Abstract: Provided is an epoxy resin composition having excellent low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising a polyphenylene ether and an epoxy resin having a specific structure.

Abstract: A thermally vulcanizable pressure-sensitive adhesive comprising a chemically precrosslinked, pressure-sensitively adhesive polybutadiene-polyurethane and ground sulfur, which during the heating phase remains pressure-sensitively adhesive, does not liquefy and hence in this phase, in which the vulcanization has not yet started and the curing has not yet commenced, has shear strength at least under load to moderate low, is able to transmit forces and hence to perform holding, a process for producing it, an adhesive tape comprising this pressure-sensitive adhesive, and a process for producing the adhesive tape.

Abstract: Described herein is a process for preparing a flexible packaging material (6). The process may comprise: providing a base material (1) having a first surface (1a) and a second surface (1b), the first surface (1a) having an electrostatic ink composition (4) printed thereon; providing a sealant layer (3) on the second surface (1b) of the base material (1); providing a flexible substrate (4) on which a thermally activatable laminating layer (5) has been deposited; and contacting under conditions of heat and/or pressure the thermally activatable laminating layer (5) disposed on the flexible substrate (4) with the first surface (1a) of the base material (1) on which the electrostatic ink composition (4) is printed.

Abstract: The present disclosure provides an adduct comprising the reaction product of a residual epoxy oligomer product and a reactive compound having at least two reactive hydrogens where the residual epoxy oligomer product was obtained from a process for producing an aromatic epoxy resin. The adduct may be used in a variety of ways, such as a curing agent in a curable system containing a curable resin.

Abstract: The present disclosure provides a curable void filler composition comprising: (a) at least one epoxy resin; (b) at least one epoxy curing agent comprising a carboxylic acid anhydride compound; (c) at least one alkaline oxide and/or at least one alkaline earth oxide.

Abstract: A composition contains a mixture of 3-glycidyloxypropylalkoxysilane oligomers in a proportion of ?60% by weight based on the composition, which is storage stable over at least 8 weeks at a storage temperature of 60° C., has a colour number of ?20 mg Pt—Co/l, a pH of not less than 3.5 to not more than 6.5 and a monomer proportion of silane employed in the production of the composition of not more than 5 mol % based on the molar proportion of Si in the composition, wherein the proportion of epoxy groups bound in Si compounds and present in the composition is not less than 95 mol % based on the molar proportion of Si in the composition.

Abstract: The present invention relates to a resin composition having high miscibility between internal components, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

Abstract: A catalyst-containing particle including a core and an acidic coating layer thereon, wherein the core includes a nitrogen-containing catalyst for a thermoset polymeric system, and the acidic coating layer comprises a binder; and a method of making such particles. A curable, one-part epoxy/thiol resin composition that includes: an epoxy/thiol resin mixture including: an epoxy resin component that includes an epoxy resin having at least two epoxide groups per molecule; a thiol component that includes a polythiol compound having at least two primary thiol groups; and catalyst-containing particles dispersed in the epoxy/thiol resin mixture; wherein each particle includes a core and an acidic coating layer thereon, wherein the core includes a nitrogen-containing catalyst for the epoxy resin; and a method of curing such curable composition.

Abstract: A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2).

Abstract: A plastic foil molded part for a blister, in particular a tablet blister, comprises a transparent carrier substrate having a semitransparent function layer. The semitransparent function layer is constituted such that the plastic foil molded part has a first, visually recognizable color upon viewing in incident light and has a second, visually recognizable color upon viewing in transmitted light.

Abstract: An adduct AD obtained from the reaction of at least one novolak glycidyl ether containing an average of 2.5 to 4 epoxy groups per molecule with an amine mixture including bis(6-aminohexyl)amine and at least one amine A1 other than bis(6-aminohexyl)amine that has at least one primary amino group. Preferably, the amine mixture is a technical grade quality of bis(6-aminohexyl)amine that contains 25% to 82% by weight of bis(6-aminohexyl)amine. The adduct AD is preparable in a simple manner and without the use of solvents, and enables low-odor, low-toxicity and low-viscosity hardeners that can be processed and stored even under cold conditions. Epoxy resin compositions cured therewith very rapidly build up high binding forces and high strengths under ambient outdoor temperatures, even on substrates that are difficult to bond.

Abstract: A preparation method of thermadapt shape memory polymers includes: (1) synthesis of pendant hydroxyl groups functionalized epoxy oligomer using epoxy resin and alcohol amine; (2) synthesis of alkoxyl groups terminated silane crosslinking agent by isocyanate silane coupling agent and diamine; (3) crosslinked shape memory polymers were prepared by condensation reaction of pendant hydroxyl groups functionalized epoxy oligomer and alkoxyl groups terminated silane crosslinking agent. The thermadapt shape memory polymers show high glass transition temperatures and high tensile strength. The original shape of thermadapt shape memory polymers can be reconfigured to a new permanent shape as needed, and thus effectively solving the bottleneck problems of reprocessing or reshape in the traditional crosslinked polymers once after molding.

