Patents Examined by Karen A. Hellender
  • Patent number: 4950726
    Abstract: A novel organopolysiloxane compound is disclosed which is capable of being cured by crosslinking and exhibiting a liquid-crystalline phase even in a crosslinked condition. The organopolysiloxane has mesogenic groups bonded to the silicon atoms such as --CH.sub.2).sub.3 O--Pn--CO--O--Pn--CN; --CH.sub.2).sub.3 O--CH.sub.2).sub.3 O--Pn--CO--O--Pn--CN; --CH.sub.2).sub.3 O--Pn--CO--O--Pn--F; and --CH.sub.2).sub.3 O--Pn--CO--O--Pn--O--CH.sub.3, in which the symbol Pn denotes a 1,4-phenylene group, and hydrolyzable groups pertaining to the crosslinking reaction.
    Type: Grant
    Filed: October 3, 1989
    Date of Patent: August 21, 1990
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hiroshi Yoshioka, Yoshitaka Hamada, Masanao Kamei
  • Patent number: 4946878
    Abstract: Extrudable organosiloxane compositions that cure by a hydrosilation reaction comprise a first polydiorganosiloxane containing alkenyl radicals only at the terminal positions of each molecule and a second polydiorganosiloxane containing alkenyl radicals on both terminal and non-terminal silicon atoms. When the alkenyl radicals on at least the second of the two polydiorganosiloxanes contain at least four carbon atoms the cure rate of the compositions is substantially increased relative to compositions wherein the alkenyl radicals on this polymer are vinyl.
    Type: Grant
    Filed: January 29, 1990
    Date of Patent: August 7, 1990
    Assignee: Dow Corning Corporation
    Inventors: Jary D. Jensen, Carl J. Bilgrien
  • Patent number: 4945124
    Abstract: This invention relates to polyamides which have been modified with special silicone graft rubbers to render them impact resistant and are tough at low temperatures and have high processing stability even at high temperatures and good surface properties.The moulding compounds, which are distinguished by excellent mechanical properties even at low temperatures, consist of at least 40% by weight of polyamide and special graft rubbers with a multishell core/sheath structure having a silicone-based core.
    Type: Grant
    Filed: January 9, 1989
    Date of Patent: July 31, 1990
    Assignee: Bayer Aktiengesellschaft
    Inventors: Uwe Westeppe, Christian Lindner, Karl-Erwin Piejko, Josef Merten
  • Patent number: 4943620
    Abstract: The invention proposes use of ammonia water in place of a conventional caustic alkali or amine compound as a catalyst in the siloxane rearrangement reaction for the preparation of a silicone-based pressure-sensitive adhesive between a poly(diorganosiloxane) having a linear molecular structure and another organopolysiloxane composed mainly of the monofunctional organosiloxane units and tetrafunctional siloxane units. The ammonia water after completion of the reaction can be easily and completely removed by distillation so that the resultant adhesive product is free from any alkaline residue of the catalyst to be imparted with greatly improved stability against viscosity changes and excellent electrical properties along with high reproducibility of the product quality.
    Type: Grant
    Filed: January 17, 1989
    Date of Patent: July 24, 1990
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shiro Gomyo, Takahide Kobori
  • Patent number: 4942188
    Abstract: The invention relates to polymer mixtures which comprise a polybutylene terephthalate, an aromatic polycarbonate, and a dialkyl silicone fluid. Due to the presence of the dialkyl silicone fluid compound a good lacquer bonding is obtained.
    Type: Grant
    Filed: November 9, 1988
    Date of Patent: July 17, 1990
    Assignee: General Electric Company
    Inventors: Wilhelmus Jozefus L. A. Hamersma, Jan de Boer, Wilhelmus M. M. Roovers, Gerrit de Wit
  • Patent number: 4937279
    Abstract: The present invention is a polymeric composition with improved extrudability comprising a vinylidene chloride interpolymer and a Group IIA alkaline-earth hydroxyphosphate, which is incorporated with the vinylidene chloride interpolymer by advance addition, polymer slurry addition or, finally, by dry blending addition. The Group IIA alkaline-earth hydroxyphosphate will be present in an amount of between about 0.01 to about 5 weight percent, said weight percents being based on the total weight of the polymeric composition.
