Abstract: An automated feeder for concrete pipe making machines used to produce concrete pipes that have round as well as box-shaped, elliptical and other non-round shapes. The feeder has a concrete storage hopper mounted over a fixed pivot, and the hopper charges the concrete onto a belt-type conveyor the input end of which turns on the same pivot as the hopper for movement along a radial track. The discharge end of the feeder conveyor discharges the concrete into a rotatable chute that distributes the concrete into the cavity of the pipe mold. Encoders are combined with the motors driving the chute and the radial movement of the feeder conveyor so as to monitor the position and speed of the radial movement of the conveyor and position and speed of rotation of the chute. Information from the encoders is inputted into a computer which is programmed to control the speed and position of these components of the feeder depending upon the selected size and shape of the concrete form to be filled.

Abstract: After a thermoplastic synthetic resin has been injection molded onto a transfer plate in a thermoplastic injection mold, the transfer plate is shifted into a silicone injection mold maintained at a high temperature and a silicone member is injection molded onto the thermoplastic member. The heat transfer to the thermoplastic body is minimized by, for example, providing insulating material between heated portions of the mold system and other portions thereof and/or by maintaining air gaps from which the silicone is excluded between the thermoplastic member and heated portions of the silicone injection mold.

Abstract: A mold is provided for forming a grommet element. The mold includes a stationary portion and an axially movable portion. The grommet element is formed by the steps of installing respective connecting terminals on conduits; forming a conduit assembly from a plurality of individual conduits, and banding together two proximal points of the conduit assembly; introducing the conduit assembly into the lower part of the mold; closing the mold; moving the two proximal points closer together to produce flexural buckling of the conduits in the conduit assembly; introducing an adhesive mass into the mold, under pressure, at an elevated temperature, during a predetermined period of time; injecting the hot adhesive between the conduits of the conduit assembly; cooling the mold to solidify the adhesive; and molding PVC or another thermoplastic elastomer over the adhesive-sealed conduit assembly, to form a grommet element, and joining the thus sealed conduit assembly to a flange or dividing wall.

Abstract: A guide block assembly is provided for retaining a plurality of fiber bore forming pins and at least one guide bore forming pin in precise relation to each other during molding of a multi-fiber ferrule used in a multi-fiber connector. The assembly includes an array of fiber bore blocks each with a fiber bore therethrough to retain a respective one of the fiber bore forming pins. At least one guide bore block that defines a guide bore for retaining a guide bore forming pin is assembled with the array of fiber bore blocks. Adjoining surfaces are defined between adjacent fiber bore blocks and between the guide bore blocks and the array fiber bore blocks. The use of bores more precisely retains the pins during the molding process, and the use of blocks with adjoining surfaces allows for the machining of such surfaces to precisely establish the relationships between successive fiber bore blocks and between the array of fiber bore blocks and the guide bore blocks.

Abstract: An apparatus for automatically producing ice vessels. A male die 21 is provided opposite to a female die 11. A bottom surface of the female die 11 is formed with a through-hole 15, in which is provided a reciprocating body 17. The body 17 is capable of being raised or lowered by cylinder 18. Above one side of the female die 11 is provided a chute box 31 having an outlet port 31A facing the female die 11. Adjacent the female die 11 is provided carrier arms 41 movable toward or away from each other. An ice pieces equalizer 28 is provided above the female die 11. Ice pieces I are accomodated into the female die 11 with the body 17 protruding from the bottom surface thereof. A surplus amount of the accomodated ice pieces I are removed by the approach and return trip of the equalizer 28. Then, the body 17 is lowered to form a sinking. After that, an ice vessel is molded by depressing the male die 21.

Abstract: An apparatus for stretching bread dough into a sheet is provided, wherein a plurality of conveying rollers are supplied with powder so as to stretch the bread dough without its adhesion to the rollers. To have powder adhere to a plurality of conveying rollers, a powder-supply conveyor belt is made to abut the lower surfaces of the rollers.

Abstract: A dough molder including a stainless steel case, a sheeter, a former, a compressor, and a removable cleaning tray. The sheeter includes a fixed roller, adjustable roller, and a scraper for each roller, where the gap between the rollers is adjustable. The dough from the sheeter is directed to a conveyor belt that moves the dough to the former, a reticulated surface, such as a chain link screen, flexible in the direction of belt movement, that forms the dough into a roll. The belt directs the rolled dough from the former to the compressor that compresses the rolled dough into a cylindrical shape. The cleaning tray is located between the upper and lower legs of the belt, accumulating bits of flour and dough. The tray is removable for emptying.

Abstract: An extruder device includes a rotor rotatably received in a housing and a tube secured to the rotor and having a helical screw formed in the outer portion. A screw member is engaged in the bore of the rotor and secured in the tube and rotated in concert with the tube and the rotor. The material to be extruded is supplied onto the tube and moved by the helical screw and then by the screw member. The helical screw includes a pitch greater than that of the screw member for allowing the helical screw of the tube to squeeze the material.

Abstract: A resin sealing and molding apparatus for electronic parts includes, a cleaning UV application mechanism for removing mold surface contaminants adhering to or accumulating on the mold surfaces. The UV application mechanism is mounted to be freely reciprocative to a retracted position not inhibiting an operation for supplying unsealed lead frames and resin tablets to each resin molding unit part and an operation for taking out sealed lead frames, and to a deployed or operating position close to the mold surfaces in each resin molding unit. Using this UV application mechanism especially in conjunction with a suction device, the mold surface contaminants, such as a; mold release agent contained in a resin material or volatile gas generated by heating, that adhere to or accumulate on the mold surfaces of each resin molding unit are efficiently and reliably removed.