Abstract: A graphene oxide/polypropylene heat-resistant high-strength composite profile and a preparation method thereof. The composite profile is a graphene oxide/polypropylene-based reinforced plain weave composite resin material, which is a heat-resistant high-strength composite profile prepared from a graphene oxide/polypropylene-based woven plain weave fabric and a fiber heat-insulating material which are made into a layered spacing structure composite flat net, and a resin composite material. The preparation method comprises the following steps: preparation of a graphene oxide/polypropylene-based woven plain weave fabric; preparation of a graphene oxide/polypropylene-based reinforced plain weave composite material; preparation of a multilayer graphene oxide/polypropylene-based reinforced plain weave composite material; and preparation of a resin composite material. The present invention has the advantages of convenient operation and excellent properties.

Abstract: A light-shielding paint includes an epoxy group-containing compound, an inorganic fine particle, a coloring agent, and an amine curing agent. The ratio (A?/A) of the mass (A?) of the amine curing agent to the active hydrogen equivalent (A) of the amine curing agent and the ratio (E?/E) of the mass (E?) of the epoxy group-containing compound to the epoxy equivalent (E) of the epoxy group-containing compound satisfy 0.1?[(A?/A)/(E?/E)]?0.45.

Abstract: An object of the present invention is to provide an epoxy resin composition capable of providing a carbon fiber-reinforced composite material that is excellent in moldability, heat resistance, and mechanical properties such as tensile strength and compression strength, and a prepreg. The present invention provides an epoxy resin composition containing at least components [A] to [D] shown below: [A]: an epoxy resin having a xylene group; [B]: a glycidyl amine epoxy resin having three or more glycidyl groups in a molecule; [C]: a thermoplastic resin; and [D]: an aromatic polyamine, the epoxy resin composition containing 10 to 80 parts by mass of the component [A] and 20 to 90 parts by mass of the component [B] based on 100 parts by mass in total of epoxy resins, and also 1 to 25 parts by mass of the component [C] based on 100 parts by mass in total of epoxy resins.

Abstract: The present disclosure provides breathable films and method of making the same. The breathable films according to the present disclosure comprise a film layer comprising polymeric composition comprising equal to or less than 60 wt % of a linear low density polyethylene resin which exhibits each of the following properties: (1) a CEF fraction from 70 to 90 C of equal to or greater than 80% of the total CEF fractions; (2) a melt index, I2, measured according to ASTM D 1238 (2.16 kg @190C), in the range of equal to or greater than 2.0 g/10 min and equal to or less than 5.0 g/10 min; and (3) a melt flow ratio, 110/12, of equal to or less than 6.7.

Abstract: Provided are an adhesive composition and a film roll whereby blocking can be prevented and excellent temporary pressure bonding properties can be obtained. The adhesive composition of the present invention contains an epoxy resin, a latent curing agent, and an acrylic rubber having a carboxyl group or a glycidyl group, and the acrylic rubber phase-separates from the epoxy resin at a normal temperature and is compatible with the epoxy resin at a predetermined temperature higher than the normal temperature and lower than the curing temperature. Adhesive force is thereby reduced at the normal temperature, blocking can be prevented from occurring and excellent adhesive force can be obtained during temporary pressure bonding.

Abstract: A thermoset adhesive for bonding two materials having different linear expansion coefficients with reduced warping and without spaces being formed therebetween. The thermoset adhesive of the present invention comprises an epoxy resin, a core-shell rubber, thermally expansive microparticles, and a curing agent. The thermally expansive microparticles can have at least one or any combination of an average particle size of from 9 to 19 ?m, an expansion initiation temperature of from 70 to 100° C., and a maximum expansion temperature of from 110 to 135° C.

Abstract: The invention relates to a composition comprising (A) a heterophasic propylene copolymer and (B) an elastomer of ethylene and ?-olefin comonomer having 4 to 8 carbon atoms, wherein the heterophasic propylene copolymer consists of (a) a propylene-based matrix, wherein the propylene-based matrix consists of a propylene homopolymer and/or a propylene copolymer consisting of at least 70 wt % of propylene and at most 30 wt % of ethylene or an ?-olefin having 4-10 carbon atoms, based on the total weight of the propylene-based matrix and wherein the propylene-based matrix is present in an amount of 60 to 95 wt % based on the total heterophasic propylene copolymer and wherein the propylene-based matrix has a melt flow index of at least 0.1 dg/min and at most 45 dg/min, measured according to ISO1133 (2.16 kg/230° C.

Abstract: Fluorescent nanoparticle compositions and methods of used for dental bonded restorations are provided herein.