Patents Examined by Laureen Chan
  • Patent number: 10847350
    Abstract: A heat treatment apparatus includes: a rotation table installed in a vacuum container, the rotation table mounting a substrate in a mounting area formed in one surface side of the rotation table and revolving the substrate; a heater that heats the rotation table; a plasma processing part that generates a plasma in a plasma generation region, which is formed in the one surface side of the rotation table at a region through which the substrate passes, and processes the substrate; a temperature measurement terminal installed in the rotation table at a region, which passes through a position facing the plasma generation region when the rotation table is rotated, the temperature measurement terminal outputting a temperature measurement result of the rotation table as an electric signal; and a conductive plasma shield part installed to cover the temperature measurement terminal when viewed from the plasma generation region.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: November 24, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Soichi Kanno
  • Patent number: 10825659
    Abstract: A gas injector for a substrate processing system includes a first injector housing including a base portion defining a first gas flow channel; a projecting portion extending from the base portion; and a second gas flow channel extending through the base portion and the projecting portion. The gas injector includes a second injector housing including a first cavity including a first opening, a second opening and a first plurality of gas through holes arranged around the second opening. The first gas flow channel communicates with the first plurality of gas through holes. The second injector housing includes a second cavity that includes a second plurality of gas through holes and that extends from the second opening of the first cavity. The second gas flow channel communicates with the second plurality of gas through holes. Gas in the first and second gas flow channels flows into a processing chamber without mixing.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: November 3, 2020
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Jason Lee Treadwell, Ivelin Angelov, Linda Marquez, Cristian Siladie
  • Patent number: 10811234
    Abstract: A plasma processing apparatus includes supporting members, connecting members and a sliding member. Each of the supporting members is partially disposed in a disc-shaped cooling plate and configured to support an upper electrode in a direction of gravity. Each of the connecting members is partially disposed in the cooling plate and extends in a diametrical direction of the cooling plate to be engaged with the corresponding supporting member. The sliding member is configured to slide the connecting members inward in the diametrical direction of the cooling plate, thereby pushing upward the supporting member and lifting the upper electrode to the cooling plate.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: October 20, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shin Matsuura, Jun Young Chung
  • Patent number: 10804120
    Abstract: A temperature controller of a plasma-processing apparatus including a heating unit and a cooling unit. The heating unit is configured to heat a liner on an inner surface of a plasma chamber in which a plasma is formed. The cooling unit is configured to cool the liner to controls a temperature of an upper electrode in the plasma chamber.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: October 13, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seong-Moon Ha, Min-Kyu Sung, Seung-Hee Cho, Seong-Chul Choi, Kyung-Sun Kim, Sang-Ho Lee
  • Patent number: 10770329
    Abstract: A gas flow is described to reduce condensation with a substrate processing chuck. In one example, a workpiece holder in the chamber having a puck to carry the workpiece for fabrication processes, a top plate thermally coupled to the puck, a cooling plate fastened to and thermally coupled to the top plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate, a base plate fastened to the cooling plate opposite the puck, and a dry gas inlet of the base plate to supply a dry gas under pressure to a space between the base plate and the cooling plate to drive ambient air from between the base plate and the cooling plate.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: September 8, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Hun Sang Kim, Michael D. Willwerth
  • Patent number: 10627173
    Abstract: A flow path member includes a lid portion, a bottom plate portion, and side walls provided between the lid portion and the bottom plate portion, a flow path in which a fluid flows is configured with the lid portion, the side walls, and the bottom plate portion, a portion of a surface of the side walls on the flow path side includes a coarse portion that is coarser than the other portions.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: April 21, 2020
    Assignee: KYOCERA Corporation
    Inventors: Keiichi Sekiguchi, Kazuhiko Fujio, Yuusaku Ishimine
  • Patent number: 10615061
    Abstract: Provided is a technique in which a heating-up time inside a process chamber is reduced. The technique includes a substrate processing apparatus including a process chamber where a substrate is processed, a substrate retainer configured to support the substrate in the process chamber, a process gas supply unit configured to supply a process gas into the process chamber, a first heater installed outside the process chamber and configured to heat an inside of the process chamber, a thermal insulating unit disposed under the substrate retainer, a second heater disposed in the thermal insulating unit and configured to heat the inside of the process chamber, and a purge gas supply unit configured to supply a purge gas into the thermal insulating unit to purge an inside of the thermal insulating unit.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: April 7, 2020