    Type: Grant
    Filed: August 11, 1988
    Date of Patent: June 26, 1990
    Assignee: The Dow Chemical Company
    Inventors: Stephen R. Betso, Duane F. Foye, G. Edwin Vrieland
  • Patent number: 4929648
    Abstract: A binder composition which comprises an aqueous alkaline solution of a phenolic resole resin and an additive wherein the additive is phenoxyethanol or a derivative of phenoxyethanol.
    Type: Grant
    Filed: March 24, 1989
    Date of Patent: May 29, 1990
    Assignee: Acme Resin Corporation
    Inventors: David R. Armbruster, Kwok-Tuen Tse
  • Patent number: 4927867
    Abstract: A process for preparing a rubber modified thermoplastic resin, in which a latex in aqueous emulsion is prepared in the presence of an ionic surfactant; a vinyl monomer insoluble or substantially insoluble in water is added, and the particles of the latex are transferred to the monomer to form an organic phase using a transfer agent of opposite charge to the surfactant; and a polymerization of the organic phase is performed.
    Type: Grant
    Filed: August 19, 1988
    Date of Patent: May 22, 1990
    Assignee: Norsolor
    Inventors: Philippe Heim, Gerard Riess
  • Patent number: 4927871
    Abstract: Disclosed is a process for producing a modified ultrahigh-molecular-weight polyolefin composition, which comprises mixing a powder of an ultrahigh-molecular-weight polyolefin (A) having an intrinsic viscosity of at least 5 dl/g, a flowability improver (B) having a melting point lower than the melting point of the ultrahigh-molecular-weight polyolefin (A), a monomer (C) having an olefinically unsaturated bond and a radical initiator (D) with stirring at the melting point of the flowability improver (B) or a higher temperature but below the melting point of the ultrahigh-molecular-weight polyolefin (A), and then melt-kneading them at the melting point of the ultrahigh-molecular-weight polyolefin (A) or a higher temperature to react the monomer (C) with the ultrahigh-molecular-weight polyolefin (A).
    Type: Grant
    Filed: July 15, 1988
    Date of Patent: May 22, 1990
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Yoshiji Ohori, Hirofumi Harazoe
  • Patent number: 4923755
    Abstract: Curable organosilicone resin coating compositions are disclosed wherein part or all of the solvent ordinarily present in conjunction with a conventional hydroxyl functional organosiloxane resin copolymer is replaced with a reactive liquid silicone resin having an increased flash point and reduced volatility relative to a prior art reactive diluent. The liquid silicone resin employed is a reaction product prepared by hydrolyzing, and the neutralizing, an equilibrated mixture of (i) a phenylsilane and (ii) a polydimethylsiloxane, the equilibration reaction being facilitated by a perfluoroalkane sulfonic acid (iii).
    Type: Grant
    Filed: March 28, 1989
    Date of Patent: May 8, 1990
    Assignee: Dow Corning Corporation
    Inventor: Gerald L. Witucki
  • Patent number: 4923927
    Abstract: A curable composition comprises 100 parts by weight of an oxyalkylene polymer having at least one silicon-containing group which has a hydroxyl or hydrolyzable group attached to silicon atom and which is crosslinkable by forming a siloxane linkage and from 0.1 to less than 10 parts by weight of a liquid diene polymer.
    Type: Grant
    Filed: December 1, 1988
    Date of Patent: May 8, 1990
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Toshifumi Hirose, Katsuhiko Isayama
  • Patent number: 4921926
    Abstract: A curable polyorganosiloxane composition is disclosed, comprising: (A) 100 parts by weight of polyorganosiloxane having at least two hydroxyl groups or hydrolyzable groups bonded to a silicon atom in the molecule thereof and having a viscosity at 25.degree. C. of 10 to 1,000,000 cSt, (B) 0 to 2,000 parts by weight of polyorganosiloxane having at least two alkenyl groups bonded to a silicon atom in the molecule thereof and having a viscosity at 25.degree. C. of 10 to 1,000,000 cSt, (C) 0.5 to 20 parts by weight of an organosilicon compound having more than 2 (on the average) hydrolyzable groups bonded to a silicon atom in the molecule thereof, (D) 0 to 10 parts by weight of a catalyst for a condensation reaction, and (E) 0.1 to 5 parts by weight of an organic peroxide, wherein at least 0.01 mol % of all organic groups bonded to a silicon atom as contained in (A) to (C) is an alkenyl group. The composition has both condensation reaction curability and ultraviolet ray curability.
