Abstract: A multi-mode filter with a resonator having a plurality of resonator bodies which are rectangular prisms and the filter being configured with a through hole that electrically connects an input and an output to the center of a coupling structure between a respective pair of slabs. The multi-mode filter further comprising a plurality of coupling aperture segments which are coupling structures between each pair of resonator bodies or slabs such that two triangular apertures at opposite corners of at least two different slab-cube interfaces are utilized with the triangular apertures being diagonally opposed to one another across the respective interface.

Abstract: The present invention relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: a first side terminal contacted with the electrode pad; and a second side terminal having a housing space in which a part of the first side terminal is housed, and connected to the RF signal connecting portion, wherein the first side terminal is provided as an elastic deformable body whose part is radially widened or narrowed against an assembly force provided by an assembler.

Abstract: There are disclosed matrix filters having an input port and sub-filters connected between the input port and respective output ports. Each of the sub-filters includes a ladder circuit with n transversely-excited film bulk acoustic resonator (XBAR) series elements and n?1 capacitor shunt elements, where n, the order of the sub-filter, is an integer greater than 2. Each sub-filter further has a first switch in parallel with a first capacitor shunt element and a second switch in parallel with a last capacitor shunt element.

Abstract: An orthomode transducer and to a satellite transmission chain includes the orthomode transducer, for transmitting a first signal and a second signal in orthogonal propagation modes. The transducer comprises: a primary waveguide with a square or rectangular cross section, two guided access means having firstly a free end via which the first signal and the second signal are respectively injected or recovered, and secondly two arms connected to the primary waveguide. Each guided access means comprises a junction configured so as to connect the free end to the two arms of the guided access means, the two arms of each guided access means being connected to the primary waveguide at two off-centred locations on one or more sides of the primary waveguide symmetrically about an axis of symmetry of the primary waveguide.

Abstract: A receiver front end (300) having low noise amplifiers (LNAs) is disclosed herein. A cascode having a “common source” configured input FET and a “common gate” configured output FET can be turned on or off using the gate of the output FET. A first switch (235) is provided that allows a connection to be either established or broken between the source terminal of the input FET of each LNA. A drain switch (260) is provided between the drain terminals of input FETs to place the input FETs in parallel. This increases the gm of the input stage of the amplifier, thus improving the noise figure of the amplifier.

Abstract: Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 ?m and 1,000 ?m.

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device can include an assembly having asymmetrically situated conductors. In selected examples, the assembly includes a ground plane, a central shield portion, a first side shield portion on a first side, a second side shield portion on a second side, a first conductor asymmetrically situated between the central shield portion and the first side shield portion, a second conductor asymmetrically situated between the central shield portion and the second side shield portion, and dielectric within the assembly.

Abstract: An interposer layer includes an integral waveguide to facilitate high speed (e.g., greater than 80 GHz) communication between semiconductor dies in a semiconductor package. An interposer layer may include a waveguide member and a dielectric layer disposed adjacent at least a portion of an exterior perimeter of the waveguide member. The waveguide member includes a material having a first relative permittivity. The dielectric member includes a material having a second relative permittivity that is less than the first relative permittivity. The waveguide member and the dielectric member form an interposer layer having an upper surface and a lower surface. A first conductive sheet may be disposed proximate the upper surface of the interposer layer and a second conductive sheet may be disposed proximate the lower surface of the interposer layer.

Abstract: A multiplexer includes an antenna terminal, first to third filters with different passbands, and first and second phase circuits that adjust the phase of a passing signal. The first filter is connected to the antenna terminal. The second filter is connected to the antenna terminal with the first phase circuit provided between the second filter and the antenna terminal. The third filter is connected to a connection node between the first phase circuit and the second filter with the second phase circuit provided between the third filter and the connection node. In the second filter, an unwanted wave is generated in the first passband of the first filter. The first phase circuit adjusts the phase to provide an impedance in an open state in the first passband at the antenna terminal. The second phase circuit adjusts the phase to provide the impedance in a short-circuited state in the first passband at the connection node.

Abstract: A coaxial tap in a hybrid fiber coaxial cable distribution system serves subscribers with an RF signal while passing the RF signal and an equipment supply voltage to devices downstream of the tap.

Abstract: A surface mountable coupler may include a monolithic base substrate having a first surface, a second surface, a length in an X-direction, and a width in a Y-direction that is perpendicular to the X-direction. A plurality of ports may be formed over the first surface of the monolithic base substrate including a coupling port, an input port, and an output port. The coupler may include a first thin film inductor and a second thin film inductor that is inductively coupled with the first thin film inductor and electrically connected between the input and output ports. A thin film circuit may electrically connect the first thin film inductor with the coupling port. The thin film circuit may include at least one thin film component.

