Patents Examined by Kimberly E Glenn
  • Patent number: 11418223
    Abstract: The present disclosure provides a dual-band transformer structure, which is suitable for at least two frequencies. The dual-band transformer structure includes a metal layer, a first transmission line, a second transmission line, and a third transmission line. The first transmission line and the second transmission line are disposed on the metal layer. A first end of the second transmission line is coupled to a second end of the first transmission line. A second end of the second transmission line is aligned with an edge of the metal layer, and a first end of the third transmission line is coupled to the second end of the second transmission line. The third transmission line extends away from the edge.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: August 16, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Tzu-Hao Hsieh, Chih-Chieh Wang
  • Patent number: 11411307
    Abstract: A symmetric, multi-layer, three-way power divider that is equally balanced, with resistors placed between all combinations of legs. This three-way power divider is specifically designed to be used in millimeter wave applications (e.g., 5G in the 20 GHz-40 GHz range for both dual and single polarization), specifically in designs where a common signal is distributed to a multiple of three elements. This three-way power divider also can be useful for addressing space constraints in 5G applications, e.g., due to routing limitations.
    Type: Grant
    Filed: October 15, 2021
    Date of Patent: August 9, 2022
    Assignee: Anokiwave, Inc.
    Inventors: Jason Leo Durbin, Trang Thai, Peter Moosbrugger
  • Patent number: 11405012
    Abstract: A balun and a method for manufacturing the same are disclosed. According to an embodiment, the balun comprises a substrate, and a first and a second coplanar waveguide (CPW) couplers which are disposed on the substrate and cascaded with each other. Each CPW coupler comprises two first ground planes disposed on a first side of the substrate, a first microstrip line and at least two second microstrip lines which are disposed on the first side of the substrate between the two first ground planes, and at least one third microstrip line that is disposed on an opposite side of the substrate. The first microstrip line and the at least two second microstrip lines can be coupled with each other by electromagnetic coupling. The at least one third microstrip line electrically connects the at least two second microstrip lines with each other by via-holes.
    Type: Grant
    Filed: July 8, 2018
    Date of Patent: August 2, 2022
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Zhancang Wang, Chen He
  • Patent number: 11405019
    Abstract: Radio frequency filters. A radio frequency filter includes a substrate attached to a piezoelectric plate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate. A conductor pattern formed on the piezoelectric plate includes a plurality of interdigital transducers (IDTs) of a respective plurality of resonators, interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms. The conductor pattern connects the plurality of resonators in a matrix filter circuit including a first sub-filter and a second sub-filter, each sub-filter comprising two or more resonators from the plurality of resonators.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: August 2, 2022
    Assignee: Resonant Inc.
    Inventors: Pintu Adhikari, Neal Fenzi, Andrew Guyette
  • Patent number: 11405017
    Abstract: There are disclosed acoustic filters and radios incorporating the acoustic filters. A filter includes a first filter port, a second filter port, and n sub-filters, where n is an integer greater than one. Each sub-filter has a first sub-filter port connected to the first filter port and a second sub-filter port connected to the second filter port. A first acoustic resonator is connected from the first filter port to ground, and a second acoustic resonator is connected from the second filter port to ground. The first and second acoustic resonators are configured to create respective transmission zeros adjacent to a lower edge of a passband of the filter.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: August 2, 2022
    Assignee: Resonant Inc.
    Inventors: Andrew Guyette, Neal Fenzi
  • Patent number: 11399152
    Abstract: A MoCA splitter device may include an input port, a first output port and a second output port, a first transmission line configured to connect the input port to the first output port, a second transmission line configured to connect the input port to the first output port, a first isolation element configured to connect the first transmission line to the second transmission line, a second isolation element configured to connecting the first transmission line to the second transmission line. The first isolation element and the second isolation element are configured to provide an isolation level between the first output port and the second output port that is less than a predetermined isolation level of about less than 16 dB in a MoCA frequency band.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: July 26, 2022
    Assignee: PPC BROADBAND, INC.
