Abstract: A memory cell array comprises memory cells disposed at intersections of a plurality of first lines disposed in parallel and a plurality of second lines disposed intersecting the first lines. The memory cell includes a variable resistance element. A set operation-dedicated first driver circuit, when executing on the memory cell a set operation for switching a memory cell from a high-resistance state to a low-resistance state, supplies a voltage to the first lines. A reset operation-dedicated first driver circuit, when executing on the memory cell a reset operation for switching the memory cell from a low-resistance state to a high-resistance state, supplies a voltage to the first lines. A length of a wiring line between the set operation-dedicated first driver circuit and the memory cell array is longer compared to a length of a wiring line between the reset operation-dedicated first driver circuit and the memory cell array.

Abstract: A flash memory capable of writing or deleting a split block is provided. A flash memory includes a memory array comprising a plurality of blocks, and a word line selection circuit, wherein each of the plurality of blocks is formed by a plurality of cell units in a well. The cell unit comprises N memory cells, a selection transistor coupled to one terminal of the memory cells, a selection transistor coupled to the other terminal of the memory cells, and a dummy selection transistor coupled between the memory cells. The word line selection circuit splits the block into a first block and a second block to use according to the operation of data writing or data deleting.

Abstract: Provided is a semiconductor device including gate structures provided on a substrate, a separation insulating layer interposed between the gate structures, and a plurality of cell pillars connected to the substrate through each gate structure. Each gate structure may include horizontal electrodes vertically stacked on the substrate, and an interval between adjacent ones of the cell pillars is non-uniform.

Abstract: The address transition detecting circuit includes two identical address transition detecting signal generating module, an inverter and a signal combining module. Both of the two address transition detecting signal generating modules have a unilateral delay circuit for generating an output pulse at the rising edge of the address signal and an output pulse at the falling edge of the address signal. The address transition detecting signal generating module can control the width of the two output pulses by controlling the delay times of the corresponding unilateral delay circuit. The signal combining module outputs the ATD signal having pulses at both the rising edge and falling edge of the address signal. The present application uses two unilateral delay circuits to control the width of the ATD signal at the rising edge and the falling edge of the address signal, thereby significantly preventing the width of the ATD signal from influence of the burr on the address line.

Abstract: Techniques are presented to detect word line failures (such as word line to word line shorts, control gate to substrate shorts, broken word lines, and so on) in non-volatile memory arrays. A first simultaneous read of multiple word lines is performed, followed by a second simultaneous read of the same word lines, where the read conditions of the two reads are shifted by a margin. For example, one of the read could use a standard read voltage on the word lines, while the other read could shift these levels slightly higher. The results of the two reads can then be compared on a bit line by bit line basis, XOR-ing the results to determine is the set of word lines may include any defective members.

Abstract: Semiconductor memory having both volatile and non-volatile modes and methods of operation. A semiconductor storage device includes a plurality of memory cells each having a floating body for storing, reading and writing data as volatile memory. The device includes a floating gate or trapping layer for storing data as non-volatile memory, the device operating as volatile memory when power is applied to the device, and the device storing data from the volatile memory as non-volatile memory when power to the device is interrupted.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell array, a buffer configured to hold data input to an input/output circuit and to hold data read from the memory cell array, and a controller configured to receive a first command and an address from the outside and to read data, in response to the first command, from a memory cell group coupled to a selected word line designated by the address to the buffer. The controller receives a second command which is input after the first command and indicates a last command of a group of commands including write commands and/or read commands, and starts a write operation from the buffer to the memory cell array in response to the second command.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell array including memory cells, word lines connected to the memory cell array to select rows of the memory cell array, first bit lines connected to the memory cell array to select columns of the memory cell array, a replica cell array including replica cells respectively connected to the word lines, and storing information on characteristics of the rows of the memory cell array, and a second bit line connected to the replica cells. An operation is changed for each row of the memory cell array based on the information in the replica cells.

Abstract: When a voltage monitoring circuit detects that a supplied voltage is in a state of being less than a certain voltage at a time of performing writing of data with respect to a memory cell of a memory core having a refresh function, a flag is set in a register circuit, an address at which the writing is performed is held, and the memory core is made to execute rewriting by a refresh operation with respect to the held address, in accordance with the flag set in the register circuit, thereby enabling an increase in speed of operation while securing a retention life of memory data, and enabling a reduction in power consumption without lowering a processing capability even if the supplied voltage is lowered.

Abstract: A variable resistance memory device includes a variable resistance memory cell, a switch that selectively passes a write voltage to an input terminal of the variable resistance memory cell, and a trigger circuit that controls the switch to cut off the write voltage from the input terminal upon determining that the variable resistance memory cell is programmed to a target state by detecting voltage fluctuation of the one side of variable resistance memory cell.

Abstract: In an exemplary aspect, the present invention provides a semiconductor memory device including sense amplifiers that drive bit lines to which memory cells are connected, and driver transistors that supply a power supply to the sense amplifiers, wherein the sense amplifiers are arranged in rows and constitutes a first sense-amplifier row in which transistors of a first conductive type are arranged and a second sense-amplifier row in which transistors of a second conductive type are arranged, and the driver transistors constitutes at least one transistor row including a first driver transistor of the first conductive type corresponding to the first sense-amplifier row and a second driver transistor of the second conductive type corresponding to the second sense-amplifier row between the first sense-amplifier row and the second sense-amplifier row.