Abstract: The present application describes a method of tuning a printed device. The method includes measuring a frequency response of a target device and a device under tune (DUT). The method includes computing, based on the measured frequency response, a coupling matrix for the target device and a coupling matrix for the DUT. The method also includes extracting eigenvalues for the coupling matrix of the target device and a first set of eigenvalues for the coupling matrix of the DUT. The eigenvalues of the target device are different than the first set of eigenvalues of the DUT. The method further includes tuning the DUT with a material removal source. The method even further includes measuring a second set of eigenvalues of the DUT. The second set of eigenvalues is different from the first set of eigenvalues of the DUT. The method yet even further includes calculating a tune path for iterative convergence of the second or a subsequent set of eigenvalues of the DUT with the eigenvalues of the target device.

Abstract: A coaxial cable is composed of a conductor, an electrical insulating member covering a periphery of the conductor, a shield layer covering a periphery of the electrical insulating member, and a sheath covering a periphery of the shield layer. The shield layer is configured to include a lateral winding shielding portion with a plurality of metal wires being helically wrapped around the periphery of the electrical insulating member, and a batch plating portion made of a hot-dip plating covering respective peripheries of the lateral winding shielding portion. The shield layer includes an outer peripheral portion, in which the metal wires are covered with the batch plating portion, and an inner peripheral portion, in which the metal wires are not covered with the batch plating portion. The outer peripheral portion of the shield layer includes intermetallic compounds between the metal wires and the batch plating portion.

Abstract: A band stop filter can include a circuit board having a first surface and an opposing second surface. The circuit board can have a transmission line on the first surface. The band stop filter can include a dielectric cavity resonator physically coupled to the second surface of the circuit board. The dielectric cavity resonator can have a coupling aperture configured to magnetically couple the dielectric cavity resonator to the transmission line, and to cause excitation of the dielectric cavity resonator in a second order transverse electric (TE) mode.

Abstract: A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than ?3.5 dB at a frequency that is greater than about 15 GHz.

Abstract: Antenna waveguide transitions for solid state power amplifiers (SSPAs) are disclosed. An SSPA includes a waveguide channel that is configured to propagate an input signal, such as an electromagnetic signal, from an input port to a solid state amplifier for amplification. The waveguide channel is further configured to propagate an amplified signal from the solid state amplifier to an output port. Waveguide transitions to and from the solid state amplifier are bandwidth matched to the waveguide channel. Additionally, the waveguide transitions may be thermally coupled to the waveguide channel. The waveguide transitions may include antenna structures that have a signal conductor and a ground conductor. In this manner, the SSPA may have improved broadband coupling as well as improved thermal dissipation for heat generated by the solid state amplifier.

Abstract: A Docsis-MoCA coupled line directional coupler includes an input port, an output port, a coupled port, and a termination port. A first track connects the input port to the output port and a second track, which may be substantially parallel to the first track, connects the termination port to the coupled port. The first track and the second track are configured to form a variable coupling length so as to control, for instance, an isolation level between the output port and the coupled port to be less than a predetermined isolation level in a MoCA frequency band.

Abstract: The present disclosure provides a dual-band transformer structure, which is suitable for at least two frequencies. The dual-band transformer structure includes a metal layer, a first transmission line, a second transmission line, and a third transmission line. The first transmission line and the second transmission line are disposed on the metal layer. A first end of the second transmission line is coupled to a second end of the first transmission line. A second end of the second transmission line is aligned with an edge of the metal layer, and a first end of the third transmission line is coupled to the second end of the second transmission line. The third transmission line extends away from the edge.

Abstract: A symmetric, multi-layer, three-way power divider that is equally balanced, with resistors placed between all combinations of legs. This three-way power divider is specifically designed to be used in millimeter wave applications (e.g., 5G in the 20 GHz-40 GHz range for both dual and single polarization), specifically in designs where a common signal is distributed to a multiple of three elements. This three-way power divider also can be useful for addressing space constraints in 5G applications, e.g., due to routing limitations.

Abstract: A balun and a method for manufacturing the same are disclosed. According to an embodiment, the balun comprises a substrate, and a first and a second coplanar waveguide (CPW) couplers which are disposed on the substrate and cascaded with each other. Each CPW coupler comprises two first ground planes disposed on a first side of the substrate, a first microstrip line and at least two second microstrip lines which are disposed on the first side of the substrate between the two first ground planes, and at least one third microstrip line that is disposed on an opposite side of the substrate. The first microstrip line and the at least two second microstrip lines can be coupled with each other by electromagnetic coupling. The at least one third microstrip line electrically connects the at least two second microstrip lines with each other by via-holes.