Abstract: A computer dust filter cover comprises an open cell synthetic foam sheet formed into a bonnet-like arrangement by an elastic strap. The cover is readily attached and removed from the computer housing front or side panels to cover the disc slots while the computer is in use and without interfering with the use of the computer. The cover can remain in place when the computer is not in use to protect the interior of the housing and parts therein from contamination by particulates at all times.

Abstract: An integral solder preform is disclosed for application to a printed circuit card having first and second sides, a first edge and first and second pluralities of conductive pads disposed on the respective first and second sides of the printed circuit card in respective first and second predetermined conductive pad arrangements. The integral solder preform has first and second pluralites of solder pads having respective first and second solder pad arrangements which are maintained in position by a plurality of bridging solder bands. The first and second solder pad arrangements correspond to the first and second predetermined conductive pad arrangements and are spaced apart by a predetermined distance by spacing solder bands.

Abstract: A multilayer electronic component has a substrate having a major surface with an area which can be utilized for mounting another electronic component thereon, and external electrodes arranged with a small pitch. According to a method of manufacturing multilayer electronic components, the external electrodes can be easily formed, and the characteristics of respective multilayer electronic components in the parent laminate can be measured during manufacture.The parent laminate is formed by stacking a plurality of insulating sheets provided with via holes each having a conductor and internal circuits connected to the conductors. V-shaped slits are formed in one of the major surfaces of the parent laminate to divide the via holes and the conductors respectively filled in the via holes and expose the conductors within the slits. The exposed conductors respectively serve as the external electrodes of each of the multilayer electronic components obtained by cutting the parent laminate.

Abstract: A method for forming a contact via in an integrated circuit includes the formation of an aluminum conductive element on an integrated circuit device. A conformal insulating layer is then deposited over the device. Using a masking layer, an anisotropic etch is performed to open a via through the conformal insulating layer. During the anisotropic etch, polymers are created from the resist and etch chemistry and adhere to the sidewalls of the via. A resist developer containing Tetra Methyl Amonium Hydroxide is used to remove the polymers from the via. A contact may now be formed by depositing conductive material into the via.

Abstract: The present invention provides an electrical connection structure for an electrical connection with high density and reliability, and which is particularly superior in high frequency characteristics and prevents any leakage current at the contact.Preferred embodiment includes a dielectric film and a first conductor pattern having one or plural microconductor protrusions which is formed on dielectric film, an elastic member which is provided on the other side of dielectric film, thereby an electrical connection is accomplished by pressing a contacting surface of first conductor pattern by a force exerted through elastic member. The distance between microconductor protrusions may be changed during a contacting operation and microconductor protrusions will scratch a surface of a conductor to be contacted, e.g. a pad, a line pattern while a distance and thickness of compression are under control.

Abstract: A chip coil includes an insulating substrate on which a spiral coil conductor and first and second terminal electrodes are formed. The coil conductor and the terminal electrodes are made by forming a conductive film on the whole of both main surfaces of the insulating substrate and then etching the same. A first insulation film made of polyimide or polyamide is formed on the insulating substrate so as to cover the coil conductor and the terminal electrodes. The first insulation film is etched such that portions corresponding to the terminal electrodes are removed and a throughhole is formed at a portion corresponding in position to the inner most end of the coil conductor. A further conductive film is formed on the first insulation film and etched so as to form a connecting conductor, the ends of which are respectively connected to the inner most end of the coil conductor and the second terminal electrode through the throughhole.

Abstract: An apparatus is adapted to be secured in a substrate having at least one conductive path and at least one aperture therein. The apparatus includes a cap and a tubular shaft, connected to the cap and positioned in a first aperture of the substrate. The tubular shaft has an electrically conductive wall portion and perforations therethrough, with the electrically conductive wall portion being operatively connected to a first conductive path of the substrate, and the perforations are adapted to permit flowthrough of material. The material facilitates the securing of at least the tubular shaft to the substrate.

Abstract: A sleeve system and method for using same provides an encasement for wires and cables passing through a wall or floor. The sleeve system is particularly useful in allowing the walls within a building to meet fire code requirements. The sleeve system can be used regardless of whether the wiring or cabling has already been installed through the wall or floor. The invention includes a pair of mating sleeve units individually inserted around the cables through the wall or floor and appropriate securing devices for tightly retaining the sleeve units in place. In one embodiment, the securing devices include at least one slotted flange and a slotted coupler on each side of the wall. The sleeve construction also allows easy installation of additional cables through the sleeve.

Abstract: A waterproof protective cover includes an upper casing member having bores formed at both endwalls in a longitudinal direction thereof to pass the electrical wires therethrough and a lower casing member pivotably connected to the upper casing member through a hinge attached to each sidewall of the upper and lower casing members. The lower casing member also has bores formed at both endwalls in a longitudinal direction thereof to pass the electrical wires therethrough. A storage chamber is defined by the upper and lower casing members when the former is engaged with the latter. Being filled up with an insulating sealant, the chamber serves to accommodate a connection part of the connected wires. A reservoir chamber for receiving the insulating sealant flowing out of the storage chamber is arranged between the bores of the upper and lower casing members and the storage chamber. Further, the upper casing member has a seal plate formed on a sidewall thereof.

Abstract: High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling.

