Patents Examined by Kimberly E Glenn
  • Patent number: 11658639
    Abstract: There are disclosed matrix filters having an input port and sub-filters connected between the input port and respective output ports. Each of the sub-filters includes a ladder circuit with n transversely-excited film bulk acoustic resonator (XBAR) series elements and n?1 capacitor shunt elements, where n, the order of the sub-filter, is an integer greater than 2. The sub-filters having noncontiguous passbands.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: May 23, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Andrew Guyette, Neal Fenzi, Michael Eddy, Bryant Garcia
  • Patent number: 11652135
    Abstract: Embodiments described herein provide circuitry employing one or more inductors having an unconventional turn-ratio. The circuitry includes a primary inductor having a first length located on a first layer of an integrated circuit (IC). The circuitry further includes a secondary inductor having a second length located on a second layer of the IC different from the first layer, whereby the second length is greater than the first length, with a ratio between the first and the second lengths corresponding to a non-integer turn-ratio.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: May 16, 2023
    Assignee: Marvell International Ltd.
    Inventors: Huy Thong Nguyen, Poh Boon Leong, Juan Xie
  • Patent number: 11646476
    Abstract: An asymmetric, broadband, compact and low-PIM orthomode transducer comprised of two parts is presented. Mating of the two parts results in the formation of a choke flange as well as a critical impedance step which suppresses unwanted modes and enables broadband matching of the junction between the two parts. Furthermore, a cruciform-quatrefoil waveguide type is utilized that transitions to an aperture. This waveguide configuration can lead to a lower overall part length, an improved reflection, and reduced manufacturing costs.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: May 9, 2023
    Assignee: Lockheed Martin Corporation
    Inventor: Jason Stewart Wrigley
  • Patent number: 11646477
    Abstract: The disclosed radio frequency (RF) bandpass filter may include an RF transmission medium that defines (1) a plurality of cavities aligned parallel to each other along a major axis, where (a) each cavity includes planar surfaces that define (i) a first dimension aligned with the major axis and (ii) second and third dimensions aligned perpendicular to the major axis and each other, where the first dimension is shorter than the second and third dimensions and (b) each adjacent pair of cavities is coupled by an inter-cavity slot, (2) an RF inlet that couples a received RF signal to a first cavity at a first end of the plurality of cavities, and (3) an RF outlet that couples a filtered RF signal from a second cavity at a second end of the plurality of cavities externally to the filter. Various other filters and manufacturing methods thereof are also disclosed.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: May 9, 2023
    Assignee: Meta Platforms, Inc.
    Inventors: Farbod Tabatabai, Haris Alijagic
  • Patent number: 11631515
    Abstract: A filter device includes a first filter including series resonators and parallel resonators, a first inductor connected in parallel between a first terminal and the first filter, a second inductor provided in series between the first filter and a second terminal, and a third inductor provided in series in a channel connecting the parallel resonator and ground, the third inductor is incorporated in a multilayer substrate, the first filter is mounted on a main surface of the multilayer substrate and incorporated in a filter chip, and the first inductor and the second inductor are chip inductors including coil conductors and are mounted on the main surface of the multilayer substrate beside the filter chip so as to be adjacent to each other and such that coil axes thereof are orthogonal or substantially orthogonal to each other.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: April 18, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takao Mukai
  • Patent number: 11632094
    Abstract: A radio-frequency (RF) splitter is provided. The RF splitter includes a common branch node configured to transfer an RF signal, input from an input port, to at least one of first and second output ports, first and second branch nodes electrically connected between the common branch node and the first and second output ports, first and second series switches configured to control switching operations to electrically connect the common branch node and the first and second branch nodes to each other, first and second inductors electrically connected between the common branch node and the first and second branch nodes, a resistor electrically connected between the first and second branch nodes, and first and second shunt switches configured to control switching operations to electrically connect the first and second branch nodes and the resistor to each other.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: April 18, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Nack Gyun Seong, Ju Young Park
  • Patent number: 11631928
    Abstract: A phase shifter and a method for manufacturing the same are provided. The phase shifter includes a substrate, a signal line on the substrate, ground lines in pairs and on the substrate, and at least one film bridge on the substrate and spaced apart from the signal line. Two adjacent ground lines of the ground lines are on both sides of the signal line and spaced apart from the signal line, respectively, and both ends of each film bridge are on the two adjacent ground lines, respectively. The signal line is in a space surrounded by each film bridge and the substrate. Each film bridge includes a metal layer opposite to the signal line, the metal layer has a plurality of openings therein, and the plurality of openings penetrate through the metal layer in a thickness direction of the metal layer.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: April 18, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Chunxin Li, Jingwen Guo, Qianhong Wu, Kui Liang, Tuo Sun
