Patents Examined by Kregg T Brooks
  • Polymer-graphene composite, method for preparing same, and polymer-graphene composite composition using same
    Patent number: 11198752
    Abstract: The present invention relates to a polymer-graphene composite, in which a polymer has been introduced onto the surface of graphene while maintaining the structural features and mechanical properties of the graphene, thereby realizing an excellent dispersibility in an organic solvent, a method for preparing the same, and a polymer-graphene composite composition using the same.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: December 14, 2021
    Inventors: Yong Wook Kim, Won Jong Kwon
  • Thermosetting resin composition for semiconductor package and prepreg using the same
    Patent number: 11193015
    Abstract: A thermosetting resin composition having improved flowability and stiffness, and a prepreg using the same. Specifically, three kinds of fillers having different average particle diameters are combined with a binder resin system including an epoxy resin, a bismaleimide resin, a diaminodiphenylsulfone resin, and a benzoxazine resin.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: December 7, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Hwayeon Moon, Changbo Shim, Hee Yong Shim, Hyunsung Min, Won Ki Kim
  • Fluoropolymer coatings and related methods
    Patent number: 11191876
    Abstract: A coating for a medical device or appliance may include a fluoropolymer and a polyimide. Such coatings may provide a lubricious exterior surface that facilitates insertion or displacement of a medical device in a body lumen. Some coatings that include a fluoropolymer and a polyimide may, among other functions and characteristics, provide increased strength and/or durability relative to some other coatings.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: December 7, 2021
    Assignee: Merit Medical Systems, Inc.
    Inventors: William Paul McKee, Albert Hillen, Peter van der Wal
  • Waterborne epoxy coating composition
    Patent number: 11186743
    Abstract: A stable two-component waterborne coating composition comprising an epoxy component A comprising a waterborne epoxy resin, a polymeric dispersant, and pigments and/or extenders; and a component B comprising a curing agent; providing coatings made therefrom with improved anti-corrosion properties; and a method of preparing the coating composition.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: November 30, 2021
    Assignees: Dow Global Technologies LLC, Rohm and Haas Company
    Inventors: Weijun Yang, Hu Li, Longlan Cui, Siyuan Jiang, Tao Wang, Yu Cai, Jia Tang, Antony K. Van Dyk
  • Chromium-free coating composition with anti-corrosive effect for metallic substrates
    Patent number: 11186730
    Abstract: The present disclosure relates to a chromium-free coating composition including at least one binder and at least one iron(III)-tris(N,N-dithiocarbamate) complex, where the binder includes at least one synthetic resin and at least one crosslinker. The present disclosure also relates to the use of such a coating composition for the protection against corrosion of metallic substrates, a process for at least partially coating a metallic substrate with such a priming coat, a substrate at least partially coated therewith and an article or a component made of such a substrate.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: November 30, 2021
    Inventors: Hubert Theil, Andre Brosseit, Hendrik Narjes, Thorsten Gelbrich, Justina Muehlmeyer, Andrea Hoene
  • Epoxy resin emulsions for electrocoating
    Patent number: 11186734
    Abstract: An epoxy resin emulsion includes a continuous phase including an aqueous carrier and an acid. The emulsion also includes a dispersed phase including an epoxy resin. The epoxy resin is the reaction product of an amine compound and a first epoxy reactant. The first epoxy reactant itself includes the reaction product of (1) an aromatic diol monomer, (2) a di-glycidyl ether of Bisphenol A and/or a di-glycidyl ether of catechol, and (3) a C8-C18 alkyl phenolic end-capping agent. The (1) aromatic diol monomer has the structure: In this structure, each of R1-R4 is independently a hydrogen atom, a C1-C8 alkyl group, a C3-C8 cycloalkyl group, an aryl group, an aralkyl group, a halide group, a cyano group, a nitro group, a blocked isocyanate group, or a C1-C8 alkyloxy group or wherein any two or more of R1-R4 may be a fused ring.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: November 30, 2021
    Assignee: AXALTA COATING SYSTEMS IP CO., LLC
    Inventors: Xin Jin, Chun Ren
  • Coating compositions, dielectric coatings formed therefrom, and methods of preparing dielectric coatings
    Patent number: 11180674
    Abstract: The present invention relates to a powder coating composition for preparing a dielectric coating. The powder coating composition includes: (a) an epoxy functional polymer; (b) a poly-carboxylic acid functional polyester polymer reactive with the epoxy functional polymer and which has an acid value of less than 100 mg KOH/g; and (c) a poly-carboxylic acid functional (meth)acrylate polymer reactive with the epoxy functional polymer. Further, if a colorant is present, the powder coating composition comprises 35 weight % or less of the colorant, based on the total solids weight of the coating composition.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: November 23, 2021
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Anthony Michael Chasser, Paul F. Cheetham, Holli Allison Gonder, Stacey Lynn Orzech, Brian Edward Woodworth, Brent Allen Schwartz, Kevin Lee Ford
  • Resin composition and article made therefrom
    Patent number: 11174386
    Abstract: A resin composition includes: (A) a vinyl-containing polyphenylene ether resin; (B) a resin of Formula (1); and (C) an inorganic filler. Moreover, also provided is an article made from the resin composition described above, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dissipation factor, comparative tracking index, X-axis thermal expansion coefficient, and temperature coefficient of dielectric constant.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: November 16, 2021
    Assignee: Elite Electronic Material (Kunshan) Co., Ltd.
