Abstract: A method and system to form a refractory metal layer on a substrate features nucleating a substrate using sequential deposition techniques in which the substrate is serially exposed to first and second reactive gases followed by forming a layer, employing vapor deposition, to subject the nucleation layer to a bulk deposition of a compound contained in one of the first and second reactive gases.

Abstract: A card guide is provided that is suitable for use in connection with a card cage system of an electronic equipment enclosure. The card guide includes one or more engagement elements configured to interact with corresponding structure of the chassis of the electronic equipment enclosure so that the card guide lacks any degree of freedom when the card guide is positioned within a fully assembled electronic equipment enclosure. At least one of the engagement elements is configured and arranged to enage the corresponding structure of the chassis in a permanent snap-fit type arrangement.

Abstract: An appliance circuitry housing is designed so a circuit board can be attached directly to the housing interior with circuit board electric terminals being accessible from the housing exterior. An integral door on the housing exterior can be pivoted to a closed position over the electric terminals and connected plugs. A plurality of housing legs with slots engage in openings in the appliance to secure the housing to the appliance. A resilient latch on the housing exterior holds the housing in its attached position to the appliance.

Abstract: In an analog electrical timepiece with a motor coil, when an external operating member is in a prescribed operating condition, the operating mode of the analog electrical timepiece is set to the data receive mode. Next, the analog timepiece generates a synchronization signal which is in synchronized to an external synchronization signal that is input from outside. Then, the analog electrical timepiece, when the operating mode is the data receive mode by the detection circuit, based on a synchronization signal and a data voltage signal that is a voltage signal induced around the motor coil by a data signal input from outside, generates and outputs a receive data.

Abstract: A fuse box for a vehicle contains a base box having a housing in which a first bus bar with a battery connection terminal is disposed. The fuse box is configured according to a modular system. For this purpose, the housing is provided for the attachment of an extension box. The extension box preferably has a second bus bar that is placed in contact with the first bus bar. As a result of the modular system with the extension box, it is possible, for example, to allow for extensions in a vehicle on-board power system with little expenditure in respect of the fuse box.

Abstract: An electromagnetic shielding structure has conductive parts for blocking propagation of electromagnetic interference, whereof at least one has an appendage or an edge configuration that is shaped so as to bite into the edge of the other of the conductive parts, such as along a narrowing groove. The appendage or edge can have a structure resembling an insulation displacement connector, but is arranged to engage the edge of a sheet-like or planar shielding element, as opposed to biting into an insulated wire. The connection achieves both electrical and mechanical connection between the parts, preferably thereby completing at least part of a shielding enclosure.

Abstract: An easily openable one-piece RF interference shield and method of manufacturing the same that is cost efficient and easily adapted for use with existing electrical devices. The RF shield having a plurality of interconnected sidewalls, a substantially open bottom region, and a hingeably connected top cover portion, having a top cover latch and disposed along the top edge of one of the sidewalls. The top cover portion of the shield is adapted to hinge toward another one of the sidewalls such that the top cover latch engages a hole disposed on the other sidewall being engaged and completing a protective enclosure about electrical components and preventing those components from causing electromagnetic interferences. The RF shield of the present invention allows for easy opening of the top cover portion to provide access to the enclosure for rework or repair of the electrical components covered by the shield, without having to unsolder the unit from a substrate containing the electrical components.

Abstract: A circuit board assembly comprising a laminate substrate and a surface mount device having a CTE less than that of the laminate substrate and attached with at least one solder joint to a first surface of the laminate substrate. The assembly further includes a localized stiffener attached to a second surface of the laminate substrate so as to be directly opposite the circuit device. The localized stiffener is formed of a material and is shaped so that, when attached to the laminate substrate, the stiffener is capable of increasing the thermal cycle fatigue life of the one or more solder joints that attach the device to the substrate.

Abstract: A leadless optical electronic package includes a lead frame having a die-attach pad and a plurality of leadless connection pads encapsulated in and extending through an encapsulation defining a planar mounting surface that can be soldered directly to a circuit board. The die-attach pad and connection pads define internal surfaces that remain partially exposed through the encapsulation. The internal surfaces are for attaching an electronic die and making electrical connections between the die and the connection pads. A die mounted on the die-attach pad is cooled more effectively and efficiently than dice in prior optical electronic packages. The leadless connection pads reduce the footprint and height of the package compared with prior optical electronic packages. The encapsulation is adapted for receiving a cover having a cover glass to allow light to pass though the cover and illuminate the die. The cover is adapted to receive an optics component for projecting light through the cover glass onto the die.

Abstract: An electronic component mounting circuit board for mounting an electronic component, comprises a circuit board, and connection pads provided on the circuit board, the connection pads being formed with a plurality of holes for inserting terminals of the electronic component.

