Abstract: Unwanted RF emissions from an imperfect enclosure surrounding an electronic apparatus are reduced by first investigating the RF field strengths inside the enclosure while the apparatus is in operation, and identifying locations where the field strengths are significantly higher than elsewhere. The field strengths at these identified locations are then lowered significantly by placing lossy materials thereat to absorb and thus dissipate RF energy. If the lossy materials are placed in the near field of the actual circuitry that generates the RF then some of that RF is dissipated according to the degree of loading, but without associated reflected energy, and without the need for the lossy material to be a free field absorber that matches the characteristic impedance of the interior of the enclosure. A hybrid arrangement also exists where the lossy material is neither a free field absorber nor located in the near field of the generator, so long as it is located in the near field of a reflector.

Abstract: An apparatus is provided to reduce the amount of EMI generated by a circuit. The grounding of an enclosure is improved by providing a number of shaped protuberances, the protuberances having an end that penetrates a conductive region of a circuit board, such that when the circuit board is mounted to the support member, the protuberances make a penetrating electrical contact and provides for additional ground paths, thereby reducing the EMI generated by the assembly.

Abstract: A flip chip integrated circuit package which provides stress relief for the solder bumps of the package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is attached to a plurality of bond pads of the substrate by a number of corresponding solder bumps. The substrate has a first layer that is attached to a second layer. An area that is located between the layers and adjacent to the bond pads is left unattached so that a portion of the first layer can move independent of the remaining portion of the substrate. The unattached area allows the integrated circuit to "float" and expand at a different rate than the substrate when the package is thermally cycled.

Abstract: The apparatus and method includes a backplane (14) and a plurality of cable connectors (16) arranged orderly on the backplane (14) to which the cables (12) are connected. A plurality of conductive groomer fingers (30) extend generally perpendicularly from the backplane (14) along at least one edge of the backplane (14), where slots of a predetermined width are defined therebetween. Each cable (12) has an EMI termination zone (32) packed in the groomer finger slots to achieve good electrical contact with the groomer fingers (30). A rear cover (34) is used to substantially enclose the backplane (14).

Abstract: A combined electronics mounting plate and heat exchanger and method of manufacturing same. The present invention provides an electronics mounting plate formed from a metal matrix composite and a metal heat exchanger in order to combine the low coefficient of thermal expansion and high heat dissipation characteristics of a metal matrix composite, with the cost effectiveness and relatively easy manufacturability of metal. In the preferred embodiment, the metal matrix composite is provided in the form of aluminum and silicon carbide, and the metal heat exchanger is provided in the form of aluminum fins. The method of manufacturing the present invention includes the steps of cleaning the metal matrix composite mounting plate and aluminum heat exchanger in a nitric acid fluoride salt before brazing the elements together.

Abstract: A container for an electronic control unit is provided for preventing heat transmission and entrance of water moisture at a low cost. An electronic control unit (1) is contained in a container (12) which is to be arranged in an engine compartment (2b). The container (12) includes a first box unit (14) and a second box unit (15). The first box unit (14) includes an inner box (20) for containing the electronic control unit (1) and an outer box (21) which defines a first heat removing space (32A) in cooperation with side walls (46a to 47b) of an upper portion of the inner box (20). The second box unit (15) is continuous with a bottom end of the outer box (21) of the first box unit (14) and defines a second heat removing space (32B) in cooperation with side walls (46a to 47b) of a lower portion of the inner box (20) and a bottom wall (48) of the inner box (20). The bottom end of the outer box (21) of the first box unit (14) and an upper end of the second box unit (15) are secured by welding.

Abstract: A multilayer circuit board unit includes a plurality of printed boards, an electronic component, an anisotropic conductive film, and a notched hole. The printed boards have printed circuits on surfaces thereof and are stacked on each other. The electronic component is mounted on at least one of the printed boards and arranged between the printed board on which it is mounted and an adjacent printed board. The anisotropic conductive film electrically connects the printed circuits of the printed boards to each other. The notched hole is formed in the adjacent printed board to correspond to the electronic component.