Abstract: A plurality of integrated circuit features are provided in the context of an array of memory cells including a plurality of word lines and a plurality of bit lines. Each memory cell includes a floating body or is volatile memory. The aforementioned features may include, among others, an option whereby the foregoing bit lines may be situated below a channel region of corresponding memory cells, etc.

Abstract: A semiconductor integrated circuit according to one aspect of the present invention may includes a plurality of driving circuits to drive a respective plurality of word lines with either a first voltage supplied from a first power supply or a second voltage supplied from a second power supply in accordance with a control signal, and a plurality of gate transistors in each of which a gate is connected to one of the plurality of word lines, and a connection state between a storage node and a bit line is changed based on the voltage provided to the word line connected to the gate. In the semiconductor integrated circuit, a gate oxide film of each of the plurality of gate transistors is thinner than a gate oxide film of each of transistors constituting the plurality of driving circuits.

Abstract: A non-volatile static random access memory cell and includes a bistable regenerative circuit coupled to first and second transistors and to first and second non-volatile memory cells. Methods of use include directly transferring a complementary data bit between the non-volatile memory cell and the bistable regenerative circuit. Alternatively, complementary data from the bistable regenerative circuit may be regenerated by a sense amplifier and a second bistable regenerative circuit before being transferred to non-volatile memory cells in a column of memory cells. The bistable regenerative circuit may be reset to ground potential. Applications using the non-volatile SRAM cell with direct read out from the bistable regenerative circuit include a non-volatile flip-flop or non-volatile multiplexer.

Abstract: A nonvolatile memory device includes: a first electrode; a second electrode; and a variable resistance layer which includes: a first oxide layer including a first metal oxide; a second oxide layer located between and in contact with the first oxide layer and a second electrode including a second metal oxide and having a degree of oxygen deficiency lower than a degree of oxygen deficiency of the first oxide layer; and a local region located in the first oxide layer and the second oxide layer, having contact with the second electrode and no contact with the first electrode, and having a degree of oxygen deficiency higher than the degree of oxygen deficiency of the second oxide layer and different from the degree of oxygen deficiency of the first oxide layer.

Abstract: According to one embodiment, a non-volatile memory device includes a memory cell array and a coil provided closely to the memory cell array. The memory cell array includes memory cells provided above an underlying layer, and a first interconnection. The memory cells are aligned in a first direction perpendicular to the underlying layer. The first interconnection extends in a second direction perpendicular to the first direction. The coil includes a winding including a second interconnection extending in the second direction and sharing a central axis with the first interconnection, a first plug extending in the first direction and connected to the second interconnection, a third interconnection electrically connected to another end of the first plug and extending in a direction parallel to the underlying layer, and a second plug having one end electrically connected to the third interconnection, and extending in a direction opposite to the first direction.

Abstract: An electronic device includes a semiconductor memory unit. The semiconductor memory unit includes first lines extending along a first direction; second lines extending along a second direction that intersects with the first direction; a silicon-added metal oxide layer disposed in each intersection region of the first lines and the second lines; a metal oxide layer that is disposed alternately with the silicon-added metal oxide layer in the first direction and that is disposed in a region between two adjacent second lines and over a corresponding one of the first lines over which the silicon-added metal oxide layer is disposed; and a silicon oxide layer that is disposed alternately with the silicon-added metal oxide layer in the second direction and that is disposed in a region between two first lines and under a corresponding one of the second lines under which the silicon-added metal oxide layer is disposed.

Abstract: A nonvolatile semiconductor memory device according to one embodiment comprises: a memory cell array comprising a plurality of NAND strings, each NAND string comprising a memory string comprising a plurality of memory cells and a dummy transistor; a plurality of word lines; a dummy word line; a plurality of bit lines; a source line; and a control circuit performing an erase sequence, the erase sequence repeating an erase operation to the memory cells and the dummy transistor and an erase verify operation of confirming whether the memory cells and the dummy transistor are changed to an erased state. The control circuit is configured to be able to perform, when the erase verify operation is unpassed, a dummy transistor erase operation of selectively changing the dummy transistor to an erased state and a dummy transistor erase verify operation of confirming whether the dummy transistor is changed to an erased state.

Abstract: A memory device including at least one bit-line decoding circuit, at least one word-line decoding circuit, a plurality of memory blocks, and a plurality of switches is provided. The sizes of the plurality of memory blocks include at least one first size and a second size, and the first size is greater than the second size. The plurality of memory blocks with the first size are grouped as at least one first group, and the plurality of memory blocks with the second size are grouped as at least one second group. Compared to the first group, the second group is closer to the bit-line decoding circuit and/or the word-line decoding circuit. The switches are controlled by at least one control signal, so as to enable or disable the first group and/or the second group.

Abstract: The apparatuses and methods described herein may operate to measure a voltage difference between a selected access line and a selected sense line associated with a selected cell of a plurality of memory cells of a memory array. The voltage difference may be compared with a reference voltage specified for a memory operation. A selection voltage(s) applied to the selected cell for the memory operation may be adjusted responsive to the comparison, such as to dynamically compensate for parasitic voltage drop.