Patents Examined by Kamand Cuneo
  • Patent number: 7309997
    Abstract: A monitor system and method for characterizing semiconductor processes including ion implantation processes is provided. The system includes a test wafer which has a plurality of sensors formed on its surface. The test wafer may be loaded into the process chamber of a process system and exposed, for example, to an implant. During implantation, electrical signals may be transmitted from the sensor to circuitry external of the chamber to evaluate a variety of ion beam and/or wafer properties. The property data may be displayed in real-time with the implant process so that processing parameters may be adjusted accordingly. The monitor system may be used, in particular, to determine properties related to beam and wafer surface charging which can provide an assessment of the efficiency of beam charge neutralization processes.
    Type: Grant
    Filed: September 15, 2000
    Date of Patent: December 18, 2007
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Svetlana B. Radovanov, Edward Macintosh, Gary Ayers, Philip Corey
  • Patent number: 7242578
    Abstract: A bladed architecture, backplane-based network (100) having N payload slots (108) includes an N/2 slot switch module (102), wherein the N/2 slot switch module is reconfigurable to one of a left-hand slot switch configuration (603) and a right-hand slot switch configuration (605), and wherein the N/2 slot switch module is coupled to N/2 of the N payload slots such that the bladed architecture, backplane-based network is in a sub-optimal configuration (601).
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: July 10, 2007
    Assignee: Motorola, Inc.
    Inventors: Douglas L. Sandy, Mark S. Lanus, Robert C. Tufford
  • Patent number: 7230834
    Abstract: Electronic equipment comprises a main body, a front panel and a recording medium receiving unit. The front panel is provided movably between an opened position and a closed position on a front side of the main body. A card-type recording medium is to be loaded or unloaded into or from the recording medium receiving unit. The recording medium receiving unit is concealed and inaccessible in case where the front panel is in the closed position. The recording medium receiving unit is displaced along with movement of the front panel so as to be exposed and accessible when the front panel moves from the closed position to the opened position.
    Type: Grant
    Filed: October 20, 2003
    Date of Patent: June 12, 2007
    Assignee: Pioneer Corporation
    Inventors: Yoshiyuki Kawada, Katsushi Kawasaki, Ken Igarashi, Nobumitsu Kasahara
  • Patent number: 7215602
    Abstract: To realize an analog multifunction timepiece capable of realizing plural movement layouts including a fan shape moving hand train wheel by only changing positions of integrating parts without changing dimensions and shapes of the parts of movements. A movement of a multifunction timepiece is provided with a first train wheel rotational center, a second train wheel rotational center, a third train wheel rotational center and a fourth train wheel rotational center. Calendar information can be displayed by a small hand moving to rotate centering on the first train wheel rotational center and the second train wheel rotational center. Calendar information can be displayed by a small hand moving in a fan shape centering on the third train wheel rotational center and the fourth train wheel rotational center.
    Type: Grant
    Filed: December 8, 2005
    Date of Patent: May 8, 2007
    Assignee: Seiko Instruments Inc.
    Inventors: Kei Hirano, Mamoru Watanabe, Takeshi Tokoro
  • Patent number: 7203071
    Abstract: A component mounting circuit board includes a circuit pattern including a plurality of electrically conductive plates, an inner electrical component electrically connected to the circuit pattern, and a resin molded section made of a resin by way of molding so as to cover the circuit pattern and the inner electrical component. The resin molded section has an opening allowing an outer electrical component located outside the resin molded section to be connected to the circuit pattern through it.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: April 10, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Tatsuya Nakagawa
  • Patent number: 7199312
    Abstract: A weight scale for a extracorporeal pump controller including: a load cell mounted to a support housing; a spring coupled to the load cell to apply a force to the load cell; a scale beam connected to the spring and at a proximal end connected to the support housing, and an overload protection bore having an aperture through which extends said beam and said aperture having at least one edge in a path of said beam, wherein said edge terminates said path and the beam has maximum rated load position in the path before the edge.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: April 3, 2007
    Assignee: CHF Solutions Inc.
    Inventors: John J. O'mahony, Sonny Behan, Andrew J. Halpert, Edward G. Rychlick
  • Patent number: 7200071
    Abstract: Disclosed is a personal organization tool comprising an indicator and an analog display divided into areas representing days of the week to help people organize themselves and remind them of various events or activities. The tool may be used in co-operation with an apparatus for providing information. The tool is particularly useful for people with short-term memory loss who often experience difficulty in keeping track of when they are supposed to do something.