    Inventors: Chenyu Shen, Yan Zhang, Jue Tan, Rongtao Wang, Chen-Yu Hsieh
  • Storage stable epoxy prepregs from dicyandiamide solutions and methods for making the same
    Patent number: 11168189
    Abstract: The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a fiber material of a heat resistant fiber, such as a continuous fiber material or a discontinuous chopped fiber mat, infused with a thermosetting resin mixture comprising (i) at least one liquid epoxy resin; (ii) at least one epoxy novolac resin, (iii) dicyandiamide and (iv) and an adduct of a cycloaliphatic amine and a liquid epoxy resin, wherein the dicyandiamide is dissolved in the adduct of a cycloaliphatic amine and a liquid epoxy resin. The prepreg or fiber material has a shelf life of at least 30 days at ambient temperature and pressure before its Initial Tg (DSC) rises above 40° C.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: November 9, 2021
    Assignee: Dow Global Technologies LLC
    Inventors: Bharati Balijepalli, David H. Bank, Rajesh H. Turakhia
  • Saponified ethylene-vinyl ester-based copolymer composition and producing method therefor
    Patent number: 11161970
    Abstract: The purpose of the present invention is to provide: an EVOH resin-based composition (pellet) which has a desired melt viscosity without increasing the boron content, thereby being effective for surging prevention; and a method for producing the resin composition. The EVOH-based resin composition contains a boric acid compound and the boric acid compound contains tetracoordinated boron. An EVOH-based resin paste containing a boric acid compounds is brought into contact with an aqueous solution containing a boric acid compound and alkali metal salt at an elevated temperature and an elevated pressure so that the amount of alkali metal salt is from 300 to 1000 ppm based on the EVOH-based resin paste, thereby converting the boron of the boric acid compound to tetracoordinated structure.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: November 2, 2021
    Assignee: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Nobuaki Sato, Taiji Kanda, Ayano Nakashima
  • Light reflective coating for audio product and preparation method thereof
    Patent number: 11155718
    Abstract: A light reflective coating for an audio product, including the following parts by weight of constituents: 15-35 parts by weight of resin, 15-35 parts by weight of glass beads, 20-40 parts by weight of aluminum beads, 5-15 parts by weight of a solidifying agent, 10-25 parts by weight of a solvent and 1-8 parts by weight of an additive. The present invention further includes a method for preparing the light reflective coating for an audio product, adopts organic macromolecular materials having good comprehensive performances to perform optimization and combination, and improves the light reflective performance of the combination. The coating prepared with the method of the present invention has a flat, fine and smooth surface, has good gloss retention, and can satisfy the use requirements of an audio product coating for anti-corrosion, anti-weathering and the like.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: October 26, 2021
    Assignee: TYMPHANY ACOUSTIC TECHNOLOGY (HUIZHOU) CO., LTD.
    Inventors: Xiaochun Guo, Liwen Tan, Cheng Ho
  • High Tg epoxy formulation with good thermal properties
    Patent number: 11155687
    Abstract: Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: October 26, 2021
    Assignee: Isola USA Corp.