  • Patent number: 11626854
    Abstract: Radio-frequency splitter circuits, devices and methods. In some embodiments, a power splitter can include an input port, a first output port and a second output port. The power splitter can further include a first signal path implemented between the input port and the first output port, and a second signal path implemented between the input port and the second output port. Each of the first and second signal paths can include a variable capacitance configured to provide a plurality of capacitance values that result in different frequency responses of the respective signal path.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: April 11, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Anuranjan Hosagavi Puttaraju, Gunjan Pandey, Paul Raymond Andrys
  • Patent number: 11621632
    Abstract: A component is disclosed. In an embodiment a component includes a first region suitable for a feedthrough of at least one bus bar and a second region in which at least one discrete device is arranged, wherein the first region and the second region are separated from one another by a cooling region thermally decoupling the first region from the second region.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: April 4, 2023
    Assignee: TDK ELECTRONICS AG
    Inventor: Fabian Beck
  • Patent number: 11613931
    Abstract: An apparatus includes a tube including an inner surface, an inner diameter, and a length. The apparatus also includes a coil spring. The coil spring includes an outer surface, an outer diameter, and a plurality of coil elements arranged along a length of the coil spring. The coil spring can be positioned within the tube and the outer diameter of the coil spring can be less than the inner diameter of the tube. The coil spring can form a waveguide. Related methods of manufacture and systems are also described herein.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: March 28, 2023
    Assignee: Quaise, Inc.
    Inventors: Hy Phan, Matthew Houde, Curtis Ardoin, Carlos Araque, Justin Lamb, Dennis Arnow, Ray Oliver
  • Patent number: 11616279
    Abstract: A receiver or transmitter designed for a broad range of frequencies requires a pre-select filter for incoming signals or a post-select filter for outgoing signals to minimize spurious signal responses. In conventional receivers, several discrete RF filters are used and a switched filter bank is created utilizing a large amount of space. A filter bank comprising a plurality of stacked shielded filters would enable different filter technologies and topologies to be used together, as other passive and active circuits may be combined into the one surface mountable component in order to save on PCB space.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: March 28, 2023
    Assignee: ThinkRF Corporation
    Inventors: Gilbert Brunette, Jeffrey Michael Hill, Theodore Pantazopoulos, Jasvinder Singh Obhi
  • Patent number: 11610722
    Abstract: A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers on top of one another and that has a coil built thereinto, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors. A first main surface of the multilayer body is a mounting surface. A stacking direction of the multilayer body is parallel to the mounting surface. The multilayer coil component includes first and second connection conductors. The first and second connection conductors overlap the coil conductors in a plan view from the stacking direction and are located closer to the mounting surface than a center axis of the coil. Distances between adjacent coil conductors are not constant in a side view from a direction perpendicular to the stacking direction.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: March 21, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Atsuo Hirukawa
  • Patent number: 11606134
    Abstract: In some embodiments, an apparatus includes a plurality of first conductive traces oriented in a first direction in a first layer and plurality of second conductive traces oriented in a second direction in a second layer coupled by vias to define first hierarchical networks. A plurality of third conductive traces oriented in the first direction in a third layer and a plurality of fourth conductive traces oriented in the second direction in a fourth layer are coupled by vias to define second hierarchical networks. Open ends of the first or second traces at a last stage of the first hierarchical networks comprise first ends and open ends of the third or fourth traces at a last stage of the second hierarchical networks comprise second ends. A first end and a corresponding second end are non-collinear to each other and perpendicular to a major plane of the first layer.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: March 14, 2023
    Assignee: Space Exploration Technologies Corp.
    Inventors: Nil Apaydin, Chiara Pelletti, Souren Shamsinejad, Alireza Mahanfar
  • Patent number: 11600895
    Abstract: A directional coupler (1) includes a substrate (10), a main line (20) formed directly or indirectly on the substrate (10), sub-lines (21, 22 and 23) at least part of each of which is formed directly or indirectly on the substrate (10) along the main line (20), a switch (30) switching connections among end portions of the plurality of sub-lines (21, 22 and 23), and detection output terminals (FWD and REV) connected to the sub-line (21), wherein, when looking at the substrate (10) in plan, the end portions of the sub-lines (21, 22 and 23) are disposed on the opposite side to the detection output terminals (FWD and REV) relative to the main line (20), and the sub-line (21) to which the detection output terminals (FWD and REV) are connected is overlapped with or surrounded by the sub-lines (22 and 23).
