Patents Examined by Kamand Cuneo
  • Patent number: 7158382
    Abstract: An uninterruptible power supply (UPS) socket of the present invention consists of a front panel, an upper cover, a socket member, a wiring insulation plate, a battery set, a print circuit board assembly, a detachable lower cover, a power cord lead and several components. The upper and lower covers are connected via several electric conductive wires, and said print circuit board assembly contains a power circuit board, a control circuit board and a surge protection circuit board.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: January 2, 2007
    Assignee: Powercom Co., Ltd.
    Inventors: Ying-Yi Fan, Mou-Tang Lian
  • Patent number: 7157647
    Abstract: A circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open segments, e.g., during a lamination process which bonds two dielectric layers of the substrate to the conductive layer. A method of making the substrate, an electrical assembly utilizing the substrate, a multilayered circuitized assembly also utilizing the substrate and an information handling system, e.g., a mainframe computer, are also provided.
    Type: Grant
    Filed: July 2, 2004
    Date of Patent: January 2, 2007
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: John M. Lauffer, James M. Larnerd, Voya R. Markovich
  • Patent number: 7157646
    Abstract: A circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. A method of making the substrate, an electrical assembly utilizing the substrate, a multilayered circuitized assembly also utilizing the substrate and an information handling system, e.g., a mainframe computer, are also provided.
    Type: Grant
    Filed: July 2, 2004
    Date of Patent: January 2, 2007
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: John M. Lauffer, James M. Larnerd, Voya R. Markovich
  • Patent number: 7154814
    Abstract: A digital engine operating time measuring apparatus for an internal combustion engine. The apparatus is powered by a magneto of the engine and accumulates engine operating time only when the engine is operating. The apparatus includes power regulation circuitry including a pair of terminals coupled to the engine magneto. The power regulation circuitry converts a time varying electrical signal generated by the magneto when the engine is operating to a low voltage DC signal. The apparatus further includes digital circuitry coupled to an output of the power regulation circuitry for calculating accumulated engine operating time. The digital circuitry is powered by the low voltage DC signal of the power regulation circuitry and only accumulates engine operating time upon sensing the low voltage DC signal. The apparatus further includes a display coupled to the digital circuitry for displaying accumulated engine operating time as calculated by the digital circuitry.
    Type: Grant
    Filed: May 10, 2004
    Date of Patent: December 26, 2006
    Assignee: Delta Systems, Inc.
    Inventor: David A. Straka
  • Patent number: 7154757
    Abstract: A method and apparatus are disclosed for isolating and attenuating shock and vibration in a disk module that includes media drives that are mounted on a printed circuit board (PCB). The apparatus includes a single printed circuit board (PCB), media drives that are coupled to the PCB, a first reinforcing rail that is attached to the PCB and to a first side of a first one of the media drives, a second reinforcing rail that is attached to the PCB and to a first side of a second one of the media drives, and a locking mechanism for locking the first and second rails together.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: December 26, 2006
    Assignee: Storage Technology Corporation
    Inventors: Eric Grant Pavol, Charles Lee Still, Todd Baxendale, Christopher McArdle
  • Patent number: 7154817
    Abstract: The apparatus includes at least one information storing unit, a unit for processing said information, a management and control unit receiving control signals from the processing unit and a supply unit controlled by said management unit and controlling the movement of said two stepping motors above a dial bearing markings Ri representative of said information. The apparatus is characterized in that said processing unit is provided with an algorithm or correspondence table between a marking Ri and angles ?i?i formed respectively by each hand from a measurement reference and in that the shape of said hands is such that when they have the angular orientations ?i ?i, their elongated parts can intersect above said marking Ri, or their tips can be aligned opposite said marking Ri. The apparatus may be a wristwatch.
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: December 26, 2006
    Assignee: Asulab S.A.
    Inventors: Jean-Jacques Born, Raymond Froidevaux, Gilles Rey-Mermet
  • Patent number: 7152302
    Abstract: A method of producing an electrical connection structure between at least two superconducting lines. The method comprises adding metal powder or alloy powder to a superconducting material comprising magnesium diboride, intervening the superconducting material between at least two superconducting lines, and heating said superconducting lines and said superconducting material to a temperature lower than the melting point of said superconducting material prior to the addition of said metal powder or alloy powder thereto, but higher than the melting point of said metal powder or alloy powder.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: December 26, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Hiroshi Morita, Kazuhide Tanaka, Yasuo Suzuki, Michiya Okada
  • Patent number: 7154048
    Abstract: A common electrode line for plating is used for forming conductive patterns of a plurality of circuit substrates on a main substrate. The main substrate has a cut line for dividing one and the other circuit substrates and a plurality of through holes formed on the one and the other circuit substrates along the cut line. The common electrode lines for plating includes first common electrode lines formed on one side of the main substrate, and second common electrode lines formed on the other side of the main substrate. Each first common electrode line extends from one through hole formed on the one circuit substrate to one through hole formed on the other circuit substrate. Each second common electrode line extends from the one through hole formed on the one circuit substrate to another through hole formed on the other circuit substrate.