Abstract: The present invention locates the primary winding of a transformer in a configuration where it substantially surrounds the secondary winding of the transformer in order to enhance the efficiency of the electromagnetic coupling. High magnetic permeability material surrounds portions of the primary winding of the transformer. The transformer is designed to efficiently operate at frequencies of approximately 50 kilohertz. In one preferred embodiment, the primary winding of the invention is formed of two U-shapes in which the parallel members of the U are substantially longer than the bottom portion of the U. The two U-shapes form a rectangular shape and the substantially parallel rectangular portions are surrounded by high magnetic permeability material to further enhance the electromagnetic coupling between the primary coil winding and the secondary coil winding. In another embodiment, the primary winding of the invention may be rectangular in shape.

Abstract: An electrical pin contact for mounting on a printed circuit board to provide an electrical interconnection to the printed circuit board. The contact includes an elongated, conductive pin, and a base attached to one end of the pin. The base has a triangular cross-section with vertices that engage a plate-through hole to support the contact in the plated-through hole during a soldering process. The contact may include a flange or stops to support the contact on a printed circuit board. The contact may also include a tail extending from the base opposite the pin.

Abstract: A multi-metal layer wiring TAB tape carrier capable of forming a fine pattern without affecting the thicknesses of conductive metal layers, and a process for fabricating the multi-metal layer wiring TAB tape carrier. This TAB tape carrier is constructed such that respective dielectric film layers are interposed between adjacent ones of plurality of conductive metal layers having a predetermined wiring pattern, such that the dielectric film layer is formed with interfacial connection holes, and such that a conductive via layer is formed in the interfacial connection holes to electrically connect adjacent conductive metal layers. The conductive via layer is formed by a vapor deposition method such as evaporation, ion plating or sputtering. Alternatively, a portion of the conductive metal layers and the conductive via layer are simultaneously formed.

Abstract: The present invention relates to a measuring transformer which contains a primary conductor which carries current to be measured, and a secondary coil which is magnetically coupled thereto. The primary conductor is shaped helically and forms a body, like a helical spring, which surrounds the secondary coil with at least one turn. The primary conductor is preferably formed by a tube having a spiral groove which passes through its wall. The primary conductor has inherent stability which is very high such that no special holding means are required for the secondary coil. The secondary coil is extremely easy to install in the primary conductor and there are no problems with installation tolerances and the like.

Abstract: A protective cover for accommodating an end connecting part of a bundle of wires includes a box-type of casing body provided with a storage chamber to accommodate the end connecting part therein and a lid pivotably connected to the casing body to close the opened upper portion thereof. A bottom wall of the casing body is provided with a stop in the shape of a rectangular plate. With the arrangement, when accommodating the ends of the wires in the casing, the stop intrudes into the wires. Under this condition, even if the wires are pulled outside the casing, the end connecting part of the wires is hooked by the stop, whereby the wires can be retained in the casing without being drawn therefrom.

Abstract: In a printed circuit board for a liquid crystal display using Tape Automated Bonding (TAB) for making interconnections, flow of molten solder to adjacent input electrodes on the TAB is prevented as well as short-circuiting between electrodes and wire breakage by using an improved TAB structure that avoids applying a concentration of shearing stress to the input electrodes and retards short-circuiting solder flow. This is accomplished by making the width of the slit for the input electrodes uneven. The width of the slit where each of the electrodes crosses over the slit is narrower than elsewhere.

Abstract: A method for forming one or more conductive paths by providing a first pattern of pre-formed conductive elements and a second pattern of preformed conductive elements in a substrate and forming, at a single level, one or more lateral conductive links between selected ones of the first and second conductive elements to provide a selected configuration of one or more conductive paths.

Abstract: The present invention provides a method for forming an improved lead-on chip semiconductor module and an improved module of this type. In a lead-on chip semiconductor device, a semiconductor chip which has a major surface having input and output bonding pads thereon, is secured to a lead frame having a plurality of leads adjacent the bonding pads by means of bonding wires connecting a respective one of the leads to a pad on the chip. A coating of dielectric material having a Young's modulus in the range of about 10 psi to about 500 psi is disposed around the entire length of each of the wires and over the pads and over the portion of the respective leads to which the wires are connected to act as a stress buffer. This material preferably has a T.sub.g of at least as low as -40.degree. C. Also preferably this package is encapsulated with conventional encapsulant.

Abstract: A reinforcement for a flexible printed circuit board, which can sufficiently prevent the flexible printed circuit board thus reinforced from being warped when heated during the assembly process of electronic components or other procedures. The reinforcement according to the present invention is used to adhere to a flexible printed circuit board 1. The reinforcement according to the present invention comprises an internal material 21 having a bending neutral surface at the center of the thickness thereof, and an external material 22 having the same Young's modulus as that of an insulating substrate 11 of the flexible printed circuit board 1, bonded to one side of the internal material 21. The other side of the internal material 21 acts as an adhesive surface to the flexible printed circuit board 1.

Abstract: A cooling device mounting a fan unit (3) above a heat sink (2) mounted on a heat-generating element (1) or buried therein, which produces an effective air flow and achieves a uniform cooling action by having the heat sink (2) comprised in various shapes. Further, a cooling fan disposed away from the heat sink (2) or to the side of the same is used for effective cooling through an air conduit passage formed by pipes or a cover.