Abstract: An electronic structure having wiring, and an associated method of designing the structure, for limiting a temperature gradient in the wiring. The electronic structure includes a substrate having a layer that includes a first and second wire which do not physically touch each other. The first and second wires are adapted to be at an elevated temperature due to Joule heating in relation to electrical current density in the first and second wires. The first wire is electrically and thermally coupled to the second wire by an electrically and thermally conductive structure that exists outside of the layer. The width of the second wire is tailored so as to limit a temperature gradient in the first wire to be below a threshold value that is predetermined to be sufficiently small so as to substantially mitigate adverse effects of electromigration in the first wire.

Abstract: A multilayer circuit board having a high level of reliability in terms of electric connection against temperature changes caused by the actual operation of electronic equipment, a manufacturing process, a substrate for multilayer circuitry, and an electronic apparatus.

Abstract: A system and method for supporting at least one electrical cable is provided. The at least one electrical cable may be secured to a movable electronic device disposed within a chassis. A harness is provided that is securable to at least one electrical cable. A flexible support member is provided to support the harness and the at least one electrical cable. The flexible support member may move with the electrical device as the electrical device is moved. The flexible support member may comprise wire. A wire reel may be provided to extend and retract the wire. The wire of the wire reel may be unwound as the electrical device is moved from a normal position to a withdrawn position. The wire of the wire reel may be wound as the electronic device is moved from the withdrawn position to the normal position.

Abstract: A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central conductive track and an external conductive track separated by a dielectric material and is positioned in a core of the electronic device carrier or in the full thickness of the electronic device. The coaxial via structure can be combined with a stacked via structure so as allow efficient transmission of high speed signals across the electronic device carrier when a manufacturing process limits the creation of a full coaxial via structure across the entire electronic device carrier.

Abstract: Methods and apparatus for interfacing a memory device with a host device are disclosed. According to one aspect of the present invention, an apparatus which enables a non-volatile memory device to communicate with a host device includes a body and an element. The body has a boundary, and the element is arranged to move at least partially within the body. The element includes an interface which may be coupled to the host device when the element is in a first position with respect to the body. The element is also arranged to receive the non-volatile memory device and to move the non-volatile memory device and the interface with respect to the body. In one embodiment, when the element is in the first position with respect to the body, the interface at least partially extends past the boundary associated with the body.

Abstract: An electronic package and information handling system utilizing same wherein the package substrate includes an internally conductive layer coupled to an external pad to provide reinforced adhesion of the pad to the substrate to substantially prevent cracking, separation, etc. of the pad when the pad has a pin bonded thereto and the package is coupled to an external substrate (e.g., printed circuit board). The reinforced adhesion also prevents pad separation, etc. during periods of package handling, manufacture, etc.

Abstract: A cooking appliance has a timer removably attached to the cooking appliance by a dove-tail joint. The cooking appliance has a lid with a lid handle located on a top of the lid. The lid handle has a first portion of the dove-tail joint and the timer has a second portion of the dove-tail joint. The timer is removably attachable to the cooking appliance by aligning and engaging the first portion of the dove-tail joint of the timer with the second portion of the dove-tail joint of the lid handle. The display and controls are located on a top of the timer. A bottom portion of the timer includes the second portion of the dove-tail joint, and the bottom portion of the timer has a substantially planar bottom surface forming a stable base for the timer when the timer is in a detached state. The bottom portion of the timer extends below the controls of the timer to provide stability for the timer when the timer is operated in the detached state.

Abstract: An apparatus for providing multi-directional signaling interface connection of a printed circuit card within a computer chassis. In one embodiment, a blind swap cartridge carries a circuit card that includes a first signaling interface connector in the form of a PCI edge connector. The edge connector is movable via a pivot point on the cartridge in a substantially transverse direction with respect to an insertion direction of said blind swap cartridge. In accordance with the present invention, a second signaling interface connector, such as a SCSI connector, is rigidly affixed to the exterior of the blind swap cartridge. The second signaling interface connector is preferably disposed on the cartridge in an orientation such that its connection direction is substantially aligned with the blind swap cartridge insertion direction. A flexible interconnect member is preferably utilized to couple the second signaling interface connector to the circuit card.

Abstract: A thin-film resin substrate having a first surface provided with a high-frequency electronic circuit and a second unleveled surface opposite the first surface. The second surface has raised portions and recessed portions, and the electronic circuit contains interconnections, at least some of which extend over regions corresponding to the recessed portions of the second surface so as to reinforce mechanical strength of the thin-film resin substrate at the regions corresponding to the recessed portions.

Abstract: A mobile communication device includes a printed circuit board (PCB); a radio frequency (RF) transceiver carried on the PCB; and an antenna coupled to the RF transceiver. A surface mountable antenna clip is mounted on the PCB for retaining the antenna. The clip is a metal structure having a plurality of planar sides generally formed into a U-shape. An opening formed by the structure is sized to receive and retain the antenna. One of the planar sides is used to support the structure and is mounted over a solder pad of the PCB. A hole formed through this planar side is configured to break a surface tension of molten solder over a solder pad of the PCB during a reflow soldering process, so that the clip is more stable and tends not to rotate out-of-position during the process. Legs extending from edges of this planar side also help to stabilize the clip during the process, and provide an increased surface area for the connection.