    Type: Grant
    Filed: November 16, 1988
    Date of Patent: May 1, 1990
    Assignee: Toshiba Silicone Co., Ltd.
    Inventors: Tsuneo Motegi, Yasuji Matsumoto, Kiyoshi Takeda, Shuji Chiba
  • Patent number: 4912189
    Abstract: Spirobiindanol polydiorganosiloxane compounds are prepared by the reaction of an .alpha., .omega.-dichloropolydiorganosiloxane with a spirobiindane bisphenol in the presence of an acid acceptor. They are useful as intermediates in the preparation of copolysiloxanecarbonates.
    Type: Grant
    Filed: November 7, 1988
    Date of Patent: March 27, 1990
    Assignee: General Electric Company
    Inventors: Gary R. Faler, David M. Dardaris
  • Patent number: 4908417
    Abstract: A thermosetting resin composition is prepared by mixing(A) a phenol novolak resin having hydroxy groups and allyl-etherified hydroxy groups,(B) a polymaleimide compound having two or more maleimide groups in the molecule, and(C) at least one silicone resin having the following formula (I); ##STR1## wherein R.sub.1 and R.sub.2, which may be the same or different, are methyl or phenyl; R.sub.3 and R.sub.4, which may be the same or different, are methyl, phenyl, hydrogen or a group having an amino group or an epoxy group but at least one of R.sub.3 and R.sub.4 is hydrogen or a group having an amino group or an epoxy group; and l and m, which may be the same or different, are a number of 0-400. The thermosetting resin composition of the present invention can be suitably used for encapsulating electric devices, for example, and gives, by curing, a cured resin product of high quality.
    Type: Grant
    Filed: May 2, 1989
    Date of Patent: March 13, 1990
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yutaka Shiomi, Kunimasa Kamio, Satoru Haraguchi, Shigeki Naitoh
  • Patent number: 4906707
    Abstract: A curable composition comprising an oxyalkylene polymer having reactive silicon groups and at least one other oxyalkylene polymer which contains no reactive silicon group and is either one containing hydroxyl groups and having a number average molecular weight of not less than 4,000 or one having essentially no hydroxyl group. The curable composition gives a cured product which imparts improved drying properties to alkyd paints applied to the cured product.
    Type: Grant
    Filed: December 27, 1988
    Date of Patent: March 6, 1990
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Sadao Yukimoto, Toshifumi Hirose, Katsuhiko Isayama
  • Patent number: 4906718
    Abstract: This invention provides novel liquid organosiloxane/graftoxyalkylene copolymers that cure to yield solid materials wherein at least a portion of the pendant oxyalkylene units are terminated with an acrylate group. The copolymers can be cured by heating them in the presence of suitable curing agents, by exposure to ultraviolet radiation in the presence of a photoinitiator, or by exposure to an electron beam. The copolymers can be combined with solubilized, ionizable lithium salts to yield curable electroconductive compositions suitable for use as electrolytes in storage batteries.
    Type: Grant
    Filed: December 9, 1988
    Date of Patent: March 6, 1990
    Assignee: Dow Corning Corporation
    Inventors: Gerald A. Gornowicz, Chi-Long Lee
  • Patent number: 4891393
    Abstract: A thermosetting organopolysiloxane composition made from organopolysiloxane gum, reinforcing silica having at least two weight percent methoxy groups, organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms per molecule, and a curing catalyst, such as organic peroxide or platinum catalyst, exhibit improved adhesion to a variety of substrates such as glasses, metals, and plastics.
    Type: Grant
    Filed: July 28, 1988
    Date of Patent: January 2, 1990
    Assignee: Toray Silicone Company, Ltd.
    Inventors: Kazuo Hirai, Takao Matsushita