Abstract: Provided is a curable composition containing a reactive mixture of components including an polyethersulfone having a chemical group reactive with an epoxide, a cycloaliphatic polyepoxide resin, a polyepoxide having a functionality greater than two, a liquid diepoxide resin, a first curative containing 9,9-bis(aminophenyl)fluorene or a derivative therefrom and having a curing onset temperature of from 150° C. to 200° C. The components can further comprise a second curative having a curing onset temperature of from 60° C. to 180° C. When thermally curing this composition, the second epoxy curative starts to cure before the first epoxy curative, thereby inhibiting vertical flow of the adhesive during the curing process.

Abstract: A method for processing a thermoset resin mixed with inorganic fibers; said method comprising combining a thermoset resin, an inorganic fiber and water to produce a dispersion.

Abstract: A method of encapsulating content with calcium alginate membrane to form a capsule. The method includes embedding sodium alginate into a traditional gelatin ribbon used in gelatin encapsulation, adding calcium to a fill material, encapsulating the fill material, and then denaturing the gelatin in the shell. An exemplary use of this method is to form throwable paintballs; however, other products could be formed using this process. A paintball formed by this process is also disclosed.

Abstract: The present invention refers to a Vacuum Insulating Glazing (VIG) able to provide excellent thermal insulation to the transparent components of curtain walling systems in buildings and to cabinets for domestic or commercial refrigerators, and to a process for its manufacture.

Abstract: The present invention is to provide a monomer mixture that is cured rapidly even in the presence of oxygen and that forms a cured product having high hardness and excellent adhesion to metals and/or glass. The monomer mixture according to an embodiment of the present invention contains two or more types of cationically polymerizable monomers. As the cationically polymerizable monomers, the monomer mixture contains at least 10 wt. %, based on a total amount of the monomer mixture, of a compound having at least one cationically polymerizable group selected from the group consisting of a vinyl ether group, an epoxy group, and an oxetanyl group, and at least one hydroxy group in a molecule, and at least 5 wt. %, based on the total amount of the monomer mixture, of a compound represented by Formula (b).

Abstract: Provided is a resin composition containing: a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond; a cross-linking curing agent having an unsaturated carbon-carbon double bond in its molecule; a silane coupling agent having a phenylamino group in its molecule; and silica. A content of the silica is 60 to 250 parts by mass with respect to a total of 100 parts by mass of the modified polyphenylene ether compound and the cross-linking curing agent.

Abstract: Urea-terminated polybutadiene polymers and polybutadiene acrylonitrile copolymers useful as both accelerators and tougheners are disclosed for use in epoxy formulations cured with dicyandiamide. The inventive urea-terminated polymers achieve comparable toughness in cured epoxy formulations when compared to that achieved with traditional polymeric or rubber tougheners with little to no change in glass transition temperature. Viscosity improvement and stability over time are also an advantage. A method of preparation emphasizing aspects of reaction stoichiometry is also disclosed.

Abstract: A compressor includes a housing, and an anticorrosive coating covering a surface of the housing. The anticorrosive coating includes a base layer applied on the surface of the housing, and a surface layer applied on the base layer. Both the base layer and the surface layer are organic coatings. Thus, the housing of the compressor is effectively separated from the external environment by means of the two organic coatings, so as to ensure that the compressor is not corroded; moreover, the anticorrosive coating does not contain a metal coating, thereby preventing the problem of the compressor being severely corroded due to an exposed metal coating.

Abstract: The present invention provides a composition comprising a) at least one epoxy resin, b) at least one cyclic amine of the formula (I) in which R1 to R4 is H or an organic radical and X?—(Y1)m-(A1)n-(Y2)o-(A2)p-(Y3)q-(A3)r-(Y4)s—,??(II) where, independently of one another, m, n, o, p, q, r and s=0 or 1, A1, A2, A3=alkylene or alkenylene radical and Y1, Y2, Y3, Y4=NR5, PR5, O or S, where R5 independently=organic radical, where any two organic radicals selected from R1 to R5 and any radicals present in the alkylene and/or alkenylene radicals A1, A2, A3 may also form one or more further rings, with the proviso that at least one of the radicals selected from R1 to R5 present and any radicals present in the alkylene and/or alkenylene radicals A1, A2, A3 is substituted by at least one —NHR6 or —NH2 group, where R6=organic radical, and c) at least one salt of a very strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and unsubstituted ammonium ions, and t

Abstract: A circuit build-up film for wafer-level packaging (WLP) includes 40 to 60 parts by mass of a first epoxy resin, 15 to 30 parts by mass of a second epoxy resin, 25 to 50 parts by mass of a curing agent, 0.1 to 5 parts by mass of a curing accelerator, 5 to 20 parts by mass of an additive, 320 to 650 parts by mass of an inorganic filler, and 0.01 to 5 parts by mass of a silane coupling agent (SCA), where the additive is obtained by subjecting an epoxy resin to a reaction with a polyhydroxyl-terminated dendritic crosslinking agent. The build-up film shows prominent fluidity during heating and curing, and can completely fill gaps among wafers. A packaging process using the build-up film is simple. Regardless of the number of wafers, packaging can be completed through one procedure with the build-up film.

