Abstract: This disclosure relates to the layout of optical components included in a photonics integrated circuit (PIC) and the routing of optical traces between the optical components. The optical components can include light sources, a detector array, and a combiner. The optical components can be located in different regions of a substrate of the PIC, where the regions may include one or more types of active optical components, but also may exclude other types of active optical components. The optical traces can include a first plurality of optical traces for routing signals between light sources and a detector array, where the first plurality of optical traces can be located in an outer region of the substrate. The optical traces can also include a second plurality of optical traces for routing signals between the light sources and a combiner, where the second plurality of optical traces can be located in regions between banks of the light sources.

Abstract: An electronic device housing may have upper and lower portions that are attached with a hinge. At least one portion of the housing may have a rear planar surface and peripheral sidewalls having edges. A display module may be mounted in the housing. The display module may have glass layers such as a color filter glass layer and a thin-film transistor substrate. The color filter glass layer may serve as the outermost glass layer in the display module. The edges of the display module may be aligned with the edges of the peripheral housing sidewalls to create the appearance of a borderless display for the electronic device. The display module may be provided with an opening that allows a camera or other electronic components to receive light. Traces may be provided on the underside of the thin-film transistor substrate to serve as signal paths for the electrical components.

Abstract: The present invention provides an optical connector coupled to an optical receptacle, wherein the optical connector comprises an outer housing, a coupling module, and a latch structure. The coupling module is disposed in the outer housing for slidably connecting to the outer housing. When the latch structure is operated at a first position, the optical connector is unable to be taken away from the optical receptacle, and when the latch structure is operated at a second position, the outer housing is allowed to slide relative to the coupling module whereby the optical connector is taken away from the optical receptacle. In another embodiment, the present invention further provides an optical module and an operation method in which a movement for changing the position of the latch structure is operated to lock the optical connector into the optical receptacle or take the optical connector away from the optical receptacle.

Abstract: The present disclosure relates to methods, devices and systems for co-axially aligning first and second optical fibers to provide an optical coupling between the first and second optical fibers. A fiber engagement element is used to force the first and second optical fibers into an alignment groove.

Abstract: A semiconductor package includes a printed wiring board, a logic IC mounted on a first surface of the board, a connector mounted on a second surface of the board on the opposite side with respect to the first surface, an optical element that converts an optical signal and an electrical signal and positioned on the opposite side with respect to the first surface such that the optical element is at least partially embedded in the board, a path that is formed in the board and electrically connects the logic IC on the first surface and the optical element on the opposite side with respect to the first surface, and an optical waveguide that is embedded on the opposite side with respect to the first surface and optically connects the connector on the second surface and the optical element on the opposite side with respect to the first surface.

Abstract: An optical isolator for generally collimated laser radiation includes a single polarizing element, at least one Faraday optical element, at least one reciprocal polarization altering optical element disposed at the single polarizing element, at least one reflective optical element for reflecting radiation to provide an even number of passes through the at least one Faraday optical element, and a magnetic structure. The magnetic structure is capable of generating a magnetic field within the at least one Faraday optical element that is generally aligned with the even number of passes along a beam propagation axis. The optical isolator is configured to receive generally collimated laser radiation, which passes through the single polarizing element and the at least one reciprocal polarization altering optical element and which makes at least two passes through the at least one Faraday optical element, whereby generally collimated laser radiation is output from the optical isolator.

Abstract: An optical waveguide package includes a substrate, an optical waveguide layer located on an upper surface of the substrate and including a cladding and a core in the cladding, a lid, and a metal member. The cladding includes a first surface facing the substrate, a second surface opposite to the first surface, and an element-receiving area being open in the second surface. The lid covers the element-receiving area. The metal member surrounds the element-receiving area between the cladding and the lid.

Abstract: Architectures are provided for selectively outputting light for forming images, the light having different wavelengths and being outputted with low levels of crosstalk. In some embodiments, light is incoupled into a waveguide and deflected to propagate in different directions, depending on wavelength. The incoupled light then outcoupled by outcoupling optical elements that outcouple light based on the direction of propagation of the light. In some other embodiments, color filters are between a waveguide and outcoupling elements. The color filters limit the wavelengths of light that interact with and are outcoupled by the outcoupling elements. In yet other embodiments, a different waveguide is provided for each range of wavelengths to be outputted. Incoupling optical elements selectively incouple light of the appropriate range of wavelengths into a corresponding waveguide, from which the light is outcoupled.

Abstract: A projection device includes multiple optical fiber mounting mechanisms. Each of the optical fiber mounting mechanisms includes an optical fiber extending along a first direction as an axis direction, a signal circuit extending along the first direction, and a mounting structure. The optical fiber includes an engaging section. The mounting structure surrounds the engaging section of the optical fiber and the signal circuit. The mounting structure includes an installation portion extending radially relative to the first direction. The installation portion includes a surface and multiple elements exposed from the surface. The surface includes a normal direction parallel with the first direction. A first length of the engaging section of the optical fiber protruding from the surface of the installation portion is longer than lengths of the elements protruding from the surface.

Abstract: Fiber optic connectors, connector housings, connectorized cable assemblies, and methods for the connectorization of cable assemblies are provided with particular cable adapter features, adapter extensions, multi-diametrical sealing flexures, subcutaneous sealing elements, and combinations thereof, for improved connector and cable performance, integrity, and durability.

Abstract: An optical-fiber connector with protective cap includes a connector body and a retaining member which are fitted over an optical-fiber sleeve member, a fixation member, and a spring. The protective cap is fitted over the retaining member and the connector body. Each second engaging portion of the protective cap is engaged with a corresponding first engaging portion of the connector body. After the protective cap draws the optical-fiber connector to pass through a guiding pipeline, the protective cap is removed, and the optical-fiber connector is assembled with a fixation sleeve and a coupling cap to form a standard connector.

Abstract: A semiconductor package includes a printed wiring board, a logic IC mounted on the printed wiring board, a connector mounted on the printed wiring board, an optical element that is accommodated inside the printed wiring board and converts an optical signal to an electrical signal and/or the electrical signal to the optical signal, an optical waveguide formed between the optical element inside the printed wiring board and the connector on the printed wiring board such that the optical waveguide optically connects the optical element and the connector, and an electrical path formed between the optical element and the logic IC such that the electrical path connects the logic IC and the optical element and that a length of the electrical path is 1 mm or less.

Abstract: A photonic integrated circuit chip includes a substrate and a wafer on the substrate. The wafer itself includes a photonic grating coupler with a taper portion and grating features. The grating features extend from the taper portion toward the substrate.

Abstract: A package includes an electronic die, a photonic die underlying and electronically communicating with the electronic die, a lens disposed on the electronic die, and a prism structure disposed on the lens and optically coupled to the photonic die. The prism structure includes first and second polymer layers, the first polymer layer includes a first curved surface concaving toward the photonic die, the second polymer layer embedded in the first polymer layer includes a second curved surface substantially conforming to the first curved surface, and an outer sidewall of the second polymer layer substantially aligned with an outer sidewall of the first polymer layer.

Abstract: Optical modulators are described having a Mach-Zehnder interferometer and a pair of RF electrodes interfaced with the Mach-Zehnder interferometer in which the Mach-Zehnder interferometer comprises optical waveguides formed from semiconductor material. The optical modulator also comprises a ground plane spaced away in a distinct plane from transmission line electrodes formed from the association of the pair of RF electrodes interfaced with the Mach-Zehnder interferometer. The ground plane can be associated with a submount in which an optical chip comprising the Mach-Zehnder interferometer and the pair of RF electrodes is mounted on the submount with the two semiconductor optical waveguides are oriented toward the submount. Methods for forming the modulators are described.

Abstract: A reversible polarity fiber optic connector includes an outer housing having a front end, a rear end, and a receiving space defined between the front end and rear end; a ferrule assembly accommodated within the receiving space and configured to form an optical connection with a receptacle, the ferrule assembly including at least one ferrule protruding from the front end of the outer housing and configured to switch between a first position and second position; and a boot assembly rotatable connected to the rear end of the outer housing. When the boot assembly is rotated to an unlock position, the boot assembly is able to disconnect with the outer housing and the ferrule assembly is able to switch between the first position and second position.

Abstract: The present invention relates to the provision of a ferrule that can be connected even when the space for the connection is small. A ferrule of the present invention is configured to hold a plurality of optical transmission members and to be connected to another ferrule. The ferrule includes a first surface facing the end of the optical transmission members when the optical transmission members are held; and a plurality of second surfaces disposed opposite to the first surface in the ferrule. In the ferrule, the optical transmission members extend in the Z direction, and the ferrule is configured to be moved in a direction orthogonal to the Z direction to be connected to the other ferrule.

Abstract: Keying may be used to indicate various features of cables, cable connectors, and/or equipment. The keying mechanisms of the connectors systems disclosed herein identifies whether each plug is a pinned plug or a pinless plug. The keying mechanisms disclosed herein identify the number of optical fibers terminated at each plug. For example, one type of keying mechanism may indicate a cable plug manufactured under a 40 Gb/sec standard and another type of keying mechanism may indicate a cable plug manufactured under a 100 Gb/sec standard. The keying mechanisms may indicate a cabling/wiring pattern to be used (e.g., indicates a polarity of the cable). The cables and/or plugs may be color coded based on the keying mechanism. Accordingly, the keying may alert a user to the features of the cable that are not readily apparent upon a cursory inspection.

Abstract: Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.

Abstract: An optical module includes a first optical splitting element to split a signal beam into a first polarization component and a second polarization component, a first element having a first introduction port, a second element having a second introduction port, a first condensing part disposed between the first optical splitting element and the first introduction port and configured to condense the first polarization component toward the first introduction port, and a second condensing part disposed between the first optical splitting element and the second introduction port and configured to condense the second polarization component toward the second introduction port. An average refractive index of the second condensing part in an optical axis direction is larger than an average refractive index of the first condensing part in an optical axis direction.