    Type: Grant
    Filed: January 25, 2005
    Date of Patent: April 3, 2007
    Inventor: A. Daniel Brophy
  • Patent number: 7193861
    Abstract: An information-processing device comprises at least one crossbar-board; a plurality of back panels detachably connected electrically and mechanically to different sides of the crossbar-board; and at least one motherboard detachably connected electrically and mechanically to each of the back panels. The crossbar-board has a switching element mounted thereon. The motherboard has an information-processing semiconductor element mounted thereon.
    Type: Grant
    Filed: January 23, 2004
    Date of Patent: March 20, 2007
    Assignee: Fujitsu Limited
    Inventors: Yoshinori Uzuka, Yoshihiro Morita, Koji Hanada, Hajime Murakami, Yasushi Masuda
  • Patent number: 7180753
    Abstract: A dual motion docking apparatus for docking an electronics console to a component board in a chassis is disclosed. The electronics console and the component board lie in the same plane of the chassis, but the electronics console must be mated with the component board at an angle orthogonal to a direction of installation of the electronics console. Aspects of the present invention include a first docking mechanism for slidably inserting the electronics console into a chassis, such that connectors on the electronics console align with connectors on the component board.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: February 20, 2007
    Assignee: International Business Machines Corporation
    Inventors: Brian M. Kerrigan, Karl K. Dittus, Matthew S. Henry, Michael S. Miller
  • Patent number: 7180756
    Abstract: A latch mechanism (1200) comprises a resilient wire (404) supported proximate its first end (412) and second end (414) by a support structure (406). The latch mechanism (1200) also includes one or more hook shaped catches (218) that have cammed outer surfaces (302) and wire engaging openings (304). To engage the latch mechanism (1200) the resilient wire (404) is urged against the cammed outer surfaces (302) bending the resilient wire (404) and allowing the resilient wire to rebound into the wire engaging openings (304). To disengage the latch mechanism the resilient wire (404) is deflected, e.g., by pushing a moveable manual actuator (408) that is engaged with the wire, in order to release the resilient wire (404) from the wire engaging openings (304) of the catches (218).
    Type: Grant
    Filed: June 21, 2004
    Date of Patent: February 20, 2007
    Assignee: Motorola, Inc.
    Inventors: Frank H. Stone, Joseph L. Allore, Anthony J. Richter
  • Patent number: 7177159
    Abstract: A packaging structure of an electronic card includes a metal cover, a plastic frame and a printed circuit board. The metal cover is produced by providing a metal plate having a central portion and an edge portion and performing a draft operation on the metal plate such that the edge portion is vertical to the central portion. The plastic frame has a first surface combined with the metal cover. The printed circuit board is combined with a second surface of the plastic frame.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: February 13, 2007
    Assignee: 3 View Technology Co., Ltd.
    Inventors: Hank Wang, Hung Tse Wang
  • Patent number: 7170753
    Abstract: An interface enhancing apparatus is provided for increasing the potential number of interfaces on the interface panel of a modular platform board. The interface enhancing apparatus may include a first component coupled an interface panel of a modular platform board and second component coupled to the first component. The second component may be substantially parallel with the interface panel when the first component is mated with the interface panel, and the second component may have one or more enhanced interfaces configured for electrical communication with the modular platform board.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: January 30, 2007
    Assignee: Intel Corporation
    Inventor: Edoardo Campini
  • Patent number: 7170155
    Abstract: An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electrically couple an RF switch array of the MEMS die to a printed circuit board (PCB). In one embodiment, the MEMS die includes a trace ring surrounding at least a portion of the RF switch array so that a signal may enter or exit the MEMS RF switch module using the vertical via without crossing the trace ring.
    Type: Grant
    Filed: June 25, 2003
    Date of Patent: January 30, 2007
    Assignee: Intel Corporation
    Inventors: John M. Heck, Tsung-Kuan Allen Chou, Joseph S. Hayden, III
  • Patent number: 7170314
    Abstract: Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.
    Type: Grant
    Filed: February 11, 2005
    Date of Patent: January 30, 2007
    Assignee: Rambus Inc.