Abstract: An installation for compacting concrete mix includes a frame which has a lower plate and an upper plate between which concrete mix can be accommodated. The plates can be pressed in the direction towards one another and can be made to vibrate with respect to one another in order to compact the mix. Each plate is connected to the frame via an associated spring-mounted massive body.

Abstract: A novel die member for positioning in a uniformly tapering, frustoconical portion of a through bore in a body member of co-extrusion, cross-head coating apparatus. The die member has an external surface with a first, frustoconical portion dimensioned for mating engagement with the body member bore extending from the front end of the die member and tapering outwardly to terminate in a plane parallel to and intermediate of the planes of the front and rear ends of the member. A second, cylindrical, external surface portion, of smaller diameter than the adjacent, larger end of the first surface portion, extends to the rear end of the die member. An annular groove of substantially semi-circular cross section extends into and 360.degree. about the second surface portion rearwardly adjacent the first surface portion.

Abstract: In a TM dual mode dielectric resonator apparatus, a cross-shaped TM dual mode dielectric resonator is provided in an electrically conductive case, and the TM dual mode dielectric resonator includes first and second dielectric resonators integrally formed so as to be perpendicular to each other, and there is further formed at least one coupling groove for coupling an operation mode of the first dielectric resonator with that mode of the second dielectric resonator, wherein the coupling groove is formed on at least one of front and back surfaces of a crossing portion of the first and second dielectric resonators, in a diagonal direction thereof so as to cut electric lines of force of either one of an odd mode and an even mode. Alternatively, at least one coupling projection may be formed instead of the coupling groove.

Abstract: A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink attached in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink. The mold is provided with a biased plug that exerts pressure on the heat sink or printed wiring board to prevent molding compound from covering the heat sink. The biased plug also accommodates variations in the thickness of the printed wiring board.

Abstract: The device for working a dough strand into a thin dough sheet, comprises two superimposed endless conveyors the operative runs of which are facing one another and adapted to be driven in the same direction at the same speed. The operative runs confine a passage gap for the dough strand that gradually increases in height in the conveying direction. According to the invention, the operative run of the upper one of the two belt conveyors has, as seen in the conveying direction of the dough strand, a profile, that satisfies the equation: ##EQU1## in which Y.sub.x is the perpendicular distance between the operative run of the upper belt conveyor and the lower, flat belt conveyor at a point x in the passage gap between the two operative runs, and wherein a is a measure for the length of the conveyance path.

Abstract: A cooling tower (30) with a film fill assembly (37) including a lower film fill stack (40) and an intermediate sloped or stepped film fill section (43). The lower stack (40) is disposed in a lower inboard corner (41) of the tower (30) proximal to an air outlet opening (35) and a collecting basin (36), and extends about 20% to 60% of the vertical height (L) of the film fill assembly (37). All film fill sections include vertical corrugated sheets (46) in composite forming an integral unit with adjacent sheets contacting each other and defining passages for gas and liquid. The film fill assembly (37) may include an upper vertically oriented film fill section (54) disposed in an upper outboard corner (44) of the cooling tower (30). A baffle assembly (73) collects and diverts descending water extending too far inwardly toward the tower plenum chamber (56) and past the lower film fill section (40).

Abstract: The invention relates to a moulding apparatus for moulding a chip on a flat carrier, including a mould formed by two mould parts which are movable relative to each other and between which the carrier can be received, the one mould part of which is provided with a mould cavity against the peripheral edges of which the carrier can be pressed, and means for exerting pressure in at least one cavity for moulding material arranged in the mould and connected to the mould cavity by means of a runner, wherein at least one compensation element is arranged whereby in the closed position of the mould parts one side of the carrier is held sealingly against the peripheral edge of the mould cavity.

Abstract: There is provided a mold die set for molding a package body which is composed of a lead frame and a semiconductor chip mounted on the lead frame, and the lead frame has a hole. The mold die set is composed of an upper mold die and a lower mold die and the package body being clamped by the upper mold die and the lower mold die. The lower mold die includes a runner section, a table section connected to the runner section and protruding from a bottom of the runner section, a lower concave section connected to the table section, and a lower gate disposed between the table section and the lower concave section.

Abstract: The improved upper magnetic plate for anchoring molds, is constituted by a body made of steel with high magnetic permeability in which recessed seats are provided for accommodating coils adapted to generate an attracting magnetic field, the improvement consisting in that the coils are constituted by turns of wire made of a material such as a fluorocarbon resin perfluor alkoxy (PFA) and wrapped by a peripheral containment lapping made of an adhesive tape which has a vitreous base; the coils are arranged in the corresponding recessed seats and are locked therein by a thermosetting silicone containing filling material which is initially inserted in the plastic and malleable state; the seats can be closed in an upward region with plates made of diamagnetic material.

Abstract: A mold system for encapsulating substrate-mounted ICs includes a split mold having a lower cavity adapted for positioning the substrate and an upper cavity adapted for providing a volume space around the IC. The lower cavity is provided with a compressible shim plate adapted to lie on a bottom surface of the lower cavity such that a substrate of a substrate-mounted IC placed in the lower cavity will extend above the upper limit of the lower cavity, which is the split surface of the mold. As the split mold is closed, a lower surface of the upper mold portion encounters first an upper surface of the substrate, then the compressible shim plate is compressed until the mold is fully closed, at which time the lower surface of the upper mold portion is in intimate contact with both the substrate and the upper surface of the lower mold portion. The IC mounted on the substrate is then presented in the upper cavity for encapsulation.

Abstract: The present invention relates to a concrete forming system and method permitting a series of stacked concrete slabs to be formed at a work site. The system includes a vertical support member configured to the work surface, concrete form members for defining a desired shape for a concrete slab and horizontal adjustment members for attachment of the form members to the vertical support member. Through use of the system, a series of stacked concrete slabs can be successively poured one on top of the other.