Abstract: A method for preparation of a high-viscosity polyester hot-melt adhesive with a partially sensitive viscosity-temperature property is disclosed, including the steps of: i) subjecting terephthalic acid, isophthalic acid, dodecanedioic acid, adipic acid, butanediol, dipropylene glycol and hexanediol to an esterification reaction in the presence of tetrabutyl titanate serving as a catalyst; and ii) adding an antioxidant to a product resulting from step i) to conduct a polycondensation reaction under a reduced pressure so as to obtain the high-viscosity polyester hot-melt adhesive which has a low melting point of 130° C.-135° C. and a partially sensitive viscosity-temperature property.

Abstract: The present invention relates to a curing agent for moisture-curing compositions which includes at least one aqueous emulsion of at least one epoxy resin. Curing agents according to the invention are especially used for the accelerated curing of moisture-curing compositions which are based on polyurethane polymers that have isocyanate groups or of silane-functional polymers.

Abstract: The instant invention provides a polyolefin composition suitable for sealant applications, sealant compositions, method of producing the same, and films and multilayer structures made therefrom. The polyolefin composition suitable for sealant applications according to the present invention comprises: an ethylene/?-olefin interpolymer composition having a Comonomer Distribution Constant (CDC) in the range of from 40 to 110, vinyl unsaturation of less than 0.1 vinyls per one thousand carbon atoms present in the backbone of the ethylene-based polymer composition; a zero shear viscosity ratio (ZSVR) in the range of from 1.01 to 2.0; a density in the range of from 0.908 to 0.922 g/cm3, a melt index (I2 at 190° C./2.16 kg) in the range of from 0.5 to 5.0 g/10 minutes, a molecular weight distribution (defined as the weight average molecular weight divided by the number average molecular weight, Mw/Mn) in the range of from 2.0 to 4.0, and tan delta at 0.1 radian/second, determined at 190° C.

Abstract: The present application provides agents for producing an impact-modified epoxy adhesive encompassing at least two components A and B packaged separately from each other, wherein (a) component A contains at least one compound having two or more isocyanate groups together with one or more further additives, (b) component B contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, together with one or more further additives, (c) at least one of components A and/or B contains at least one epoxide prepolymer as an additive, (d) at least one of components A and/or B contains at least one latent hardener for epoxide prepolymers as an additive, and (e) components A and B contain no blowing agent that is capable of being heat activated.

Abstract: The invention relates to a two-component composition, including a component A, which includes at least one silane-functional polymer and at least one hardener or accelerator for epoxy resins, and a component B, which includes at least one aqueous emulsion of at least one epoxy resin. Two-component compositions according to the invention are suitable as adhesives, sealants or coatings.

Abstract: Use of biologically-derived polyphenols for the preparation of epoxy resins is described. Examples of biologically-derived polyphenols include resveratrol, genistein, daidzein, and polyphenols synthesized from tyrosine. Because the epoxy resins are prepared from biologically-derived materials, they provide epoxy resins that will degrade into biologically harmless materials. The epoxy resins can be used to provide coating compositions.

Abstract: The present invention relates to styrenated phenol useful as a curing agent or a plasticizing agent for an epoxy resin. More particularly, it relates to use of styrenated phenol, which has viscosity and curing properties similar to those of nonylphenol and exhibits superior curing properties for an epoxy resin, as a curing agent or a plasticizing agent for an epoxy-cured paint.

Abstract: The present invention concerns a two-part sizing composition comprising: (A) A precursor comprising: (a) An aminosilane (e.g. A1100) and (b) a polymer or copolymer containing carboxylic acid and/or anhydride, both having a functionality, F?3, and (B) A binder comprising a multi-functional epoxy resin of functionality, F?3. Glass fibres sized with the reaction product of the above composition yield a higher resistance to hydrolysis of polymeric matrix composite materials reinforced with such fibres. The sizing composition of the present invention is particularly advantageous for use with polyester resins, such as PET.

Abstract: Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, particularly low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy and composition of which does not require additional silane coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including at least one alkoxysilyl group and at least two epoxy groups, a method for preparing the same by epoxide ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved. Thus, the composite exhibits good heat resistance properties and the cured product exhibits good flame retardancy.

Abstract: To provide a process for producing an acrylic rubber/fluorinated rubber composition, capable of forming a layer excellent in the interlayer-adhesion with a layer formed by crosslinking a fluorinated rubber. A process for producing an acrylic rubber/fluorinated rubber composition having particles of a crosslinked acrylic rubber (B) dispersed in a continuous phase of a fluorinated rubber (A), which comprises kneading a fluorinated rubber (A), a crosslinking agent for an acrylic rubber and a crosslinking coagent for an acrylic rubber to obtain a fluorinated rubber composition containing the crosslinking agent for an acrylic rubber and the crosslinking coagent for an acrylic rubber, and kneading under heating the obtained fluorinated rubber composition and an acrylic rubber (B) in a mass ratio of fluorinated rubber (A)/acrylic rubber (B)=5/95 to 50/50 to crosslink the acrylic rubber (B), and dispersing particles of the crosslinked acrylic rubber (B) in a continuous phase of the fluorinated rubber (A).

