Abstract: In a process known per se for producing base materials copper-clad on at least one side, in which a winding core carrying a copper foil is wound with a reinforcing fiber, the laid fibers are impregnated with a solvent-free resin and the resin is cured fully to reach the C-stage, it is proposed to use, as the resin, a solvent-free epoxy-isocyanurate resin having a viscosity at processing temperature of less than 1000 mPa.s and an NCO content of more than 20%.

Abstract: This invention relates to a resistive heating device. In particular, it relates to an exhaust gas apparatus useful for achieving early light-off of catalytic converters comprising a cellular substrate having a layer of conductive material formed thereon and means for activating the device by passing electric current or by exposing the device to an electromagnetic energy field.

Abstract: A method for electroplating over a nonconducting substrate comprising the steps of applying a thin film of a non-metallic conductive coating having a surface resistivity not exceeding 100 megaohms over said substrate, applying an electrically nonconductive coating over said conductive coating, said nonconductive coating having imaged recesses therein and electroplating metal into said recesses. The method is particularly useful for the manufacture of printed circuit boards.

Abstract: A surface-treated metal sheet which excels in workability, electrical conductivity and corrosion resistance has a metal sheet which has been plated as required, a chromate layer as a first layer formed on at least one side of the metal sheet, with a deposition amount of about 5 to 200 mg/m.sup.2 as calculated on the basis of Cr, and a second layer formed on the first layer from organic lubricant particles, with a deposition amount of from about 5 to 1000 mg/m.sup.2, such that the area coated by the organic lubricant particles to the entire area of the metal sheet surface is below about 50%. The second layer is preferably applied with a roll coater, a spin coater or a dip coater, a dispersion liquid or an emulsion containing about 0.1 to 40 wt. % of the organic lubricant particles so as to provide a wet film thickness of about 0.2 to 10 .mu.m.

Abstract: The temperature adjustable coating and medium and method for providing an electrically-resistant temperature-adjustable article and structure. The coating provides a continuous electrically-conductive electrically-resistive path for the application of electrical current to the coating. The electrically-resistant temperature-adjustable article consists of a surface on which a high-temperature conductive-resistive coating is bound. The surface temperature of the article along the path is thereby adjustable between ambient and 2000.degree. F. in response to electric current applied to it without oxidization destroying the electrical conductivity of the medium in temperatures above 600.degree. F. The medium possesses the high-temperature conductive-resistive quality of the coating while maintaining a clay consistency capable of being formed into various shapes without a substrate.

Abstract: An adhesive sheet material for use comprises a backing layer which has upon at least a portion of one surface a pressure sensitive adhesive layer. A removable release liner covers the adhesive layer and a support layer is attached to the backing layer on the surface remote from the pressure sensitive adhesive layer. The stripping load required to separate the release liner from the adhesive layer is greater than the stripping load required to separate the support layer from the backing layer. As the release liner is stiffer than the support layer then the release liner can be removed from the adhesive without disturbing the support layer. The support layer is conformable enough to remain attached to the sheet when adhered to the skin. Adhesive sheets in the form of ostomy flanges and IV dressings are described.

Abstract: An interlayer dielectric structure for microelectronic devices having multiple conducting layers provides a planarized surface for deposition of subsequent layers and further prevents cracking of spin-on-glass by limiting spin-on-glass thickness to about 0.4 .mu.m or less. A first dielectric layer is formed over a first conducting layer by means of reacting Si(OC.sub.2 H.sub.5).sub.4 and O.sub.2 at approximately 9 torr between 370.degree. C. to 400.degree. C., and a second dielectric layer is formed over the first dielectric layer by a method different than that used to form the first dielectric layer. After etching back the second dielectric layer, a spin-on-glass layer is formed. Spin-on-glass layer is etched back to provide a planar surface and a third dielectric-layer is formed over the spin-on-glass layer. The resulting surface is ready for contact hole formation, deposition and patterning of subsequent conductive and insulating layers.

Abstract: The uppermost, porous layer consists of a filler material free plastic material, of which the particles are melted together at their mutual contact areas. This forms capillaries, through which the coloring material is transported downwards. A receiving layer for the respective color material, which penetrates thereinto capillarily by diffusion, is located under the porous upper layer. These two layers lie on a supporting layer.Because during a printing the coloring material is transported capillarily through the uppermost layer to the middle layer, an immediate drying at the surface of the record carrier occurs. A lateral spreading, i.e. running of the coloring material, does not occur. Thus no smudged areas are formed and the pictures are of an excellent brilliancy.

Abstract: A microelectronic device containing one or more dies bonded to a substrate 0.5-8 mil thick thermoplastic adhesive film is disclosed. The adhesive's main constituent is a thermoplastic organic high polymer containing the elements of carbon and hydrogen, and one or more of the elements oxygen, nitrogen, sulfur, halogen in its repeating unit. The polymer's Vicat softening temperature is 30.degree.280.degree. C., preferably 70.degree.-230.degree. C. The adhesive may also contain up to 45 volume percent of a thermally conductive inorganic filler of 0.5-20 micrometer particle size. The attachment process simply consists of heating and pressing the film, sandwiched between the adherent surfaces, above the melting temperature and cooling to ambient.

