Abstract: A semiconductor package device includes a first semiconductor package, a second semiconductor package, and first connection terminals between the first and second semiconductor packages. The first semiconductor package includes a lower redistribution substrate, a semiconductor chip, and an upper redistribution substrate vertically spaced apart from the lower redistribution substrate across the semiconductor chip. The upper redistribution substrate includes a dielectric layer, redistribution patterns vertically stacked in the dielectric layer and each including line and via parts, and bonding pads on uppermost redistribution patterns. The bonding pads are exposed from the dielectric layer and in contact with the first connection terminals. A diameter of each bonding pad decreases in a first direction from a central portion at a top surface of the upper redistribution substrate to an outer portion at the top surface thereof. A thickness of each bonding pad increases in the first direction.

Abstract: An integrated circuit structure is provided. The integrated circuit structure includes a die that contains a substrate, an interconnection structure, active connectors and dummy connectors. The interconnection structure is disposed over the substrate. The active connectors and the dummy connectors are disposed over the interconnection structure. The active connectors are electrically connected to the interconnection structure, and the dummy connectors are electrically insulated from the interconnection structure.

Abstract: The present disclosure relates to an artificial intelligence chip for processing computations for machine learning models that provides a compute node and a method of processing a computational model using a plurality of compute nodes in parallel. In some embodiments, the compute node, comprises: a communication interface configured to communicate with one or more other compute nodes; a memory configured to store shared data that is shared with the one or more other compute nodes; and a processor configured to: determine an expected computational load for processing a computational model for input data; obtain a contributable computational load of the compute node and the one or more other compute nodes; and select a master node to distribute the determined expected computational load based on the obtained contributable computational load. Consequently, learning and inference can be performed efficiently on-device.

Abstract: A semiconductor device includes a semiconductor layer of a first conductivity type. A well region that is a second conductivity type well region is formed on a surface layer portion of the semiconductor layer and has a channel region defined therein. A source region that is a first conductivity type source region is formed on a surface layer portion of the well region. A gate insulating film is formed on the semiconductor layer and has a multilayer structure. A gate electrode is opposed to the channel region of the well region where a channel is formed through the gate insulating film.

Abstract: An embodiment device includes: a first dielectric layer; a first photonic die and a second photonic die disposed adjacent a first side of the first dielectric layer; a waveguide optically coupling the first photonic die to the second photonic die, the waveguide being disposed between the first dielectric layer and the first photonic die, and between the first dielectric layer and the second photonic die; a first integrated circuit die and a second integrated circuit die disposed adjacent the first side of the first dielectric layer; conductive features extending through the first dielectric layer and along a second side of the first dielectric layer, the conductive features electrically coupling the first photonic die to the first integrated circuit die, the conductive features electrically coupling the second photonic die to the second integrated circuit die; and a second dielectric layer disposed adjacent the second side of the first dielectric layer.

Abstract: Provided are a display panel and a display device. The display panel includes a display area, a non-display area and a polarizer. The non-display area includes a fan-out area and a bonding area arranged in a direction facing away from the display area. The fan-out area includes a first section and a second section. The second section is a bending area. The first section, the second section and the bonding area are arranged in a first direction. A side of the polarizer facing towards the fan-out area is provided with multiple first openings. The bending area and the bonding area are covered with a protective glue which further extends to an edge of the polarizer in the first section.

Abstract: The present disclosure provides a method of manufacturing a semiconductor package assembly. The method includes steps of providing a plurality of first dies arranged horizontally; forming a redistribution layer on the first dies and the first insulative material, wherein the redistribution layer is divided into a first segment and a second segment electrically isolated from the first segment; mounting a plurality of second dies on the first segment of the redistribution layer; depositing a second insulative layer on the second dies and the redistribution layer; and forming a plurality of conductive plugs penetrating through the second insulative material and contacting the second segment of the redistribution layer.

Abstract: A display device includes: a substrate; a display area including pixels arranged on the substrate; a first area disposed at one side of the display area; a second area including pads arranged on the substrate; a bending area disposed between the first area and the second area; and a fan-out line disposed in the first area, the bending area, and the second area. The fan-out line includes: a plurality of sub-routing lines arranged in the first area and electrically connected to each other; and a plurality of sub-pad lines arranged in the second area and electrically connected to each other. The number of the plurality of sub-routing lines is greater than the number of the plurality of sub-pad lines.

Abstract: A display apparatus in which a thin film transistor of each pixel region includes an oxide semiconductor pattern is provided. The pixel regions can be disposed on a display area of a device substrate. The display area can be electrically connected to the gate driver by gate lines. An encapsulating element can be disposed on the thin film transistor of each pixel region. The encapsulating element can extend beyond the display area. The gate lines can overlap the encapsulating element. A barrier line can be disposed between the gate lines and the encapsulating element. The barrier line can include a hydrogen barrier material. Thus, in the display apparatus, the characteristics deterioration of the thin film transistor due to the encapsulating element can be prevented or minimized.