Abstract: An article of manufacture. The article of manufacture includes a ring-opened lactide copolymer. The ring-opened lactide copolymer is formed in a process that includes reacting a functionalized lactide monomer with a BPA-derived monomer. The reaction forms a lactide copolymer, which is reacted to form the ring-opened lactide copolymer.

Abstract: A composite material comprises a polymer matrix having microstructure filler materials that comprise a plurality of interconnected units wherein the units are formed of connected tubes. The tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, growing or depositing a material on the metal microlattice such as graphene, hexagonal boron nitride or other ceramic, and subsequently removing the metal microlattice.

Abstract: An object of the present invention is to provide an antifouling coating composition capable of forming an antifouling coating film that retains a high antifouling performance for a prolonged period of time and has an excellent damage resistance. Another object of the present invention is to provide an antifouling coating film formed with the antifouling coating composition, a substrate with an antifouling coating film and a method for producing the same, and an antifouling method using the antifouling coating film. The antifouling coating composition of the present invention contains a hydrolyzable polymer (A) containing a metal ester group, zinc oxide (B), and medetomidine (C), and has a content of the zinc oxide (B) in a solid content of the antifouling composition of 27 to 60% by mass.

Abstract: The present invention relates to a heat-curable composition comprising at least one epoxy monomer comprising two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one epoxy group, and at least one epoxy ring-opening catalyst. The composition comprises at least 50% by weight of compounds having at least one epoxy group, relative to the total weight of polymerizable compounds present in the composition and provides upon pre-curing a tack-free coating that can be removed by treatment with a solution of sodium hydroxide, and upon post-curing a coating that cannot be removed by treatment with a solution of sodium hydroxide.

Abstract: An additive composition includes a specific amount of ?-methylstyrenated phenol, can be mixed with a main material part or curing agent part for paint, and can suppress the occurrence of a discoloration issue.

Abstract: Disclosed herein are ethylene-based polymers generally characterized by a density of at least 0.94 g/cm3, a high load melt index from 4 to 20 g/10 min, a zero-shear viscosity at 190° C. from 20,000 to 400,000 kPa-sec, and a relaxation time at 190° C. from 225 to 3000 sec. These ethylene polymers can be produced by peroxide-treating a broad molecular weight distribution Ziegler-catalyzed resin, and can be used in large diameter, thick wall pipes and other end-use applications.

Abstract: Casting of non-ferrous metals, especially aluminum and magnesium, can have problems with erosion, in which molten metal contacts the mold or core surfaces during the pouring process, resulting in the sand being dislodged. Binder systems addressing this issue often use bisphenol F epoxy resin. A binder system is provided in which a major portion of the epoxy resin component is a bisphenol epoxy resin that has been modified by incorporating oxazolidone rings into an epoxy backbone of the bisphenol epoxy resin, especially a bisphenol A epoxy resin. The modification is preferably achieved by reacting the diglycidyl ether of the bisphenol with a methylene diphenyl diisocyanate.

Abstract: The present invention relates to a resin composition having a high flow property, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

Abstract: This invention outlines a method for synthesizing a blended resin system in a one pot reaction that may utilize, for example, bio-based anhydrosugars such as isosorbide as a principle component to produce isosorbide dimethacrylate and other monomeric materials for thermosetting applications. This invention establishes a one-pot procedure for reacting a hydroxy group containing compound with methacrylic anhydride in the first step and using the by-product methacrylic acid to react with glycidyl ethers to form additional methacrylate compounds in the second step. This methodology can be formulated to produce a wide array of resin systems that have controlled ratios of hydroxy group containing compound/crosslinker/reactive diluent. Additionally, the novel resin systems may be partially to fully biobased, promoting global sustainability and reducing costs, and when free radically polymerized have properties that meet or exceed their petroleum derived counterparts.

Abstract: The disclosure provides for dynamic polymers based on silyl ether exchange that are malleable and recyclable which have favorable mechanical properties and chemical resistance, methods of making thereof, and uses and applications thereof.