Abstract: In accordance with some embodiments of the present invention, a composite material is prepared by blending a flame retardant modified cellulosic nanomaterial (FR-CN) filler into a polymer, wherein the FR-CN filler comprises a cellulosic nanomaterial (e.g., cellulose nanocrystals (CNCs) and/or cellulose nanofibrils (CNFs)) having a surface functionalized to incorporate a phosphorus-containing moiety. In some embodiments, the FR-CN filler is prepared by reacting hydroxyl groups on the surface of the cellulosic nanomaterial and a halogenated phosphorous-containing monomer (e.g., diphenyl phosphoryl chloride). In some embodiments, the surface of the cellulosic nanomaterial is further functionalized to incorporate an orthogonal functionality selected to enhance the compatibility of the FR-CN filler with the polymer by reacting hydroxyl groups on the surface of the cellulosic nanomaterial and a monomer (e.g., epichlorohydrin when the polymer is an epoxy-based polymer).

Abstract: The present invention relates to novel high-latency liquid hardeners for hardening of curable polymer resins, especially epoxy resins, and to epoxy resin compositions comprising liquid hardeners for the production of fiber composite materials.

Abstract: The present invention is a solventless one liquid type cyanate ester-epoxy resin composition having high thermal resistance as well as excellent storage stability and curing properties, which contains (A) cyanate ester, (B) epoxy resin, (C) guanidine compounds and (D) at least one kind of phenol compounds selected from a group consisting of phenol compounds represented by the following general formulae. In the general formulae, 1 is an integer selected from 0 to 4, R1 represents an unsubstituted or fluorine-substituted monovalent hydrocarbon group.

Abstract: Coating compositions can be prepared from an acrylic grafted polyether resin, wherein the smallest difunctional hydroxyl phenyl segment used to form the acrylic grafted polyether resin has a molecular weight greater than about 500, and wherein the smallest difunctional hydroxyl phenyl segment used to form the acrylic grafted polyether resin does not comprise two or more non-impaired hydroxyl groups attached to two or more different five-membered or six-membered carbon atom rings in a segment having a molecular weight less than about 500. The acrylic grafted polyether resin can be prepared by reacting a dihydroxyl compound and/or a diamine compound with a phenol stearic acid compound to produce a diphenol, reacting the diphenol with a diglycidyl ether compound to form a polyether resin, and mixing the polyether resin with an ethylenically unsaturated monomer component in the presence of an initiator to form the acrylic grafted polyether resin.

Abstract: A prepreg includes; agent-coated carbon fibers coated with a sizing agent; and a thermosetting resin composition impregnated into the sizing agent-coated carbon fibers. The sizing agent includes an aliphatic epoxy compound (A) and an aromatic epoxy compound (B1). The sizing agent-coated carbon fibers are in a shape of woven fabric or braid. The thermosetting resin composition includes a thermosetting resin (D), a thermoplastic resin (F), and a latent hardener (G). The sizing agent-coated carbon fibers have an (a)/(b) ratio in a certain range where (a) is the height of a component at a binding energy assigned to CHx, C—C, and C?C and (b) is the height of a component at a binding energy assigned to C—O in a C1s core spectrum of the surfaces of the sizing agent-coated carbon fibers analyzed by X-ray photoelectron spectroscopy.

Abstract: A condensation product of at least one (hydroxymethyl)phenol and at least one polyoxyalkylene diamine and a process for the preparation thereof and the use thereof in the curing of epoxy resin systems are described.

Abstract: The present disclosure relates to a curable system comprising at least two compositions (A) and (B) where composition (A) comprises an epoxy resin, an inorganic thixotropic agent, an organic gelling agent and a filler and composition (B) comprises a hardener, an inorganic thixotropic agent, an organic thixotropic agent and filler. The curable system may be used in the manufacture of components or parts of electrical equipment.

Abstract: An inflatable implant is disclosed. The inflatable implant comprises at least one inflation channel for forming an inflatable structure of the inflatable implant; and an inflation media disposed within the at least one inflation channel, wherein the inflation media comprises a mixture of an epoxy resin and a hardener, the mixture is configured to gel at about 37° C in less than about 2.5 hours after mixing to form a gelled mixture.

Abstract: A quaternary phosphonium salt, an epoxy resin composition including the quaternary phosphonium salt, and a semiconductor device encapsulated with the epoxy resin composition, the quaternary phosphonium salt being represented by Formula 1:

Abstract: The present invention relates to an inkjet composition for forming transparent films, which is highly economical and environmentally friendly and has excellent physical properties, including excellent transmittance, chemical resistance, heat resistance, adhesion, jetting stability and storage stability.

Abstract: Disclosed is an aqueous adhesive agent composition which has no concern about environmental safety and can be used as an adhesive agent composition for automobile interior materials. The aqueous adhesive agent composition comprises (A) an acid-modified polyolefin resin and (B) a core-shell-type curing agent.

Abstract: A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption.

Abstract: An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140° C. The adhesive material has a heat conductivity greater than 3 W/m-K.

Abstract: The present invention relates to a adhesion promoter composition containing at least one aqueous dispersion of a solid epoxy resin; at least one polyamine; and at least one Compound V in free or hydrolytically releasable form which can enter into a condensation reaction with the polyamine. Adhesion promoter compositions according to the invention lead to an improvement in the adhesion under hot, humid conditions.

Abstract: A thermoplastic resin composition includes 1 to 200 parts by weight of an inorganic filler (C) blended with 50 to 80 parts by weight of a thermoplastic resin (A) and 20 to 50 parts by weight of a rubbery polymer having a reactive functional group (B) which together account for 100 parts by weight; wherein the thermoplastic resin (A) and the rubbery polymer having a reactive functional group (B) form a continuous phase and a dispersed phase, respectively, while the inorganic filler (C) is dispersed in the continuous phase and/or the dispersed phase; and the dispersed phase of the rubbery polymer contains fine particles with a diameter of 1 to 100 nm of a compound resulting from a reaction between the thermoplastic resin (A) and the rubbery polymer; and an area occupied by the fine particles account for 10% or more of the dispersed phase.

Abstract: Magnetically aligned carbon nanoparticle composites have enhanced electrical properties. The composites comprise carbon nanoparticles, a host material, magnetically sensitive nanoparticles and a surfactant. In addition to enhanced electrical properties, the composites can have enhanced mechanical and thermal properties.

Abstract: A homogeneous solid composition includes an aromatic epoxy resin and a poly(phenylene ether) having a number average molecular weight of 600 to 2000 atomic mass units and an average of 1.5 to 3 hydroxyl groups per molecule. The molecular weight and hydroxyl functionality of the poly(phenylene ether) allow it to be dissolved in the epoxy resin at relatively low temperature, and remain dissolved as the solution is cooled and solidified. The homogeneous solid composition facilitates incorporation of the poly(phenylene ether) into powder coating compositions that exhibit reduced water absorption in the cured state.

Abstract: The present invention relates to novel high-latency liquid hardeners for hardening of curable polymer resins, especially epoxy resins, and to epoxy resin compositions comprising liquid hardeners for the production of fiber composite materials.

Abstract: Disclosed is a non-halogen flame retardant styrene resin composition which comprises (a) a styrene resin and (b) a phosphorous-modified epoxy resin and thus exhibits superior flame retardancy to external candle flame ignition.

Abstract: A crosslinkable composition is described comprising an acid- and epoxy-functional copolymer, which when crosslinked with a triazine crosslinking agent provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles.