Abstract: Flexible multilayer printed circuit boards are disclosed which utilize adhesiveless laminates interconnected in a generally superposed relationship by a conductive adhesive. In one embodiment, the adhesiveless laminates have relatively thin conductive layers and metallized through holes which exhibit high delamination resistance. The metallized through holes preferably have a thickness of at most about 25 microns, yet they are capable of withstanding multilayer assembly processes. High flexibility, reliability, packaging density, and environmental resistance are consequently available in a thin multilayer construction. In a further embodiment, adhesiveless dielectric layers are interposed between adhesiveless laminates to electrically insulate portions thereof. The adhesiveless dielectric layers may define relatively small apertures therein, thus providing greater packaging density for a multilayer printed circuit board.

Abstract: A process and apparatus for producing supported conductive networks which can be flexible or rigid, having densely packed circuits. The process and apparatus for making the conductive network involves forming a conductive material supported on a "dynamic pressure cushion" into a non-planar pattern defining the desired conductive circuits in relation to a fixed reference plane. The "dynamic pressure cushion" is a material having suitable viscosity and flow characteristics to flow out from under the conductive material as it is being formed and fill up any voids. To ensure that the "dynamic pressure cushion" properly flows without deforming the desired circuits, the die used to form the conductive material is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane leaving the desired conductive circuits.

Abstract: A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.

Abstract: A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials.This copper-based paste has particular applicability to the formation of vias and lines in ceramic packages wherein the vias and lines would have a composition principally of copper with additions of the refractory metal.

Abstract: A printed circuit board arrangement and method of making the same are provided, the printed circuit board arrangement comprising a first printed circuit board having a component carrying side and an opposite printed circuit side, a second printed circuit board having a component carrying side and an opposite printed circuit side, and securing structure securing the second printed circuit board to the first printed circuit board, the securing structure comprising a plurality of conductive jumper wires each having a generally L-shaped configuration and having opposite ends one of which is secured to the printed circuit side of the second printed circuit board and the other of which is secured to the printed circuit side of the first printed circuit board.

Abstract: Fan-folded electrical leads made from copper cladded Kapton, for example, with the copper cladding on one side serving as a ground plane and the copper cladding on the other side being etched to form the leads. The Kapton is fan folded with the leads located at the bottom of the fan-folds. Electrical connections are made by partially opening the folds of the fan and soldering, for example, the connections directly to the ground plane and/or the lead. The fan folded arrangement produces a number of advantages, such as electrically shielding the leads from the environment, is totally non-magnetic, and has a very low thermal conductivity, while being easy to fabricate.

Abstract: A high voltage transformer for a television receiver includes a coil former supporting a primary winding on a magnetic core. The primary winding has an axial length L. A compartmentalized coil former supports a high voltage coil radially surrounding the primary winding. The high voltage coil has a radial outer diameter D with the ratio of L/D being less than one. A plurality of diodes are supported by the compartmentalized coil former and connect the high voltage coils in series. The diodes are supported on the compartmentalized coil former at substantially the same axial position and are equally spaced about the periphery of the compartmentalized coil former.

Abstract: A substrate or a ceramic package for packaging semiconductor chips, which comprises an insulating layer having a signal line on one surface of said insulating layer and a power line or ground line corresponding to said signal line on the other surface of said insulating layer. A well-controlled constant high frequency characteristics, and particularly, characteristic impedance, can be obtained on the signal line without being influenced by the power line or ground line.

Abstract: An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in an acid or an oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is a mixture of a thermoplastic resin and an uncured thermosetting resin or an uncured photosensitive resin.

Abstract: A laminated cylindrical backplane is constructed using disks with a conductive material mounted on a top surface, and a conductive material mounted on a second surface. Each disk and its conductive surfaces are separated from adjacent disks and their conductive surfaces by a dielectric material. The laminated structure forms a cylindrical backplane where circuit cards are radially mounted to the backplane by inserting the cards into slots in the perimeter of the cylindrical structure. The slots contain contacts where similarly positioned contacts of a particular disk are electrically connected to form a bus structure. As a result, similarly positioned conductive surfaces on circuit cards are electrically connected when the cards are inserted into the slots.

Abstract: In an electronic component chip holder comprising a body of elastomer having a plurality of through holes which are so sized as to receive a plurality of electronic component chips one by one respectively and to hold the respective electronic component chips received therein, films of a metal, for example, providing higher slidability than elastomer are formed at least on inner peripheral surfaces of the through holes. Due to such metal films, a pressure for inserting the electronic component chips in the through holes can be reduced to inhibit the electronic component chips from chipping and cracking, whereby it is possible to improve rubber hardness of the elastomer so that the electronic component chip holder can be directed to a purpose requiring heat resistance with no problem.

Abstract: A structure of the flexing section of a multilayer flexible circuit board wherein at least one layer of a flexible insulation base material is bonded, via an adhesive agent layer, between a plurality of wiring conductors on which required wiring patterns are formed with conductive foil, the flexible insulation base material of the flexing section of the multilayer flexible circuit board being provided with a non-bonded portion so that it is not bonded with the wiring conductors or another flexible insulation base material at least on one surface.

Abstract: A method and apparatus for reducing electromagnetic emissions from switching-type battery chargers safely and at low cost. The method and apparatus generally comprises enclosing the battery charger in a conductive metal case, electrically and physically isolating the low voltage, high current output components from the remainder of the circuitry, reducing the loop area of the output circuit, use of ferrite beads on various conductors, use of an output common-mode inductor wound within a ferrite core, use of inductors and transformers having foil windings, and use of a fusible resistor to protect internal circuitry. The battery charger includes a secondary assembly printed circuit board and a primary assembly printed circuit board which are supported in a spaced apart, substantially parallel arrangement.

Abstract: A termination for a flexible circuit having flat conductive strips integrally bonded to a flexible substrate. The conductive strip has a termination portion located adjacent an aperture in the substrate. The termination portion has a connection tab, with the termination portion and the connection tab lying in a plane. The termination is for connection to a conductive element end which extends through the aperture. The connection tab is formed into a shape outside the plane with the connection tab engaging the conductive element where it is secured by welding to the conductive element.

Abstract: A multilayer inductor 1 is fabricated, for example, by sandwiching a first magnetic material sheet (21) between a second magnetic material sheet (22) and a third magnetic material sheet (23) and integrating the three layers. The first magnetic material sheet (21) is preferably at least 0.2 mm thick and has a first spiral conductor pattern (31) having an extreme lead-out portion (310) formed on its upper major surface. The first sheet (21) is provided with a through-hole (4) extending between the opposed major surfaces and having a larger diameter on the conductor pattern bearing surface. The through-hole (4) is filled with a conductor (35) contiguous to the first conductor pattern (31). The second magnetic material sheet (22) has a second spiral conductor pattern (32) having an extreme lead-out portion (320) formed on its upper major surface and connected to the conductor (35) in the through-hole (4).

Abstract: An integrated circuit assembly that prevents silver migration by providing conductive rims around oxidizable silver contacts that contact a substrate. Typically the silver contacts are supported by respective metal pads on the substrate with a contact potential existing at each contact-pad junction. In many applications an electrical circuit transmits electrical signals via the contacts to produce potential differences between the contacts and create electrical fields at their surfaces. The conductive rims have a work function that is sufficiently small to reduce the electric fields and contact potentials so as to inhibit the ionization of the oxidized contacts' surfaces and prevent silver migration across the metal pads and the substrate.

Abstract: A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials. This copper-based paste has particular applicability to the formation of vias and lines in ceramic packages wherein the vias and lines would have a composition principally of copper with additions of the refractory metal.

Abstract: Improved printed wiring boards are disclosed, in which indications showing the types of electronic devices to be mounted on the printed wiring boards and other information are provided within the insulation cover coating and are protected from getting accidentally scraped off. Alignment marks are also well protected so that users can always rely on the alignment marks. The surfaces of the printed wiring boards are smooth and flat, which prevents stagnation trouble in a feeding operation of the printed wiring boards as well as helps provide a securer mounting of electronic devices. An improved wiring freedom is also provided.

Abstract: A blind hole extending from upper or surface wiring of a printed circuit board to inner or lower wiring, and having an opening larger than the bottom, is formed on a substrate, and a conductor pattern is formed on the bottom and the internal wall of the blind hole to connect the inner wiring with the surface wiring.

Abstract: An arrangement for making fatigue-free external connections to a device mounted on a direct copper bonded substrate, in which one or more connector tubes are brazed to respective copper areas on the substrate before the device is mounted on the substrate, and external connections are made by soldering leads or bus bars into the tubes.