Abstract: The present invention relates to hydrophilic, i.e., water loving coatings (hereafter referred to as “WLC”). Polyurethane epoxy alkylene oxide coatings usable as coatings on for example, medical devices are a preferred WLC.

Abstract: The present invention relates to compounds comprising the epoxide functional reaction product of: (a) at least one molecule comprising two terminal epoxy-reactive moieties; with (b) two molecules comprising two epoxide moieties; wherein, said compound comprises, pendent to the residue of (a) (i.e. as a side chain of the molecule), one or more polyoxyalkylene or polyoxyalkylene alkyl ether radical(s) having a weight average molecular weight of at least 400. Also provided are aqueous coating compositions comprising such compounds.

Abstract: A resin composition for producing a composite part, comprising a first resin component comprising a glycidyl ether epoxy resin, a second resin component comprising a naphthalene based epoxy resin, and an amino-phenyl fluorene curative; wherein the epoxy resin components a) and b) contain up to 33 wt % of the second resin component.

Abstract: Fiber reinforced epoxy resin composites are produced using a specific epoxy resin system. The epoxy resin system contains at least one polyglycidyl ether of a polyphenol. The system also contains a hardener that contains a mixture of aminocyclohexanealkylamine and polyalkylene polyamine hardeners. The ratio of epoxy resin groups to amine hydrogen groups is from 1.05 to 1.50. The epoxy resin system contains a tertiary amine catalyst such as a tertiaryaminophenol, a benzyl tertiary amine or an imidazole compound.

Abstract: A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol. The system also includes a hardener mixture containing mainly polyethylene tetraamines. The system includes one or more of i) alkali metal salts, ii) carboxylic acid-, carboxylic anhydride- or carboxylic acid ester-substituted phenol compounds, iii) an amino as a catalyst. The system has beneficial curing characteristics that make it useful for producing fiber-reinforced composites in a resin transfer molding process.

Abstract: Disclosed is a vinyl polymer powder which is superior to dispersibility to curable resin compositions, which immediately gives a gel state for curable resin compositions by short-time heating with predetermined temperature, which is with high ion concentration, and which is useful as a pre-gel agent suitable for fields of electronic materials, to provide a curable resin composition comprising the vinyl polymer powder, and to provide a cured substance of the curable resin composition. The vinyl polymer powder of the present invention has an acetone-soluble component of 30% by mass or more, mass average molecular weight of the acetone-soluble component of 100,000 or more, a content of an alkali metal ion of 10 ppm or less, and a volume average primary particle size (Dv) of 200 nm or more.

Abstract: An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.

Abstract: The present invention relates to a curable coating composition, comprising: (a) a curable coating resin comprising thiol-reactive groups, (b) a thiolated norbornene curing agent for the curable coating resin, the thiolated norbornene curing agent comprising on average at least 1.0 thiol group per molecule, and (c) an accelerator for accelerating the reaction between the thiol reactive-groups on the curable coating resin and the thiol groups on the thiolated norbornene curing agent. These coating compositions can be cured at ambient temperature and provide a coated surface that can be walked on after only a couple of hours. The coating compositions in general have a VOC below 250 g/L. The coating compositions can be used for the protection of large steel structures, such as ships, buildings, bridges, industrial plants, and oil production installations.

Abstract: A polyamide composition comprising a reaction product of: a) an excess of a polyfunctional amine; b) a dimer fatty acid; and c) a monomer fatty acid is disclosed. The polyamide composition can be used as a hardener in epoxy resin formulations.

Abstract: The present invention provides a coating composition, a process for producing the same, one or more coating layers derived therefrom, and articles comprising one or more such coating layers. The coating composition according to the present invention comprises: (a) from 10 to 90 percent by weight of an aqueous, high-solid, solvent-free alkyd dispersion comprising: (i) from 40 to 70 percent by weight of one or more alkyds based on the total weight of the dispersion, wherein each said one or more alkyds has an acid value of less than 20 and a molecular weight (Mn) in the range of greater than 1000 Dalton; (ii) from less than 10 percent by weight of one or more surfactants, based on the total weight of the dispersion; and (iii) from 30 to 55 percent by weight of water, based on the total weight of the dispersion; wherein said aqueous, high-solid, solvent-free alkyd dispersion has an average particle size diameter in the range of from 0.