Abstract: A circuit board holder includes a base portion, and a mounting portion coupled to the base portion. The mounting portion is configured to actuate with a first circuit board when the circuit board holder attaches to the first circuit board. The circuit board holder further includes a capturing portion coupled to the base portion. The capturing portion is configured to capture an edge of a second circuit board when the circuit board holder attaches to the first circuit board and when the second circuit board electrically connects with the first circuit board. Such a holder alleviates the need to consume a large amount of circuit board space on the second circuit board. Furthermore, the use of such a circuit board holder enables the first and second circuit boards to maintain reliable electrical connectivity even when exposed to heavy shock or vibration.

Abstract: Watch movement comprising a housing (26, 28, 30, 32, 34) and a gear train, formed from a series of spindles (36, 38, 40, 42), pivotably mounted on the housing, of which a first of said spindles (42) is provided with a shank (42a), for fixing a first hand (16) and a second of said spindles (50) is provided with a cylinder (50b), arranged co-axially to said shank, for fixing a second hand (20). According to the invention, the second spindle (50) is rotationally mounted on said housing (34) by means of a ball bearing (54).

Abstract: A method for producing a computer-assisted real-time system that includes at least one processing unit. Data exchange between the processing unit and the environment or one or more additional processing units is synchronous or asynchronous. At least one real clock is allocated to the processing unit to correlate data exchange.

Abstract: A multilayer printed circuit board is provided in which microcracks or metallic migration is mitigated when a Resin Fill Plated Through Hole (RFP) is arranged near the edge thereof. The multilayer printed circuit board includes an inner layer having an RFP, outer layers, RFP lands, and conductor layers. The conductor layers are positioned over the RFP lands and the outer edges of the conductor layers extends outward further than the outer edges of the RFP lands. When the multilayer printed circuit board is heated, a stress is generated in and near the RFP. The conductor layers positioned so as to cover the RFP lands, exert a reaction against the stress to suppress generation of microcracks in the multilayer printed circuit board and thereby mitigate metallic migration in the board.

Abstract: An electronic assembly is disclosed. The electronic assembly includes a lower portion and a first elongate trace formed on an upper surface of the lower portion. The trace is covered by an upper portion, and an opening formed through an upper surface of the upper portion extends to the trace to expose a portion of the trace. A second elongate trace is formed on the upper portion. A portion of the second elongate trace positioned in the opening formed through the upper surface of the upper portion contacts the first elongate trace through the opening to form an electrical interconnection between the first trace and the second trace.

Abstract: A substrate supporting a plurality of interconnecting patterns arranged in matrix is cut at a position at least between adjacent columns of the interconnecting patterns. A plurality of positioning marks are formed on the substrate and arranged on a straight line between adjacent columns of the interconnecting patterns. Cutting of the substrate is performed by using the positioning marks as reference.

Abstract: A watch apparatus includes a wristwatch that includes a watch housing with a face, a back side and a peripheral edge. A wristband is attached to the peripheral edge. A bezel is rotatably mounted to the watch housing and extends around the face. A motor is mounted on the peripheral wall of the watch housing. A gear assembly is mechanically coupled to the motor. The motor is adapted for rotating the gear assembly. The gear assembly is in communication with the bezel so that the bezel rotates when the motor is turned on. A processor is electrically coupled to the motor. A heat sensor is mounted on the back side and is electrically coupled to the processor. The processor turns on the motor when the heat sensor detects heat above 80 degrees. The processor turns off the motor when the heat sensor detects a temperature less than 80 degrees.

Abstract: On a motherboard, a first slot for receiving a high-performance component that typically generates higher levels of heat and emissions is mounted next to a second slot for receiving a card that generates relatively lower levels of heat and emissions. The second slot is positioned between the first slot and the central processing unit (CPU) socket on the motherboard. Through this configuration, a CPU can be shielded from the heat and electromagnetic interference generated by with a high-performance component. The first slot can be positioned near the edge of the motherboard, further facilitating heat dissipation and access to the slot. In an embodiment, the first slot is an AGP slot and the second slot is a PCI slot.

Abstract: The printed circuit board comprises a plate made of an insulating material and having opposite surfaces and having a connection strip portion including a grouping of at least three rows of sets of at least three spaced apart connection locations in each set on at least one of said plate surfaces, the centers of the connection locations in each set being spaced from each other by a predetermined distance, groups of conductive strips on one of the plate surfaces, each conductive strips being aligned with and in electrical conductivity with one of the rows of three spaced apart connection locations each connection location defining an electrical contact point on the strip with all of the conductive strips being electrically isolated from each other, and the sets being aligned in each row end-to-end and each row being offset or staggered from each adjacent row, such that an array of spaces is formed, with each space in an interior row forming a center of a diamond shaped four connection point connector, that has

Abstract: A sheet metal cover (11) for a PC card, or electronic card, includes identical top and bottom sheet metal cover parts (13, 12) with opposite sides constructed to allow the cover parts to be joined together by merely pushing the sides of the top cover part forcefully down against the sides of the bottom cover part. One side (23) of each cover part is bent and cut to form a plurality of latching lugs (37), and the other side (24) of each cover part is bent and cut to form a plurality of slots leading to recesses that each receives a lug and then resists movement of the lug out of the recess. Each lug has outer and inner legs (38, 39) that are joined in a fold of less than 90°. The slots each receives a lug only when the inner and outer legs of the lug are deflected closer together.

Abstract: A conductive sash is etched around the periphery of a land grid array interconnection on a carrier for dense integrated circuit connections. If the array comprises more than one module or module chip domain, the conductive sash is also positioned between the modules. The dimensions of the sash are such that it is slightly larger than a frame of an interposer or other electrical connector which is placed upon the array. In this fashion, the interposer or other electrical connector rests upon the sash and provides protection against particulate and gaseous contamination of the array.

