepared by heating a wet ink comprising a polymer, e.g. a vinyl polymer such as polyvinyl chloride or polyvinyl alcohol or an unsaturated polymer such as polybutadiene, and a Group 1B or 8 compound, e.g. palladium dichloride, which is adapted to drying at room temperature to a catalytically inert ink. Selective areas of the ink activated by application of heat or light are catalytic to electroless deposition of cobalt.
Type:
Grant
Filed:
July 8, 1994
Date of Patent:
August 1, 1995
Assignee:
Monsanto Company
Inventors:
Albert W. Morgan, James P. Brozek, James D. Capistran, Michael T. O'Connor, Jr.
Abstract: A compact and lightweight filter assembly for mounting on electronic equipment enclosures which provides EMI shielding and passage of air to the enclosure.
Abstract: A new composition and methods for densifying a refractory oxide coating. The new composition includes two substituents. The first substituent is the reaction mixture produced by combining 80% formic acid and saturated aqueous chromic acid. The second substituent includes either phosphoric acid or monoaluminum phosphate. The proportions of the first substituent:second substituent vary from about 5:9 (weight:weight) to about 3:2 (weight:weight). A refractory oxide coating may be densified by first applying the new composition to the refractory oxide coating, then heating to a temperature of at least about 450.degree. F., followed by cooling. A refractory oxide coating may be further densified by repeating this process one or more additional times. Alternatively, the first and second substituents may be sequentially applied to the refractory oxide coating before heating and cooling operations.