    Inventors: Paul Bailey, Erdogan Alkan, Thomas Hart
  • Patent number: 11398807
    Abstract: A signal transmission device, including a RF processing circuit and a cable connecting circuit including a first choke inductor, a first and second bypass capacitors, and a first coupling capacitor, is provided. One end of the first choke inductor is coupled to a transceiver end of a RF transceiver and the other end is coupled to a first control end of a RF antenna controller. The transceiver end is coupled to a first conductor. The first bypass capacitor is coupled between the other end and a digital ground terminal. The first coupling capacitor is coupled between the digital ground terminal and a RF ground terminal. The second conductor is coupled to the RF ground terminal and a second control terminal of the RF antenna controller at a second connecting end of a RF cable. The second bypass capacitor is coupled between the second control terminal and the digital ground terminal.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: July 26, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Shih-Ping Liu, Chia-Yuan Lin, Kuang-Ta Sun, Bo-Ru Zeng, Tzu-Tu Hsu, Kai-Lun Huang
  • Patent number: 11394101
    Abstract: A hybrid coupler operating in a power divider mode includes two inputs, two outputs, a capacitive module coupled between the inputs and the outputs or on each input and each output. The capacitive module has an adjustable capacitive value making it possible to adjust the central frequency. A calibration method includes: delivering a first reference signal having a first reference frequency on the first input of the hybrid coupler, measuring the peak value of a first signal delivered to the first output of the coupler and measuring the peak value of a second signal delivered to the second output of the coupler. The two peak values are compared and an adjustment of the capacitive value of the capacitive module is made until an equality of the peak values is obtained to within a tolerance.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: July 19, 2022
    Assignee: STMicroelectronics SA
    Inventors: Vincent Knopik, Jeremie Forest, Eric Kerherve
  • Patent number: 11387564
    Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. A cavity filter is provided. The cavity filter includes a plate of the cavity filter and including a feeder part for supplying an electrical signal, a housing forming an exterior of the cavity filter and coupled to the plate to form a shielded space inside the cavity filter, and a metal structure having a first end coupled to an inside of the housing and a second end that extends toward the feeder part and resonates to filter frequencies in the shielded space.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: July 12, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dongjoo Kim, Bonmin Koo, Jonghwa Kim, Seungtae Ko, Youngju Lee, Jongwook Zeong
  • Patent number: 11381274
    Abstract: A transmit-and-receive module includes a multiplexer, a power amplifier, and a low-noise amplifier. The multiplexer includes a transmit filter and a receive filter. The power amplifier and the low-noise amplifier are integrated with each other. In a Smith chart, impedance in a receive band of the receive filter seen from a receive terminal intersects a line connecting a center point of noise figure circles and a center point of gain circles. The center point of the noise figure circles represents the impedance at which the noise figure of the low-noise amplifier is minimized. The center point of the gain circles represents the impedance at which the gain of the low-noise amplifier is maximized.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: July 5, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Jin Yokoyama, Shiro Masumoto, Syunji Yoshimi
  • Patent number: 11375608
    Abstract: An electromagnetic band gap structure apparatus includes a first conducting layer having at least one first slot. Each of the at least one slot is arranged with a planar conductor unit, and the each planar conductor unit is coupled to a first via. The electromagnetic band gap structure apparatus further includes a second conducting layer in parallel with the first conducting layer. The second conducting layer has a second slot. The second slot is arranged with at least one planar transmission line unit. The each of the at least one planar transmission line unit is coupled to the first conducting layer through a second via, and the each first via is coupled to the second conducting layer.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: June 28, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsin-Chan Hsieh, Ruey-Beei Wu, Shih-Hung Wang, Ting-Ying Wu
  • Patent number: 11374297
    Abstract: A filter arrangement having three or more stacked metallization layers separated by printed circuit board, PCB, layers. Each metallization layer includes an aperture. The filter arrangement has a plurality of via-holes extending though the stacked metallization layers and through the separating Dielectric material layers, whereby the via-holes and the metallization layers delimit a cavity in each Dielectric material layer. The cavities in two consecutive Dielectric material layers being coupled by the aperture in the single metallization layer separating the two consecutive Dielectric material layers. The aperture of a topmost metallization layer being arranged as antenna element. The filter arrangement having a signal interface arranged as a conduit connecting at least one dielectric material layer to an exterior of the filter arrangement.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: June 28, 2022
    Assignee: Telefonaktiebolaget LM Ericsson (Publ)
    Inventors: Anatoli Deleniv, Ola Tageman
  • Patent number: 11369272
    Abstract: An RF applicator has an open-ended waveguide having an aperture and a dielectric cone extending through the aperture and is electrically connected to an RF source that is configured to generate RF energy pulses. A top fin is mounted to an inner top surface of the waveguide and comprises a conductive material, is electrically connected to the RF source, and has dimensions configured to optimize a bandwidth that the RF applicator applies to tissue. A bottom fin is mounted to an inner bottom surface of the waveguide and comprises a conductive material electrically isolated from the RF source, with dimensions configured to optimize a bandwidth that the RF applicator applies to tissue. A dielectric cone is inserted into the waveguide. A filler material between inner surfaces of the waveguide and the solid dielectric cone can fill gaps and has a dielectric constant similar to the dielectric cone.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: June 28, 2022
    Assignee: ENDRA Life Sciences Inc.