Abstract: Described examples include a sensor device having at least one conductive elongated first pillar positioned on a central pad of a first conductor layer over a semiconductor substrate, the first pillar extending in a first direction normal to a plane of a surface of the first conductor layer. Conductive elongated second pillars are positioned in normal orientation on a second conductor layer over the semiconductor substrate, the conductive elongated second pillars at locations coincident to via openings in the first conductor layer. The second conductor layer is parallel to and spaced from the first conductor layer by at least an insulator layer, the conductive elongated second pillars extending in the first direction through a respective one of the via openings. The at least one conductive elongated first pillar is spaced from surrounding conductive elongated second pillars by gaps.

Abstract: An organic light emitting display device including a plurality of pixels having a first sub-pixel and a second sub-pixel comprises a base substrate; a first anode disposed on the base substrate in the first sub-pixel; a second anode disposed on the base substrate in the second sub-pixel; an anode connection part connected to the first and second anodes; a driving transistor including a drain electrode that contacts the anode connection part and switching a driving power supplied to the first and second anodes; an organic light emitting layer disposed on the first and second anodes; a cathode disposed on the organic light emitting layer; and a dummy repair part including a plurality of metal layers overlapping each other with an insulating film interposed therebetween in a laser irradiation area, wherein at least one metal layer among the plurality of metal layers contacts the drain electrode and the cathode has an opened shape in the laser irradiation area.

Abstract: A display panel and a display device are provided, and the display panel includes a bonding area, a thin film transistor functional layer, and a conductive structure layer disposed in order. A part of the thin film transistor functional layer disposed on the bonding area includes a first inorganic layer and a plurality of signal lines. The conductive structure layer includes a second inorganic layer and a conductive layer disposed in order, and a part of the second inorganic layer disposed in the bonding area is disposed on the signal line and is directly disposed on the first inorganic layer.

Abstract: The present disclosure relates to a display device including an optical device, more specifically, it relates to a display device in which the optical device is positioned under the display panel so that the optical device is not exposed in the front direction. Even if the optical device is located under the display panel, the display device can normally perform the function of the optical device related to the front direction of the display panel and have a structure for this.

Abstract: Provided is a light-emitting diode and a method for preparing the same. The light-emitting diode includes an anode, a hole transport layer, a perovskite light-emitting layer, an electron transport layer and a cathode stacked in sequence, in which the perovskite light-emitting layer includes a first sublayer and a second sublayer stacked in sequence, with a material for forming the first sublayer including an inorganic perovskite material, and with a material for forming the second sublayer being an organic perovskite material.

Abstract: A display panel includes a base, a plurality of conductive connectors disposed on the base, a plurality of leads arranged on the base along an edge of the display panel, and at least one groove located between the conductive connectors and the edge. One end of each lead is connected to a corresponding conductive connector, and another end thereof extends to the edge of the display panel. At least one lead is divided into at least two parts by the at least one groove, and a depth of the groove is greater than or equal to a thickness of the lead.

Abstract: A foldable display device and a method of manufacturing the same are disclosed. The foldable display device includes a flexible display panel. When the flexible display panel is in a first pre-folded state, part of the flexible display panel corresponding to a folding area is under a stress less than or equal to a first predetermined threshold.

Abstract: A deposition mask group includes a first deposition mask having two or more first through holes arranged along two different directions, a second deposition mask having two or more second through holes arranged along two different directions and a third deposition mask having two or more third through holes. The first through hole and the second through hole or the third through hole partly overlap when the first deposition mask, the second deposition mask and the third deposition mask are overlapped.

Abstract: Disclosed is an organic light-emitting display device having a touchscreen in which the configuration of a pad unit and a circuit board connected to the pad unit is simplified, resulting in bonding stability and an improved form factor of the device, and a method of manufacturing the same. In the organic light-emitting display device having the touchscreen in which a touch electrode is directly provided on an encapsulation layer, a touch pad and a display pad are disposed parallel to each other on the same side so as to be connected to a flexible printed circuit board with a difference in height therebetween. Thereby, increased bonding reliability and an increased effective display area are achieved.

Abstract: Exfoliated graphite materials, and composite materials including exfoliated graphite, having enhanced through-plane thermal conductivity can be used in thermal management applications and devices. Methods for making such materials and devices involve processing exfoliated graphite materials such as flexible graphite to orient or re-orient the graphite flakes in one or more regions of the material.

Abstract: A display apparatus includes a substrate partitioned into a central area and a peripheral area disposed adjacent to the central area. The central area includes a display area; a first insulating layer corresponding to the peripheral area of the substrate; at least one slit corresponding to a region of the first insulating layer; and a cladding layer, which covers the at least one slit, on the first insulating layer.