    Assignee: Kokusai Electric Corporation
    Inventors: Shuhei Saido, Hidenari Yoshida, Takatomo Yamaguchi, Takayuki Nakada, Tomoshi Taniyama
  • Patent number: 10612142
    Abstract: A film formation apparatus for forming a thin film having high gas barrier performance, such as a DLC (Diamond Like Carbon) film, a SiOx film, a SiOC film, a SiOCN film, a SiNx film, and an AlOx film, on an inner surface and/or an outer surface of a container such as a PET bottle. The film formation apparatus has: a vacuum chamber for forming, in a vacuum state, a film on a surface of a container using a heat generating element; a vacuum evacuation device for vacuumizing the vacuum chamber; and a relative shifting device for relatively shifting the container and the heat generating element in the vacuum chamber after the vacuumization of the vacuum chamber.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: April 7, 2020
    Assignee: KIRIN BEER KABUSHIKI KAISHA
    Inventors: Hiroyuki Ooshima, Keiichi Fujimoto, Hiroyasu Tabuchi, Masaki Nakaya
  • Patent number: 10573496
    Abstract: An apparatus for supplying plasma products includes a plasma generation block that defines a toroidal plasma cavity therein. The plasma cavity is substantially symmetric about a toroidal axis, and the toroidal axis defines a first and second axial side of the plasma generation block. A magnetic element at least partially surrounds the plasma generation block at one azimuthal location with respect to the toroidal axis, such that a magnetic flux within the magnetic element induces a corresponding electric field into the plasma cavity to generate a plasma from one or more source gases, the plasma forming plasma products. The plasma generation block supplies the plasma products through a plurality of output apertures defined by the plasma generation block on the first axial side.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: February 25, 2020
    Assignee: Applied Materials, Inc.
    Inventor: Dmitry Lubomirsky
  • Patent number: 10529599
    Abstract: In a substrate processing apparatus of the present disclosure, a bearing member includes a decaying mechanism provided with a connecting shaft inserted therein and configured to decay radicals or ions; a first member configured to cover the decaying mechanism; and a second member disposed at the connecting shaft and provided with the connecting shaft inserted therein while being in contact with a sealing member. Further, an end of the first member and an end of the second member are connected to be engaged with each other, an invasion path is formed to allow the radicals to invade from the connected portion of the end of the first member and the end of the second member, and the invasion path is formed to be folded back in an extending direction of the connecting shaft. The sealing member is made of a material having a tensile strength larger than 12.1 MPa.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: January 7, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Toshinori Kitabata, Yusuke Hayasaka, Kazuya Matsumoto
  • Patent number: 10522372
    Abstract: A plasma processing device includes a stage, a cluster generation machine, and a plasma generation machine. The stage is disposed in a processing chamber. The stage may support a substrate. The cluster generation machine generates cluster gas by clustering process gas. The plasma generation machine generates plasma of at least one of the process gas and the cluster gas in the processing chamber. The plasma generation machine processes the substrate using the generated plasma.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: December 31, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventor: Takashi Ohashi
  • Patent number: 10515784
    Abstract: Exemplary embodiments of the inventive concept provide a plasma treatment apparatus with a substrate support unit, a plasma unit, a first rotation driving unit, and a gas supply part. The substrate support unit supports a substrate. The plasma unit generates a plasma and provides the plasma to the substrate. The first rotation driving unit is coupled to the plasma unit to rotate the plasma unit with respect to the substrate support unit. The gas supply part supplies a source gas to the plasma unit. The plasma unit includes a body, a first electrode located in the body, a second electrode located in the body and facing the first electrode, and a pipe located between the first and second electrodes to flow the source gas therethrough.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: December 24, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Youngsik Yoon, Jaehoon Jung, Daeho Yoon, Jonghwan Cho
  • Patent number: 10504703
    Abstract: A plasma treatment apparatus and a plasma treatment method are provided. The apparatus includes a chamber, a planar plasma-generating electrode, a sample suspension and holding system, and an optical observation system. The chamber defines a processing inner chamber, and the top portion of the chamber has a window. The planar plasma-generating electrode is located in the processing inner chamber for generating a planar plasma. The sample suspension and holding system is disposed opposite to the planar plasma-generating electrode in the processing inner chamber to suspend and hold a sample. The optical observation system is located in the processing inner chamber adjacent to the sample suspension and holding system to measure the thickness range of a planar plasma effective influence region through the window of the chamber.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: December 10, 2019
    Assignee: Industrial Technology Research Institute
    Inventor: Hung-Yuan Hsieh
  • Patent number: 10502508