Abstract: A server blade is provided which comprises a processor. The server blade additionally comprises an enclosure which encloses the processor. The server blade is configured as a field replaceable unit removably receivable in a carrier of a modular computer system, and is configured as an oversized unit to span more than one standard information processing module receiving location in the carrier.

Abstract: A heat sink clip assembly (1) for attaching a heat sink (5) on a CPU (7) includes a retention frame (10), and a pair of clips (20) pivotally attached to two sides of the retention frame. Each clip includes a main body (21), and a handle (41) pivotally attached to the main body. The main body includes a cross beam (23), and two locking arms (31) respectively depending from opposite ends of the cross beam. Each locking arm defines a locking hole (33) at a distal end. The handle has a cam portion (47) at one end thereof. The clips are pivoted outwardly to make way for the heat sink to seat on the CPU. Then the clips are pivoted upwardly, so that the cross beam is suspended above the heat sink. The handle is pivoted downwardly so that the cam portion presses the heat sink to the CPU.

Abstract: To prevent, in a multilayer wiring board to which a semiconductor chip is flip-chip bonded, occurrence of cracks in the board at portions adjacent to electrode pads due to a difference in thermal expansion coefficient between the semiconductor chip and the board. A multilayer wiring board (20) of the present invention has features that electrode pads (22) corresponding to electrodes of a semiconductor chip (25) located near an outer periphery (29) of the semiconductor chip each have an oblong shape, openings (35) of a solder resist (23) are each smaller than the oblong shape, and the center (B) of the opening is located to be offset from the center (A) of the oblong shape by a distance (L4) in a direction (30) toward the center of the semiconductor chip. Therefore, in the multilayer wiring board of the present invention, thermal stresses applied to portions (L3) of the electrode pads (22) on the board near the outer periphery of the semiconductor chip are relaxed.

Abstract: A time measurement device includes a power generator 2, secondary power source 31, current time counters 922 and 932, receiver circuit 42 for receiving a time standard radio wave, time display means 5 for displaying the current time, power detector 83 for outputting a power detection signal when the power generator 2 is in a power generating state or when a voltage stored in the secondary power source 31 is at a predetermined voltage value, operation mode switcher 874 switching, in response to the power detection signal, between a power saving mode in which time display is suspended and a standard mode in which time display is not suspended. The operation mode switcher 874 causes the time display means 5 to display the current time based on the time information counted by the time counters 922 and 932 and the time information received by the receiver circuit in response to the device being switched from the power saving mode to the standard mode.

Abstract: A modularized circuit board mounting architecture is proposed, which is designed for use to mount a modularized circuit board onto the inside of an enclosure, such as a server's chassis or a desktop computer's casing. The proposed mounting architecture is more advantageous to use that prior art in that the mounting and dismounting of the modularized circuit board to and from the enclosure can be both carried out effortlessly simply by hand without requiring technical personnel or user to use any assisting tools, such as screw drivers. This feature allows computer manufacturers to assembly computer units more quickly and efficiently and thereby significantly reduce labor hours. Moreover, it also allows after-sale maintenance or upgrade to be carried out more quickly and efficiently.

Abstract: Systems and methods for providing a dynamically modular processing unit. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units in an enterprise. In some implementations, a modular processing unit includes a non-peripheral based encasement, a cooling process (e.g., a thermodynamic convection cooling process, a forced air cooling process, and/or a liquid cooling process), an optimized circuit board configuration, optimized processing and memory ratios, and a dynamic back plane that provides increased flexibility and support to peripherals and applications. The modular processing unit is customizable and may be employed in association with all types of computer enterprises. The platform allows for a plethora of modifications that may be made with minimal impact to the dynamically modular unit, thereby enhancing the usefulness of the platform across all type of application.

Abstract: A support structure of a control board has a control board including a plurality of attaching holes disposed at respective corners of an imaginary polygon; a support member for supporting the control board; and a plurality of support bosses disposed on the support member, a plurality of support bosses each having a support portion in contact with one face of the control board, and an engaging portion inserted into the attaching hole and engaged with other face of the control board, wherein each of the engaging portions is formed with a split groove in a shape of a straight line opened at a front end thereof and the respective support bosses are provided at the support member by avoiding the split grooves of the support bosses disposed at two ends of straight lines connecting the corners of the imaginary polygon from being disposed on the same straight lines.

Abstract: An electronic control unit having a flexible circuit board assembly is disclosed. The electronic control unit comprises a flexible circuit board with at least one layer having first and second portions separated by a bendable region. The electronic control unit further comprises a substantially rigid substrate having first and second portions separated by a bend region and inside and outside surfaces. The first and second portions of the circuit board are affixed to respective first and second portions of the substrate. The bend region has one of the group of a recess and aperture extending outwardly from the inside surface of the substrate with the one of the group of the recess and aperture sized to accept the bendable region of the circuit board.

Abstract: An apparatus, such as a reader, adapter, or other device, is described that is capable of receiving at least four different types of memory cards using a single slot. The slot includes a central region having a width to receive a memory card of a first type, first outer regions that extend the width of the central region to a second width to receive a memory card selected from a second type of memory card or a third type of memory card, and second outer regions that extend the width of the central region to a third width to receive a memory card of a fourth type. A plurality of electrically conductive contact areas are disposed within the slot. The apparatus may receive, for example, any of a Smart Media flash memory card, Memory Stick flash memory card, Secure Digital flash memory card, or MultiMedia flash memory card.