Abstract: A method of preventing non-uniform bonding wire sweep during an encapsulating process of an integrated circuit package includes the step of forming an encapsulating material flow restricting element between two widely spaced functional bonding wires. The integrated circuit package includes an array of electrically conductive leads for electrically connecting the package to other electrical elements and an integrated circuit die having a plurality of input/output terminal pads. A plurality of functional bonding wires electrically connects certain ones of the input/output terminal pads to associated electrically conductive leads such that the functional bonding wires have a predetermined pitch which defines an approximate minimum desired spacing between adjacent functional bonding wires. The plurality of functional bonding wires includes two widely spaced functional bonding wires which are spaced apart from one another by a distance substantially greater than the predetermined minimum desired spacing.

Abstract: An assembly for attenuating and diverting electromagnetic, radio frequency and microwave-radiation emitted from cellular and marine band telephones, which includes a completely lined EMI/RF and microwave radiation shielded protective case to fully enclose a cellular or marine band telephone, the case including at least two telescoping parts slidably connected to each other to permit insertion or extraction of a telephone, wherein an opening is formed in one of the at least two telescoping parts to permit operating the telephone inserted therein, and a shielded section formed in one of the at least two telescoping parts thereby preventing a base of the antenna from touching a users head during use; a telescoping antenna with a connector base adapted to engage antenna circuitry of a telephone; and a removable handle attached to the outside of the shielded case, the removable handle being configured and dimensioned to permit telescoping of the case and holding of the parts together for security and comfort.

Abstract: A printed circuit board includes first and second flat portions each including first and second sides for mounting a electrical elements. A bending portion joins the flat portions and bends to place the flat portions in a superposed state. A cutout having an elongate portion and an end portion is located in the bending portion. The end portion is substantially equal in width to the bending portion. The elongate portion is narrower than the bending portion. The elongate portion creates additional flat portions for mounting elements when the first and second flat portions are in the superposed state. The end portion is resistant to bending strain. The end portion may be circular, semi-circular, or another shape.

Abstract: A printed circuit board (PCB) having an epoxy barrier disposed around its throughout slot in a semiconductor chip mounting region, and a BGA semiconductor package using such a PCB, thereby exhibiting a high moisture discharge characteristic. The epoxy barrier includes a copper layer and a solder resist layer both disposed around the throughout slot and is defined by a groove which is disposed around the throughout slot while spacing apart from the periphery of the throughout slot by a desired distance. Alternatively, the epoxy barrier includes a solder resist layer formed to a desired width around the throughout slot on the uppermost layer laminated on the PCB. By virtue of the epoxy barrier, the throughout slot is not closed by epoxy resin coated over the PCB. As a result, it is possible to externally discharge moisture which expands in the PCB upon carrying out a series of processes for the fabrication of the package at a high temperature or mounting the package on a mother board.

Abstract: The bottom and side surfaces of an electronic device, such as an integrated circuit chip or a multichip assembly, are surrounded by a soft gel medium. The gel medium is laterally confined by a rigid plastic rim that is epoxy-bonded in place along its perimeter. A plate, made of plastic or metal, can be attached to the top surface of the rim, in order to provide a cover for the package.

Abstract: An enclosure for protecting a heat sensitive item from high temperatures and shock which includes: (a) an outer housing including an inner cavity for containing at least one heat sensitive item; (b) an aquarium located within the inner cavity including at least one protective compartment within which the at least one heat sensitive item is located; (c) a thermal mass, located within the inner cavity and covering at least a portion of the exterior surface of the aquarium; and (d) a venting mechanism for venting any moisture, that penetrates the aquarium and enters the at least one protective compartment included therein, to the ambient air outside the outer housing. The invention finds particular utility in the Flight Recorder field where heat sensitive components, such as solid state memories, may be subject to fire and shock often resulting from an aircraft crash.