Abstract: A multilayer printed circuit board reducing cross-talk noise between signal interconnection layers and between through-holes for connecting the signal interconnection layers is disclosed. The multilayer printed circuit board has printed substrates each formed thereon an interconnection layer, and prepreg sandwiched therebetween. The prepreg comprises an reinforcement lattice cloth formed of rovings of a electroconductive material maintained at a ground potential and a dielectric resin impregnated thereinto and forming a dielectric solid layer having through-holes penetrating therethrough. The electroconductive reinforcement lattice cloth functions as a ground layer between signal interconnection layers and between through-holes . The rovings may be of a metal or a semiconductive material such as carbon fiber. The multilayer printed circuit board is superior in heat resistance, dimensional stability and mechanical strength.

Abstract: A photolithography test structure is provided for measuring the amount of notching associated with photolithography processing. The test structure includes a curved insulating structure placed in close spaced proximity with a conductive, interconnect structure. A pair of conductive pads are deposited at opposite ends of the interconnect structure for measuring the resistance through the interconnect. Depending upon the amount of notching associated with the interconnect, resistance readings will vary. Test areas containing notched interconnect can be compared with controlled areas specifically designed not to have notching in order to determine relative changes in resistance, and to correlate that resistance with notching magnitude. The insulating structure, interconnect structure and conductive pads are processed upon the same substrate material containing the resulting product requiring testing.

Abstract: An improvement to a vibration-damping structural component of the type hag viscoelastic material sandwiched between two outer structural layers of stiffness material is disclosed. An inner layer of stiffness material having two predominant surfaces is positioned between the two outer structural layers of stiffness material and is fixed along an edge of one of the two predominant surfaces to one of the two outer structural layers of stiffness material along a line thereon corresponding to a nodal line of vibration. The remainder of the two predominant surfaces is fixed to the viscoelastic material. During flexural vibrations, the inner layer displaces in-plane with respect to the inner surfaces of the outer layers, causing greater shearing in the viscoelastic material, and therefore causing greater vibration damping in the structural component.

Abstract: A tape carrier for semiconductor apparatus and a method of manufacturing the tape carrier includes three or more layers and contact holes of small size. A peelable agent is applied to a planar substrate made of glass or the like, and plural insulating layers and plural conductive layers are alternatingly formed thereon in predetermined patterns. The peelable agent is then removed to peel the tape carrier from the substrate. The tape carrier includes the insulating layers and the conductive layers and has projection electrodes but no tape base.

Abstract: A thin film circuit board has an insulator layer and a conductor layer embedded in the insulator layer and supported in an undercut state by an insulator. The entire conductor layer, excluding the portion supported by the insulator, is surrounded by an insulator having a relatively low dielectric constant which in turn is surrounded by an insulator having a relatively high dielectric constant. The insulator portion that supports the conductor layer in the undercut state has a relatively high etching rate and is formed in a desired thickness on an insulator layer having a relatively low etching rate.

Abstract: A printed circuit board and method of manufacture thereof is disclosed. The printed circuit board includes a first substrate provided from a conductive layer having disposed on a first surface thereof a cured adhesive layer. A semi-cured adhesive layer is then disposed over the cured adhesive layer and a second substrate is disposed against the semi-cured adhesive layer.

Abstract: A ceramic substrate is described consisting essentially of a crystallized glass and having at least one throught-hole filled with a conductor material having 100 parts by weight of copper and form 1 to 30 parts by weight of a glass having a softening point of 1,000.degree. C. or less and a thermal expansion coefficient of from 1.5.times.10.sup.-6 /K to 4.0.times.10.sup.-6 /K as measured in a temperature range of from room temperature to 400.degree. C.

Abstract: A package comprising a central tube, a product wound around the central tube and a perforated film having tube holes prepunched into the film is disclosed. This perforated prepunched tube hold film allows for substantially all of the product exposed surface to be covered by the perforated film but leaves the central tube ends uncovered.

Abstract: Adhesive agent for substrate of electroless plating characterized in comprising epoxy resin, synthetic rubber, and phenolic resin as main components, a hardener of the epoxy resin, inorganic filler having hydroxyl group, and solvent.The adhesive agent is hardened at relatively low temperature (about 150.degree. C.) in short period (within 30 minutes) without giving warp and distortion to the insulation substrate, and moreover its insulation resistance after hardening is high.The adhesive agent is preferable as an adhesive agent for a printed circuit board.

Abstract: A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.

Abstract: A novel multilayered sleeve-like printing blanket is mountable on gapless cylinders or tubular blanket carriers, thereby minimizing vibration when operated at high rotational speeds. An exemplary printing blanket comprises a seamless outer printing surface layer; at least one reinforced elastomer layer, the elastomer layer being reinforced by fibers substantially parallel with the inward and outward sides of the cylindrical tube defined by the reinforced elastomer layer; and a resiliently compressible layer. The oriented fibers reinforce the elastomer layer such that the modulus of elasticity in the circumferential direction of rotation is increased. Exemplary methods for forming one or more of the layers are also disclosed herein.