    Type: Grant
    Filed: April 4, 2001
    Date of Patent: December 26, 2006
    Assignee: Citizen Watch Co., Ltd.
    Inventors: Masayoshi Kikuchi, Masahiro Ohtahara, Kiyoshi Shimizu
  • Patent number: 7154752
    Abstract: An optical module is inserted into a cage containing a connector electrically connected to a conductive wiring on a host board. The cage, the connector and the conductive wiring is provided on the host board. The optical module includes a circuit board and a housing. The circuit board has a card edge connector at an edge thereof. The card edge connector mates with the connector on the host board. The housing has a conductive ceiling with a rear edge and builds the circuit board therein. The conductive ceiling has a stopper supported thereby and protrudes therefrom. The stopper extrudes from the edge of the circuit board and the rear edge of the conductive ceiling.
    Type: Grant
    Filed: September 5, 2003
    Date of Patent: December 26, 2006
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Shunsuke Sato, Ichiro Tonai, Kazushige Oki, Toshio Mizue
  • Patent number: 7151228
    Abstract: The present invention comprises a plurality of laminating double-side circuit boards and a plurality sheets of prepreg for interlayer connection that are placed one on another. Via holes extend from the circuit on one side of each laminating double-side circuit board to the circuit on the other side thereof. Each via hole is filled with electro-conductive material to connect the circuits on both sides of the laminating double-side circuit board. The pad on a laminating double-side circuit board and the pad on another laminating double-side circuit board are laminated via a sheet of prepreg for interlayer connection so that the respective pads are opposed to each other via the through hole filled with electro-conductive material formed through the sheet of prepreg for interlayer connection. Thereby, the respective pads on the laminating double-side wiring circuit boards are electrically connected with one another.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: December 19, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshihisa Takase, Tsuneshi Nakamura
  • Patent number: 7151676
    Abstract: Open and close of a cover of a recording media holding section is locked and unlocked in accordance with turn-on and turn-off of a power switch. Turn-on and turn-off of the power switch is performed in accordance with an operation of for example a movable grip. When the power switch is turned on, a cover of the recording media is held by the movable grip so as not to be opened.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: December 19, 2006
    Assignee: Fuji Photo Film Co., Ltd.
    Inventor: Shinji Suzuki
  • Patent number: 7151677
    Abstract: An apparatus and method for supporting a circuit board within a computer chassis is disclosed. The apparatus comprises a standoff support mounted in a channel so that the standoff can be positioned along the length of the channel by moving or sliding the standoff within the channel. This movable standoff facilitates the mounting of a variety of circuit boards within the same computer chassis.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: December 19, 2006
    Assignee: Gateway Inc.
    Inventors: Bao G. Le, Derek T. Nguyen, David R. Davis, Allan L. Klink
  • Patent number: 7151673
    Abstract: The invention is directed to a memory card that includes a device connector conforming to the memory card standard, and a host connector conforming to a host connection standard and comprising a retractable shieldless tab compatible with the host connection standard. The presence of the two connectors adds versatility to the memory card. The host connector facilitates direct coupling of the memory card to a computing device without an adapter or reader. The memory card maintains a form factor of the memory card standard when the shieldless tab is retracted, which allows the memory card to be used similar to a conventional memory card of the memory card standard. In order to fit within the memory card standard form factor, the shieldless tab may be an altered version of a conventional connector interface conforming to the host connection standard.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: December 19, 2006
    Assignee: Imation corp.
    Inventors: Trung V. Le, Steven L. Lindblom, Robert W. Tapani
  • Patent number: 7151227
    Abstract: On a surface of a film substrate made of an insulating synthetic resin, which is formed by connecting an approximately quadrangular first film substrate and an approximately quadrangular second film substrate through a bent portion, a ground electrode formed to cover at least a part of the second film substrate, and a first electrode layer formed of one of the wiring patterns on a part of the first film substrate are formed. An insulating film made of an insulating resin is formed on the first electrode layer, a second electrode layer formed of the other of the wiring patterns is formed on a surface corresponding to the part of the first film substrate of the insulating film, and the film substrate, the first electrode layer and the insulating film are bent in the bent portion such that the rear surfaces of the film substrate face each other.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: December 19, 2006
    Assignee: Alps Electric Co., Ltd.