    Abstract: There is provided a system including a temperature-controllable stage, which includes: a disc-shaped plate having a front surface on which a substrate is mounted and a rear surface; a heat exchanger configured to individually supply a heat exchange medium to a plurality of regions two-dimensionally arranged to face the rear surface of the plate and configured to individually recover the heat exchange medium supplied to the regions, the plurality of regions being obtained by dividing a plurality of zones defined to face the rear surface of the plate in the heat exchanger; and a plurality of valve units configured to control, for each of the plurality of zones, the supply or cutoff of the heat exchange medium to the plurality of regions by the heat exchanger.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: December 10, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Tsutomu Hiroki
  • Patent number: 10424465
    Abstract: Introduced here is a plasma polymerization apparatus. Example embodiments include a reaction chamber in a shape substantially symmetrical to a central axis. Some examples further include a rotation rack in the reaction chamber. The rotation rack may be operable to rotate relative to the reaction chamber about the central axis of the reaction chamber. Examples may further include two reactive species discharge mechanisms positioned around a perimeter of the reaction chamber and configured to disperse reactive species into the reaction chamber in a substantially symmetrical manner from the outer perimeter of the reaction chamber toward the central axis of the reaction chamber, such that the reactive species form a polymeric coating on surfaces of the one or more substrates during said dispersion of the reactive species, and a collecting tube positioned along the central axis of the reaction chamber and having an air pressure lower than the reaction chamber.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: September 24, 2019
    Assignee: Jiangsu Favored Nanotechnology Co., LTD
    Inventor: Jian Zong
  • Patent number: 10381197
    Abstract: A transformer includes: a rotary shaft configured to rotate about a central axis of the rotary shaft as a rotational axis; a primary-side first coil configured to extend around a first axis perpendicular to the central axis; a secondary-side second coil configured to extend around a second axis and supported by the rotary shaft, the second axis being perpendicular to the rotational axis in an area surrounded by the first coil; and a secondary-side third coil configured to extend around a third axis and supported by the rotary shaft, the third axis being perpendicular to the rotational axis and forming a predetermined angle with the second axis in the area.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: August 13, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Yohei Yamazawa
  • Patent number: 10354842
    Abstract: An apparatus, for use in a processing chamber is provided. A pneumatic cylinder is provided. A manifold with a supply and an exhaust is controllably connected to the pneumatic cylinder. A dry gas supply is in fluid connection with and provides positive pressure to the exhaust of the manifold.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: July 16, 2019
    Assignee: Lam Research Corporation
    Inventor: Jacqulyn Edem
  • Patent number: 10319568
    Abstract: A plasma processing apparatus includes a process chamber including a sidewall, a mounting table disposed in the process chamber, a shield member which is disposed along the inner surface of the sidewall to surround the mounting table and has an opening facing the transfer port, and a shutter configured to open/close the opening, the shutter being movable up and down. The shutter has a first portion adapted to face the opening, and a second portion adapted to face the shield member at a lower side of the shield member. The shield member has a lower portion including a contact surface facing the second portion. A contactor adapted to contact the contact surface is disposed at the second portion. The first portion of the shutter closes the opening through a gap between the first portion and the shield member. The contact surface and the contactor are formed of HASTELLOY®.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: June 11, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Ippei Shimizu, Naoki Mihara, Shunsuke Ogata
  • Patent number: 10312061
    Abstract: An embodiment of the present disclosure provides a vacuum apparatus, which relates to a display technical field. The vacuum apparatus can eliminate an electrostatic adsorption between a substrate and an electrode so as to avoid damages to the substrate. The vacuum apparatus includes: a vacuum cavity; a first electrode and a second electrode located inside the vacuum cavity and opposite to each other; and positioning structures for positioning the substrate. The substrate is located between the first electrode and the second electrode and is positioned closer to the first electrode or the second electrode. The vacuum apparatus further includes an electrostatic elimination device.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: June 4, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Haitao Yang, Yunyou Zheng, Chenglong Wu, Wei Li, Youngjin Song, Xin Li, Lin Feng, Jie Liu
  • Patent number: 10290469
    Abstract: Embodiments of an apparatus having an improved coil antenna assembly that can provide enhanced plasma in a processing chamber is provided. The improved coil antenna assembly enhances positional control of plasma location within a plasma processing chamber, and may be utilized in etch, deposition, implant, and thermal processing systems, among other applications where the control of plasma location is desirable. In one embodiment, an electrode assembly configured to use in a semiconductor processing apparatus includes a RF conductive connector, and a conductive member having a first end electrically connected to the RF conductive connector, wherein the conductive member extends outward and vertically from the RF conductive connector.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: May 14, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Valentin N. Todorow, Gary Leray, Michael D. Willwerth, Li-Sheng Chiang