Abstract: The present invention relates to hydrophilic, i.e., water loving coatings (hereafter referred to as “WLC”). Polyurethane epoxy alkylene oxide coatings usable as coatings on for example, medical devices are a preferred WLC.

Abstract: The present invention relates to a process for producing a resin composition for an optical semiconductor from a powdery material and a liquid material using a kneader having a first supply port and a secondary supply port disposed at a downstream side of the first supply port, the process including: a step of supplying the powdery material into the kneader from the first supply port and delivering the powdery material to a second supply port side by the kneader at a temperature at which the powdery material is not melted; a step of melting the powdery material by heating and simultaneously supplying the liquid material from the second supply port under a pressure higher than a pressure in the kneader to knead a melted product of the powdery material and the liquid material; and a step of further kneading a kneaded product thereof while cooling.

Abstract: Provided is a dielectric material having a non-halogenated diaminodiphenylsulfone curing agent.

Abstract: A condensation product of at least one (hydroxymethyl)phenol and at least one polyoxyalkylene diamine and a process for the preparation thereof and the use thereof in the curing of epoxy resin systems are described.

Abstract: The present invention generally relates to self healing polymer materials comprising thermoset and thermoplastic polymers. The present invention also relates to a method of manufacturing self healing polymer materials, methods of post-curing and healing the self healing polymer materials, composite materials comprising self healing polymer materials and methods of preparing the composite materials. In an attempt to develop improved structural materials, polymers and polymer materials have been identified that can be used in materials to act as self healing agents to repair structural damage occurring in the materials. The self healing polymer materials that have been identified are capable of being healed under post-curing or healing conditions.

Abstract: Provide is a cross-linked polymer which is a polymer of a water-soluble ethylenically unsaturated monomer, the cross-linked polymer being cross-linked by a water-soluble crosslinking agent. An aqueous liquid with a pH of 6.8 to 7.0 consisting of water and 1.0% by mass of the cross-linked polymer has an equilibrium compliance at 25° C. of 5.2×10?4 to 1.0×10?1 (1/Pa), while an aqueous liquid with a pH of 6.8 to 7.0 consisting of water and 0.2% by mass of a corresponding cross-linked polymer has a viscosity at 25° C. of 200 mPa·s or more.

Abstract: A plurality of particles comprising an elastomer-modified crosslinked aromatic epoxy vinyl ester polymer, wherein a particle from the plurality of particles maintains at least 50 percent of its height under a pressure of 1.7×107 Pascals at a temperature of at least 150° C. is disclosed. Mixtures of the plurality of particles and other particles, fluids containing the plurality of particles, methods of making the plurality of particles, and methods of fracturing a subterranean geological formation are also disclosed.

Abstract: Embodiments include a curable composition comprising an epoxy resin, a non-halogen flame retardant agent comprising at least two of an aryl-cyanato group and at least two of a phosphorus group, and a styrene and maleic anhydride copolymer. Embodiments include method of preparing the curable composition, prepregs that include a reinforcement component and the curable composition, and an electrical laminate formed with the curable composition.

Abstract: The present disclosure is directed to an anticrater additive that is useful for providing a smooth surface to a cured layer of an electrocoating composition on a substrate. The anticrater additive comprises the reaction product of a polyisocyanate with an acrylic polymer having one isocyanate reactive functional group. The acrylic polymer can be an acrylic polymer that is terminated with a chain transfer agent. Also disclosed is an electrocoat composition comprising the anticrater additive and a substrate coated with a cured layer of the electrocoat composition.

Abstract: A partially esterified epoxy resin and an epoxy resin composition applied with the same, and a method for preparing the composition are provided. The preparation method includes the following steps. A bifunctional epoxy resin and an anhydride are mixed and heated, wherein the number of equivalent moles of the bifunctional epoxy resin is greater than that of the anhydride, to form a partially esterified epoxy resin. A curing agent is mixed into the partially esterified epoxy resin to form a mixed solution. The mixed solution is cured to form the partially esterified epoxy resin composition.

Abstract: Disclosed is a semiconductor device consisting of a lead frame or a circuit board, at least one semiconductor element which is stacked on or mounted in parallel on the lead frame or on the circuit board, a copper wire which electrically connects the lead frame or the circuit board to the semiconductor element, and an encapsulating material which encapsulates the semiconductor element and the copper wire, wherein the wire diameter of the copper wire is equal to or more than 18 ?m and equal to or less than 23 ?m, the encapsulating material is composed of a cured product of an epoxy resin composition, the epoxy resin composition contains an epoxy resin (A), a curing agent (B), a spherical silica (C), and a metal hydroxide and/or metal hydroxide solid solution (D), and the semiconductor device is obtained through a step of encapsulating by the epoxy resin composition and molding, and then segmenting the resultant into pieces.

Abstract: Disclosed are an epoxy resin composition for semiconductor encapsulation containing (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler material, (D) a hydrocarbon compound having structures of formula (1) and formula (2), and (E) a hydrocarbon compound having an ester group; and a semiconductor device including a semiconductor element encapsulated with the epoxy resin composition for semiconductor encapsulation.

Abstract: Disclosed is an epoxy resin composition used for encapsulation of a semiconductor containing an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a mold releasing agent, in which the mold releasing agent contains a compound (D) having a copolymer of an ?-olefin having 28 to 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic alcohol having 10 to 25 carbon atoms.

Abstract: An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.

Abstract: The present invention provides an overcoat film which has excellent degree of planarization by optimizing the molecular weight of a binder resin included in a thermally curable resin composition for a protective film and the content of each component including the same. In a color filter according to the present invention, it is not necessary to light up all the red, green, and blue (RGB) pixels for eliciting a white light and perform a separate application process of a white portion because an overcoat film according to the present invention may serve as the white portion.

Abstract: A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption.

Abstract: It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.

Abstract: An epoxy oxazolidone including the reaction product of (a) a divinylarene dioxide, and (b) an excess of a polyisocyanate to provide an epoxy oxazolidone composition; wherein the composition has an oxazolidone selectivity of greater than 40% relative to the total of the carbonyl compounds; a process for making the epoxy oxazolidone; and a curable epoxy resin composition including (i) the epoxy oxazolidone derived from a divinylarene dioxide such as divinylbenzene dioxide (DVBDO) and a polyisocyanate, (ii) at least one curing agent; and/or (iii) a catalyst. The cured product made from the above epoxy resin composition is thermally stable and offers improved properties such as a lower viscosity and a high heat resistance compared to known cured products prepared from known epoxy resins.

Abstract: Disclosed is a thermoplastic melt-mixed composition including: a) a polyamide resin; b) a poly(amino acid)-polyol compound provided by reacting: b1) one or more amino acids selected from the group consisting of primary amino acids and secondary amino acids and combinations of these; the amino acid having no more than one hydroxyl group; and b2) one or more polyepoxy compound comprising at least two or more epoxy groups; the poly(amino acid)-polyol compound having a range of at least 10 percent conversion of epoxy equivalents of component (b1) up to, but excluding, the gel point of the components b1) and b2) and c) reinforcing agent; and, optionally, d) polymeric toughener; and f) further additives. Processes for making the composition are also disclosed.

Abstract: Disclosed herein are functionalized polymers comprising ethylene and substituted ethylene segments, which have been modified by epoxidation to enhance their crosslinking ability. These functionalized polymers are useful as film forming resins in cathodic electrocoating compositions. Also disclosed herein are aqueous dispersion compositions comprising the functionalized polymers and a process for coating various electrically conductive substrates.