    Inventor: Hiroshi Shigetaka
  • Patent number: 7148428
    Abstract: A system and method are disclosed in which flex cables are affixed to PCBs, for providing high-speed signaling paths between ICs disposed upon the PCBs. The flex cables are fixably attached to the PCBs so as to substantially mimic their structural orientation. Where the configuration includes more than one PCB, the flex cables include multiple portions which are temporarily separable from one another and from the die, using flex-to-flex and flex-to-package connectors, allowing field maintenance of the configuration. By routing the high-speed signals between ICs onto the flex cable, single-layer PCBs can be used for non-critical and power delivery signals, at substantial cost savings. By disposing the flex cables onto the PCB rather than allowing the cables to float freely, the configuration is thermally managed as if the signals were on the PCB and cable routing problems are avoided.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: December 12, 2006
    Assignee: Intel Corporation
    Inventors: Pascal C. H. Meier, Sanjay Dabral
  • Patent number: 7149095
    Abstract: A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the at least one attachment site and electrically connected to at least some of the first and second contacts. The substrate is folded so that the first contacts are accessible at a bottom of a subassembly and the second contacts are accessible at a top of a subassembly. The plurality of subassemblies are stacked one on top of another in a generally vertical configuration. The substrate of at least one of the subassemblies has a plurality of attachment sites and a plurality of microelectronic elements assembled to the attachment sites. The substrate is folded so that at least some of the plurality of microelectronic elements are disposed alongside one another.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: December 12, 2006
    Assignee: Tessera, Inc.
    Inventors: Michael Warner, Philip Damberg, John B. Riley, David Gibson, Young-Gon Kim, Belgacem Haba, Vernon Solberg
  • Patent number: 7148423
    Abstract: A phase split structure of a superconducting cable includes three cable cores each having a shield layer provided around a superconductor, a splitter box housing the three cable cores extending from an assembly portion where the three cable cores are assembled into the cable, in a state in which the cable cores are spaced apart from each other, and a shield connecting portion connecting respective shield layers of the cable cores to each other within the splitter box. The shield connecting portion allows the cable cores to have their respective shield layers connected together with low resistance and each shield layer can pass a current substantially equal in magnitude to that which each superconductor passes. Thus in each shield layer a magnetic field can be formed having a level that can cancel a magnetic field generated from each superconductor. The structure can thus effectively prevent a large magnetic field external to the cable core.
    Type: Grant
    Filed: June 8, 2004
    Date of Patent: December 12, 2006
    Assignees: Sumitomo Electric Industries, Ltd, The Tokyo Electric Power Company Incorporated
    Inventors: Takato Masuda, Hiroyasu Yumura, Yoshihisa Takahashi, Shoichi Honjo, Keisuke Etoh
  • Patent number: 7146731
    Abstract: A magnet assembly connectable to a metal assembly in an engaging fashion, a metal assembly connectable with the magnet assembly in an engaging fashion and a snapping mechanism comprising the magnet assembly and the metal assembly are disclosed, to be used with a strap and a watch case. A leaf spring element and a base element to be used with a watch case are also disclosed, together with manufacturing processes and a system and method to teach the concept of time.
    Type: Grant
    Filed: January 7, 2004
    Date of Patent: December 12, 2006
    Assignee: Disney Enterprises, Inc.
    Inventors: Stephanie Kraus, Chris Heatherly, Randal Ouye, Julie Nishioka, John Holland, Jeffrey Sand
  • Patent number: 7149089
    Abstract: An electrical assembly comprises a lower housing, a circuit board mounted in the lower housing, and an insulator block mounted on an upper surface of the circuit board holding a plurality of terminals that have contact heads extending above the insulator block and connector tails extending below the insulator block and attached to the circuit board. The contact heads extend through a face seal. An upper housing having an integral upstanding shroud is attached to the insulator block and/or the lower housing so that the contact heads are disposed within the shroud and the face seal is compressed between the insulator block and the upper housing. The shroud has an outer periphery and the insulator block has an outer periphery that is spaced inwardly of the outer periphery of the shroud to provide a space beneath the upper housing for attaching electrical and/or electronic components to the circuit board adjacent the insulator block.
    Type: Grant
    Filed: January 14, 2004
    Date of Patent: December 12, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Raymond J. Blasko, Mauro R. Jadue, William G. Flask
  • Patent number: 7145780
    Abstract: A printed circuit board connector engagement apparatus includes a four-bar linkage capable of coupling to an electronics system housing and is configured to accept and enable a printed circuit board to travel in a first direction until a connector on the printed circuit board and a corresponding connector coupled to the housing are aligned. The four-bar linkage further enables the printed circuit board to travel essentially orthogonal to the first direction to engage the printed circuit board and housing connectors.
    Type: Grant
    Filed: April 29, 2004
    Date of Patent: December 5, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Christopher G. Malone, Glenn C. Simon