    Inventors: Christopher Nelson Davis, Paolo Maccarini
  • Patent number: 11367773
    Abstract: An on-chip inductor structure includes first and second winding portions symmetrically arranged in an insulating layer by a symmetrical axis. Each of the first and second winding portions includes first and second semi-circular conductive lines concentrically arranged from the inside to the outside. First and second input/output conductive portions are disposed in the insulating layer along the extending direction of the symmetrical axis, to respectively and electrically couple the first ends of the outermost semi-circular conductive lines. A conductive branch structure is disposed in the insulating layer along the symmetrical axis and between the first and second input/output conductive portions, and electrically coupled to first ends of the innermost semi-circular conductive lines. The conductive branch structure has a grounded first end and a second end is electrically coupled to a circuit and is opposite the first end of the conductive branch structure.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: June 21, 2022
    Assignee: VIA LABS, INC.
    Inventor: Sheng-Yuan Lee
  • Patent number: 11361899
    Abstract: An apparatus is provided. The apparatus includes an electronic circuit for processing a differential signal. A device including an electronic circuit may include a first inductor and a second inductor that process a differential signal, a first circuit connected to the first inductor in parallel, a second circuit connected to the second inductor in parallel, and lines connecting the first inductor and the first circuit, the lines being disposed to pass through an area defined by the first inductor and the second inductor. The first inductor and the second inductor have symmetrical differential structures.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: June 14, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youngchang Yoon, Jaehyup Kim, Sangmin Lee
  • Patent number: 11362686
    Abstract: A multiplexer includes a common terminal, a first filter configured to be connected to the common terminal, and having a first passband, a second filter configured to be connected to the common terminal, and having a second passband that at least partially overlaps the first passband, and a third filter configured to be connected to the common terminal, and having a third passband that does not overlap both the first passband and the second passband.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: June 14, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hirotsugu Mori, Hidenori Obiya
  • Patent number: 11355829
    Abstract: A microwave or radio frequency (RF) device includes stacked printed circuit boards (PCBs) mounted on a flexible PCB having at least one ground plane and a signal terminal. Each of the stacked PCBs includes through-holes the sidewalls of which are coated with a conductive material. Microwave components are mounted on the flexible PCB within the through-holes, such that signal terminals of the components bond to signal terminals of respective through-holes. A conductive cover is mounted on the PCBs such that the cover is in electrical contact with the ground plane of the flexible PCB through the conductive material, forming shielding cavities around the components. The flexible PCB is folded such that the cover of one PCB faces the cover of the second PCB. The flexible PCB includes striplines or microstrips that carry RF or microwave signals to the signal terminals.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: June 7, 2022
    Assignee: KNOWLES CAZENOVIA, INC.
    Inventor: David Bates
  • Patent number: 11322844
    Abstract: Embodiments of a circuit, system, and method are disclosed. In an embodiment, a circuit includes a first microstrip transmission line, a second microstrip transmission line, and a slotline formation, wherein the slotline formation extends between the first microstrip transmission line and the second microstrip transmission line so that the slotline formation is configured to electromagnetically couple the first microstrip transmission line to the second microstrip transmission line during operation of the circuit. In addition, the circuit includes at least one controllable capacitance circuit electrically connected to at least one of the first microstrip transmission line and the second microstrip transmission line, wherein a magnitude of capacitance of the at least one controllable capacitance circuit is controllable (e.g., in response to a capacitance control signal received at a control interface).
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: May 3, 2022
    Assignee: NXP USA, Inc.
    Inventors: Oleksandr Nikolayenkov, Geoffrey Tucker, Martin Beuttner
  • Patent number: 11322816
    Abstract: A feeding device is disclosed. The feeding device includes a body and at least one first port, the body includes at least one first contour port, and each of the at least one first contour port corresponds to one of the at least one first port; and the first contour port includes at least two sub-ports, and the at least two sub-ports of the first contour port are connected, by using at least one power splitter, to the first port corresponding to the first contour port. In the foregoing implementation solution, the first contour port is divided into several sub-ports, and the first port and the several sub-ports are connected by using the at least one power splitter.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: May 3, 2022
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Qingming Xie, Gaonan Zhou, Qiuyan Liang, Jianping Zhao
  • Patent number: 11309865
    Abstract: There are disclosed acoustic diplexers and radios incorporating the acoustic diplexers. A diplexer includes common port, a low band port, a high band port, n low band sub-filters, and n high band sub-filters, where n is an integer greater than one. Each low band sub-filter has a first sub-filter port connected to the common port and a second sub-filter port connected to the low band port. Each high band sub-filter has a first sub-filter port connected to the common port and a second sub-filter port connected to the high band port. A first acoustic resonator is connected from the common port to ground and a second acoustic resonator is connected from the low band port to ground. The first and second acoustic resonators are configured to create respective transmission zeros adjacent to a lower edge of a passband of the diplexer.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: April 19, 2022
    Assignee: Resonant Inc.
    Inventors: Andrew Guyette, Neal Fenzi