Abstract: A multiple chip module for packaging integrated circuit chips. It has a module body with multiple faces and covers. One of the faces has conduction pads. Each of the other faces has a chip receiving compartment. Each compartment includes at least one chip receiving section. The bottom boundary of the chip receiving section faces the center of the module body and each chip receiving section includes a base surrounding its bottom boundary for locating and bonding one of the chips. Conduction areas are provided on the base of each of the chip receiving sections for connecting with the pad windows of one of the chips and are connected with corresponding conduction pads through a layout in the module body. The covers cover the chip receiving compartments for sealing the chips therein.

Abstract: An electronic package is provided where in a semiconductor device on a substrate is encapsulated with a thermally reworkable encapsulant composition including:(a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and(b) at least one filler present from about 25 to about 75 percent by weight based upon the amount of components (a) and (b). Such a process provides a readily reworkable electronic package.

Abstract: The invention provides a multilayer microelectronic circuit board including a laminate of a plurality of circuit layers containing conductive vias within the layers or a combination of conductive vias and conductive wiring patterns on a surface of the layers, the layers comprising a first liquid crystal polymer and, interposed between said circuit layers, a layer of second liquid crystal polymer having a melting point of at least about 10.degree. C. lower than the melting point of the first liquid crystal polymer.

Abstract: An IC career includes a movable corner ruler for regulating one of the two diagonally opposed corner portions which are situated on opposite corners of an IC, and a reference ruler for regulating the other corner portion. The movable ruler is resiliently retained by a first and a second plate spring extending along the two sides forming the first-mentioned corner portion of the IC such that the first-mentioned one corner portion is resiliently urged towards the reference corner ruler. The first and second plate springs are connected with each other through a connection piece integrally blanked together with the first and second plate springs, and internal ends of the first and second plate springs extend from connection portions with respect to the connection piece so as to define free ends.

Abstract: An enclosure and a method of making an enclosure for electromagnetic shielding of electronic circuitry contained therein. The enclosure is a carbon fiber composite having a removable panel which is assembled to the enclosure body through mating surfaces which are in electrical contact, and an electrically conductive ground strap extends from the mating surfaces to an inlet port for a cable connector. The ground strap is grounded via the cable connector.

Abstract: In a data processing apparatus, communication apparatus or similar electronic apparatus, a laminate wiring board has a signal layer having a ground area and interposed between a signal layer and a power supply layer. Therefore, there is no need to provide a ground layer between the signal layer and the power supply layer. The wiring board can therefore be implemented with a small number of layers and is free from faults ascribable to extra layers.

Abstract: A cross polarized electromagnetic interference shield apparatus for an electronic device having a Faraday cage made of two sets of planar conductive plates. Each of the two sets of planar conductive plates have parallel aligned elongated apertures which are not aligned in the same direction, and are spaced apart at a predetermined distance. This arrangement provides improved EMI attenuation and improved air flow over prior planar EMI shields, at a lower cost than prior honeycomb shields.

Abstract: A chassis for containing a circuit board and a method of mounting a circuit board to a chassis.

Abstract: An electronic control module (10) includes a package substrate (12) having an interior cavity (28) through which a package lead (22) traverses. The interior cavity (28) is filled with an expandable polymer material (34). The expandable polymer material (34) is constrained within the cavity by a pressure resistive layer (32, 35) that overlies expandable polymer material (34) In one embodiment, an epoxy layer (32) forms an upper surface of the interior cavity (28). The expandable polymer material (34) is responsive to a fluid, such that upon contact with a fluid diffusing along the package lead (22), the expandable polymer material (34) will swell and form a fluid-tight pressure seal around the package lead (22). The fluid-tight pressure seal prevents the fluid from diffusing to interior portions of the electronic control module (10) and causing the failure of electronic components (18) mounted within the electronic module (10).

Abstract: A polyimide multilayer wiring substrate that includes a plurality of wiring layer blocks, each of which include a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by way of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting the anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure including N pieces of wiring layer blocks.

Abstract: A computer chassis has an exterior wall on the inner side of which a metal EMI shield wall is mounted, the shield wall having a grounding portion that projects outwardly through the chassis wall. A selected one of a plurality of circuit boards may be operatively installed within the chassis, the circuit boards having mutually different through-chassis component connection access opening requirements. Circuit board component connection access openings are formed through the exterior chassis and EMI shield walls to accommodate the circuit board having the maximum access opening requirement. To modify the effective chassis connection opening pattern as required for the other circuit boards, without having to redesign the chassis for each of the other circuit boards, a plurality of metal cover grounding plates are provided. Each of the plates is associated with one of the circuit boards and has connection openings formed therein to match the chassis opening requirements of the associated circuit board.

Abstract: An enclosure for electronic circuits intended to operate at great depths beneath the sea in which the circuits are protected from stresses induced by the accumulation of mechanical tolerances during assembly, from shock during transportation, and from deformation of the enclosure at great pressure. The circuits being accessible in their final configuration during testing before insertion into the enclosure and sealing. Cable lengths within the enclosure are minimized to ensure reliability.

Abstract: An electronic component mounting holder for surface mounting of an electronic component having a plurality of tape leads, includes a non-conducting three dimensional rectangular frame having vertical peripheral walls formed of nonconducting material for receiving an electronic component having a plurality of tape leads, the peripheral walls having a top peripheral edge and a bottom peripheral edge, a support ledge extending inward from inner surface of said peripheral wall for supporting an electrical component, a coil formed of foil windings having leads formed by extensions of said foil windings, a plurality of tape lead receiving areas formed in at least two sides of said bottom peripheral edge, said receiving areas each positioning a tape lead for surface bonding to a conductor on a PC board, a plurality of lead receiving recesses formed in corresponding sides of said top peripheral edge for receiving an outermost end of a tape lead, and a retainer for mounting in engagement with latch means in said frame

Abstract: A strain relief bulkhead that provides EMI shielding for data cables being inserted into cabinets, including a conductive vise, slidably mounted on a stationary guide track that is permanently attached to a bracket made of conductive material to which a conductive cover panel is removably fastened. In a preferred embodiment the vise is moved along the guide track by a threaded screw which extends through threaded openings in the guide track. A C-ring holds the end of the screw to the vise. The bracket containing the vise and guide track is fastened to the cabinet which houses the printed circuit boards by screws or other means. The vise is located on the guide track and the guide track is attached to the bracket in such a way as to provide cable openings through which cables can be inserted.