    Inventors: Belgacem Haba, Richard E. Perego, David Nguyen, Billy W. Garrett, Jr., Ely Tsern, Crag E. Hampel, Wai-Yeng Yip
  • Patent number: 7167363
    Abstract: An air stream distribution apparatus directs portions of an air stream, at substantially ambient temperatures, to serially arranged circuit board components of a circuit board assembly. The air stream distribution apparatus splits an incoming air stream into air stream portions and directs each air stream portion toward each serially arranged circuit board component. Such direction of the portion of the air stream, by the air stream distribution apparatus, minimizes overheating and failure of the circuit board components. Furthermore, the air stream distribution apparatus minimizes a decrease in the pressure of the air stream as the air stream travels from the air stream source. The air stream distribution apparatus, therefore, ensures that circuit board components located at relatively large distances from the air stream source receive air from the air stream to minimize overheating and potential failure.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: January 23, 2007
    Assignee: Cisco Technology, Inc.
    Inventors: James Cushman, Sridevi Iyengar, Hsing-Sheng Liang
  • Patent number: 7167379
    Abstract: An assembly includes an electronic assembly with a microprocessor coupled to a power conversion assembly via a compliant conductor assembly. The compliant conductor assembly includes a plurality of spring conductors mounted in a carrier. Selected ones of the spring conductors are electromagnetically coupled with others of the spring conductors. Additionally, each spring conductor provides multiple conductive paths.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: January 23, 2007
    Inventors: Joseph T. DiBene, II, Edward J. Derian
  • Patent number: 7167417
    Abstract: A time correction system has a timepiece with pointers for displaying the time, and a correction instruction device. The correction instruction device has a timing section for timing reference time data, a time input section for inputting pointed time data corresponding to the time indicated by the pointers, a comparison section for comparing the reference time data and the pointed time data, and a communication section for outputting a correction instruction signal based on the results of this comparison to the pointer type timepiece. The pointer type timepiece has an external signal detection circuit for receiving the correction instruction signal, a drive control section for controlling the driving of the pointers, and a time correction control circuit for matching the readings of the pointers with the reference time data based on the received correction instruction signal.
    Type: Grant
    Filed: January 7, 2004
    Date of Patent: January 23, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Hidehiro Akahane, Osamu Takahashi
  • Patent number: 7167380
    Abstract: A card cage system is provided that includes a middle card guide interposed between two end card guides in an electronic equipment enclosure. Each of the card guides includes one or more channels adapted to receive a card edge. The middle card guide includes a removable adapter element that, when present in the middle card guide, prevents insertion of double wide, or larger, cards while, at the same time, permitting insertion of two single wide cards in a side-by-side arrangement. When the adapter element is removed, a double-wide card can be received in the middle card guide such that it straddles the middle card guide. The edges of the double-wide card are received in the first and second end card guides. Thus, the card guide can be readily customized to accommodate a variety of card types and sizes, in various arrangements.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: January 23, 2007
    Assignee: Finisar Corporation
    Inventor: Donald A. Ice
  • Patent number: 7164588
    Abstract: A printed circuit board (PCB) holder having a pair of spaced apart frames with captivating mechanisms for supporting one or more PCBs independent of the number and geometry of the PCBs. Each frame is defined by a ridge member surrounding the periphery of the frame and the ridge member has at least one captivating mechanism to engage a portion of at least one PCB. One frame holds one end of a PCB and the other frame holds the opposite end of the PCB.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: January 16, 2007
    Assignee: Leviton Manufacturing Co., Inc.
    Inventors: Danilo F. Estanislao, Paul Soccoli
  • Patent number: 7161812
    Abstract: A surface mount grid array implemented on a PCB (printed circuit board) optimized for trace escape routing for the PCB. The surface mount grid array includes a plurality of connection blocks, with each connection block including an array of pins and an array of vias, wherein the pins and vias are configured to communicatively connect an integrated circuit device to a plurality of traces of the PCB. The connection blocks are disposed in a tiled arrangement, wherein the connection blocks implement a plurality of trace escape channels along connection block boundaries. The trace escape channels are configured for routing traces from inner pins of the surface mount grid array to a periphery of the surface mount grid array.
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: January 9, 2007
    Assignee: Nvidia Corporation
    Inventor: Simon A. Thomas