Abstract: A charge coupled device (CCD) semiconductor chip package includes a body having a hole formed in the center thereof and a projection extending inwardly from the inner wall of the body. A plurality of outleads are embedded in the projection, and a plate is attached to the upper surface of the projection. A glass lid is attached to the upper surface of the body for covering the upper portion of the hole. A chip has a light receiving area and a plurality of solder balls, and a bottom cover fills the lower portion of the hole and supports the chip. The CCD package chip employs a direct connection technique of outleads to solder balls formed on chip pads, instead of a wire bonding process, which demands a high temperature environment. By using a price competitive plastic body, material cost is reduced compared to a costly material, such as a ceramic body, when fabricating a semiconductor package. Further, package reliability is enhanced.

Abstract: An enclosure for protecting a heat sensitive item from high temperatures and shock which includes: (a) an outer housing including an inner cavity for containing at least one heat sensitive item; (b) a thermal insulator located within the inner cavity defining at least a portion of a second interior cavity, with the at least one heat sensitive item being located within the second interior cavity; and (c) a boiler located within the second interior cavity including at least one containment compartment for containing a thermal mass and at least one protective compartment within which the at least one heat sensitive item is located. The invention finds particular utility in the Flight Recorder field where heat sensitive components, such as solid state memories, may be subject to fire and shock often resulting from an aircraft crash. The invention also features a corrosion protection capability which is effective when the item being protected is in close proximity to a source of moisture.

Abstract: An electric shielding metal shell having two symmetrical rectangular-shaped metal casings connected together to hold a receptacle and an electric wire covered within a braided earthed tubes. The metal casings each having a respective binding strip that are connected to each other to hold the braided earthed tube and the electric wire. The binding strip of each metal casing respectively extends from a respective curved suspension strip, which suspends from a bottom wall of the respective metal casing, so that the binding strips of the metal casings can be moved relative to the metal casings, for permitting the electric wire to be bent smoothly to the desired angle.

Abstract: A coil-shaped flexible printed circuit board retains its original outer diameter unchanged without any guide or retainer. For this purpose, either the conductive pattern of copper or synthetic base material is processed to have a permanent stretch before or when the board is wound into a coil shape. A squeezing step may be employed to generate the permanent stretch on the conductive pattern. Alternatively, a heat treatment of the base material may be used to form an additional bridged ingredient after the board has been wound. The additional bridged ingredient may retain the coil shape unchanged for a long time without guiding pieces.

Abstract: The present invention relates to a circuitized board having removable flexible modules disposed thereon. The flexible modules are mechanically and electrically connected to the board to provide an apertured connect, yet may be easily removed without using heat. The invention also relates to a circuit package including a substrate and a flexible module. The substrate includes a circuit board, a plurality of pads affixed to the circuit board, and a plurality of gold plated metal balls affixed atop the pads. The flexible module includes a flexible dielectric member and gold plated vias disposed in the flexible dielectric member wherein at least some of the vias are positioned over the metal balls so that a line contact is made between the vias and the metal balls.

Abstract: A novel through-hole interconnect for connecting a power plane conductor to a through-hole includes a central pad connected to the through-hole and a deformable hinge that connects the central pad with the power plane conductor in a multilayer circuit board. The central pad and hinge are defined by a non-continuous area removed from the plane conductor. Preferably this area has a C-shape. During the compression process to join the core assemblies, deformation of the hinge advantageously absorbs the shear forces and allows the power plane beyond the hinge to remain substantially planar. The resulting multilayer laminated circuit board includes a plurality of cores laminated together in a stacked configuration and a plurality of plated through-holes defined in said multilayer laminated circuit board each of which is connected to a plane conductor by a hinge deformed so that the interconnect area is aligned outside of a plane defined by the plane conductor.

Abstract: A circuitized substrate having conductive circuitry thereon and a barrier located adjacent at least portions of the circuitry to serve as an effective constraint for liquid material (e.g., encapsulant) applied to cover and protect the circuitry. The barrier can be formed concurrently with circuitry formation and formed of materials (e.g., copper, nickel, gold) similar to those used for the circuitry. The barrier is of two-part construction and of a particular shape wherein one part affords a greater surface tension than the other such that the material may actually lie on one part while being prevented from engagement with the other. Providing such dual (or "progressive") surface tensions successfully constrains the liquid material at least until solidification thereof occurs.