    Inventors: David Bedner, Tarun Amla
  • Self-assembly assisted additive manufacturing of thermosets
    Patent number: 11149108
    Abstract: The present invention relates to formulations including a self-assembly monomer. In particular embodiments, the self-assembly monomer provides a thermoset having beneficial viscoelastic properties for printing methodologies. Methods of making and using such formulations are also provided.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: October 19, 2021
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Kylie Manning, Mathias C. Celina, Adam Cook
  • Method for fabricating heterogeneous nickel-based catalyst on aluminum oxide support, heterogeneous nickel-based catalyst on aluminum oxide support and method for synthesizing polyetheramine
    Patent number: 11141715
    Abstract: The present disclosure provides a method for fabricating a heterogeneous nickel-based catalyst on an aluminum oxide support. The method includes a solution preparation step, a drop-cast step, a first calcining step, and a second calcining step. The solution preparation step is provided for preparing a precursor solution. The drop-cast step is provided for dropping the precursor on the support. The first calcining step is provided for obtaining an oxidation state catalyst. The second calcining step is provided for obtaining the heterogeneous nickel-based catalysts on aluminum oxide support.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: October 12, 2021
    Assignees: National Tsing Hua University, Chang Chun Plastics Co., Ltd., Chang Chun Petrochemical Co., Ltd., Darien Chemical Corp.
    Inventors: De-Hao Tsai, Hung-Yen Chang, Guan-Hung Lai, Chih-Yuan Lin, Chun-Yu Lee, Chih-Cheng Chia, Chuen-Lih Hwang, Huan-Ming Chang
  • Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board
    Patent number: 11136454
    Abstract: The present invention provides a thermosetting resin composition containing (A) a maleimide compound, (B) an epoxy resin having at least two epoxy groups in one molecule, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (E) a flame retardant dispersion.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: October 5, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Keisuke Kushida, Hiroshi Shimizu, Minoru Kakitani, Yoshikatsu Shiraokawa, Tatsunori Kaneko
  • Soluble polyfunctional vinyl aromatic copolymer, method for producing same, curable resin composition and cured product thereof
    Patent number: 11130861
    Abstract: A novel soluble polyfunctional vinyl aromatic copolymer capable of yielding a cured product or molded body having improved heat resistance, compatibility, dielectric properties, wet heat reliability and resistance to thermal oxidative degradation. Disclosed herein is a soluble polyfunctional vinyl aromatic copolymer containing structural units derived from a divinyl aromatic compound (a), styrene (b), and a monovinyl aromatic compound (c) other than styrene. The copolymer includes structural units made up of an unsaturated hydrocarbon group represented by Formula (a1) and derived from the divinyl aromatic compound (a); and the copolymer includes, at terminals thereof, predetermined amounts of specific terminal groups having a vinyl group or a vinylene bond derived from monomers (a), (b), and (c). Also disclosed is a method for producing the copolymer.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: September 28, 2021
    Assignee: NIPPON STEEL Chemical & Material Co., Ltd.
    Inventors: Masanao Kawabe, Shinichi Iwashita
  • Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the same
    Patent number: 11124614
    Abstract: A halogen-free low dielectric resin composition is provided.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: September 21, 2021
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Shur-Fen Liu, Chin-Hsien Hung, Meng-Huei Chen
  • Resin composition and uses of the same
    Patent number: 11124613
    Abstract: A resin composition and uses of the same are provided. The resin composition includes the following components: (A) a cross-linking agent of the following formula (I): (B) a polyphenylene ether resin, wherein the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond; and (C) a catalyst, wherein, R1 in formula (I) is a C6 to C16 alkyl or a C6 to C16 alkenyl, and the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: September 21, 2021
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Shur-Fen Liu, Chin-Hsien Hung
  • Attenuation material composition, attenuation material and preparation method and use thereof
    Patent number: 11118057
    Abstract: The attenuation material composition disclosed in the present disclosure comprises a room temperature vulcanized silicone rubber, an epoxy resin, a first curing agent and a second curing agent, wherein the first curing agent comprises ethyl orthosilicate and dibutyltin oxide; and the weight ratio of the room temperature vulcanized silicone rubber to the epoxy resin is (0.1-1):1.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: September 14, 2021
    Assignee: CHINA UNIVERSITY OF PETROLEUM (BEIJING)
    Inventors: Pinbo Ding, Shiqi Huang, Jianxin Wei, Bangrang Di, Feng Zhang, Lianbo Zeng, Xiangyang Li
  • Resin composition and article made therefrom
    Patent number: 11111383
    Abstract: A resin composition comprises: a vinyl-containing polyphenylene ether resin, a bis(vinylphenyl)ethane and a modification of divinylbenzene. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dielectric constant, dissipation factor, copper foil peeling strength, glass transition temperature, ratio of thermal expansion, thermal expansion coefficient, precipitation property of varnish, solder dipping thermal resistance, solder floating thermal resistance of multi-layer board, reflow thermal resistance of multi-layer board and T300 thermal resistance.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: September 7, 2021
    Assignee: ELITE MATERIAL CO., LTD.
    Inventor: Shu-Hao Chang