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: March 7, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Daisuke Tokuda, Yasushi Shigeno
  • Patent number: 11600429
    Abstract: A system of modular components each include pin ports that may be connected in different configurations to enact alternative planar designs. Each modular component has asymmetries that are utilized to facilitate alternative wiring. Such asymmetries could include protrusions in the wafer to align edge connections. Alternatively, or in addition, the asymmetries include differences in copper disposition to certain edge connections. Each modular component has a non-conductive coating on each side of the wafer to insulate the underlaying copper layer.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: March 7, 2023
    Assignee: Rockwell Collins, Inc.
    Inventors: Joshua Gerdes, Jeffrey J. Deloy, James B. Mayfield, Tristan J. Kendall, Steven Stowe
  • Patent number: 11581620
    Abstract: A waveguide filter having a core including an external face and internal faces defining a channel for filtering and guiding the waves. The channel includes several slots, each having a first and a second face. The first face is inclined in relation to the second face. A method for manufacturing the waveguide filter.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: February 14, 2023
    Assignee: SWISSTO12 SA
    Inventors: Santiago Capdevila Cascante, Tomislav Debogovic, Esteban Menargues Gomez
  • Patent number: 11569554
    Abstract: An orthomode transducer including a first Boifot junction and a second Boifot junction. Each of the first and second Boifot junctions includes a dual polarized port, a first lateral port, a second lateral port, the first and second lateral port being single polarized, and a third single polarized port along the propagation direction of a signal in the dual polarized port. A first power divider for coupling the first lateral port of the first Boifot junction with the first lateral port of the second Boifot junction to a third port. A second power divider for coupling the second lateral port of the first Boifot junction with the second lateral port of the second Boifot junction to a third port. A third power divider for coupling the third port of the first power divider with the third port of the second power divider to a fourth single polarization port.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: January 31, 2023
    Assignee: SWISSTO12 SA
    Inventors: Esteban Menargues Gomez, Santiago Capdevila Cascante, Tomislav Debogovic
  • Patent number: 11563259
    Abstract: Antenna and/or waveguide assemblies for vehicles, such as RADAR sensor antenna assemblies, along with associated signal confinement structures. In some embodiments, the assembly may comprise an antenna block defining one or more waveguides. A conductive layer may be coupled to the antenna block to form, at least in part, a wall of the waveguide. The assembly may comprise one or more periodic structures that may be operably coupled to the waveguide, each of which may comprise a first elongated opening and a first series of repeated slots extending at least substantially transverse to the first elongated opening, wherein each of the first series of repeated slots is spaced apart from an adjacent slot in the first series of repeated slots along the first elongated opening.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: January 24, 2023
    Assignee: Veoneer US, LLC
    Inventors: Angelos Alexanian, Scott B. Doyle, Arnold Mobius
  • Patent number: 11562849
    Abstract: An inductor includes a coil that is constituted by a conductor having a coating layer and includes a winding portion where the conductor is wound and an extended portion extended from the winding portion, a base body that envelops the coil and is constituted by a magnetic body containing magnetic powder and resin, and an outer electrode that is arranged on a surface of the base body and connected to the extended portion. The extended portion of the coil includes a conductor portion that does not have the coating layer in an end portion of the extended portion, and the conductor portion includes a first region connected to the outer electrode and a second region in contact with the magnetic body.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: January 24, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yuuhei Tomizuka
  • Patent number: 11552598
    Abstract: Wideband power combiners and splitters are provided herein. In certain embodiments, a power combiner/splitter is implemented with a first coil connecting a first port and a second port, and a second coil connecting a third port and a fourth port. The first coil and the second coil are inductively coupled to one another. For example, the first coil and the second coil can be formed using adjacent conductive layers of a semiconductor chip, an integrated passive device, or a laminate. The power combiner/splitter further includes a fifth port tapping a center of the first coil and a sixth port tapping a center of the second coil. The fifth port and the sixth port serve to connect capacitors and/or other impedance to the center of the coils to thereby provide wideband operation.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: January 10, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Bo Pan, Aleksey A. Lyalin, Weimin Sun, Philip John Lehtola