Abstract: An object of the present invention is to provide a Pd alloy, a Pd alloy material, and a probe pin for electric and electronic devices in which specific resistance, hardness, and processability are balanced at a higher level than before, and methods for manufacturing the same. In order to achieve this object, the Pd alloy for electric and electronic devices according to the present invention having a composition comprising 50.1 mass % or more and 55.5 mass % or less of Pd, 6.3 mass % or more and 16.1 mass % or less of Ag, 30.0 mass % or more and 38.0 mass % or less of Cu, and 0.5 mass % or more and 2.0 mass % or less of In is adopted.

Abstract: The present disclosure provides a method for manufacturing a measurement probe, the method comprising cutting a carrier substrate to form a probe contour, the probe contour comprising at least one probe tip and a probe body, and metallizing the surface of the at least one probe tip of the probe contour. Further, the present disclosure provides a respective measurement probe.

Abstract: The present invention relates to an apparatus and a method capable of calculating insulation resistances and parasitic capacitances of a battery outside the battery. In the present invention, when a positive electrode connector and a negative electrode connector are coupled to a positive electrode terminal and a negative electrode terminal of the battery, respectively, and a ground connector is coupled to a case of the battery, even though the battery is positioned inside a chamber in order to perform a temperature test or the like of the battery, the insulation resistances and the parasitic capacitances of the battery may be calculated without needing to move the battery to the outside of the chamber. Accordingly, the insulation resistances and the parasitic capacitances of the battery may be conveniently calculated.

Abstract: A cantilever probe card device and a focusing probe thereof are provided. The focusing probe includes a soldering segment, a testing segment, two outer elastic arms spaced apart from each other, and a focusing portion. The testing segment is spaced apart from the soldering segment along an arrangement direction, and has a needle tip, an outer edge, and an inner edge that is opposite to the outer edge. Each of the two outer elastic arms has two end portions respectively connected to the soldering segment and the inner edge of the testing segment. The focusing portion is connected to the inner edge and is located between the needle tip and the two outer elastic arms, and has a plurality of focusing points arranged on one side thereof away from the two outer elastic arms.

Abstract: It is intended to provide an irradiation device that can achieve good starting performance even without encapsulating a starting performance promoting substance into the internal space of a luminous tube in a discharge lamp, and simultaneously, can distinguish whether the discharge lamp is a genuine product or not. An irradiation device (50) is composed of a discharge lamp (110) provided as a light source and an ultraviolet light source (200) irradiating ultraviolet light to the discharge lamp (110) to detect whether the discharge lamp (110) is a genuine product or not in activation of the discharge lamp (110).

Abstract: Systems, methods, and devices are provided for estimating a state-of-charge in an energy storage system. The systems, methods, and devices may measure a current and a voltage related to the energy storage system, generate a model-based state-of-charge estimate based thereon, generate an aggregated state-of-charge estimate based on the model-based state-of-charge estimate, generate an adaptation current based on the measured current, aggregated state-of-charge estimate, and the adaptive state-of-charge estimate, and update the adaptive state-of-charge estimate based on the measured current and the adaptation current. The systems, methods, and devices may also provide a tracking indication whether the adaptive state-of-charge estimate is tracking between upper and lower confidence limits.

Abstract: An automated high speed test solution for Quad Flat Pack device packages that enables connectivity between test equipment and the integrated circuit under test is described. A test probe geometry that provides highly repeatable and reliable connections suitable for use with consumer grade QFP devices coupled with ease of maintenance is provided. In some embodiments, the probe tip ends are chisel-shaped. The probes can be slightly slanted with respect to a vertical axis of the probe retaining block.

Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat tensional spring segment.

Abstract: The present invention provides a battery safety test device includes: a mechanical switch element having one end connected to either a battery positive or negative electrode and the other end connected to an electronic switching element; the electronic switching element having one end connected to the mechanical switch element and the other end connected to the other of the battery positive or negative electrode; a voltage sensor for measuring a voltage of the battery after the mechanical switch element and the electronic switching element are turned on; and a current sensor for measuring a current of the battery after the mechanical switch element and the electronic switching element are turned on.

Abstract: An integrated circuit with a through-silicon via (TSV) fault-tolerant circuit, a TSV fault tolerance method are disclosed. The IC may include a plurality of operational TSVs, a spare TSV, a plurality of fault-tolerance control modules each coupled to one of the plurality of operational TSVs and the spare TSV, and a decoder coupled to the fault-tolerance control modules. The fault-tolerance control modules may be configured to deactivate an operational TSV that is determined to be defective and activate the spare TSV based on a positioning code for the defective operational TSV from the decoder. The IC may reduce the defect rate in the fabrication of TSV-based three-dimensional (3D) IC chips.

Abstract: A semiconductor device with contact check circuitry is provided. The semiconductor device includes a plurality of pads, an internal circuit, and a contact check circuit. The plurality of pads includes a first pad and a second pad. The internal circuit is coupled to the plurality of pads. The contact check circuit, at least coupled to the first pad and the second pad, is used for checking, when the semiconductor device is under test, contact connections to the first pad and the second pad to generate a check result signal according to comparison of a first test signal and a second test signal received from the first pad and the second pad with at least one reference signal.

Abstract: In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.

Abstract: A sensor includes a sensing element configured to generate a sensing element output signal indicative of a sensed parameter and a signal path responsive to the sensing element output signal and having at least one of an adjustable gain or an adjustable offset, wherein the signal path is configured to generate a sensor output signal indicative of the sensed parameter. A supply voltage detector is configured to generate a supply voltage signal indicative of which of a plurality of voltage ranges a supply voltage of the sensor falls within and at least one of the adjustable gain or the adjustable offset is adjustable in response to the supply voltage signal.

Abstract: A cantilever probe card and a carrier thereof are provided. The carrier includes a seat, a metal sheet, and a plurality of coarse adjustment members. The metal sheet is assembled to the seat and has a carrying surface. The coarse adjustment members are spaced apart from each other and are disposed between the seat and the metal sheet. Each of the coarse adjustment members is configured to be independently operable along a testing direction for changing a distance between the carrying surface and the seat. The carrying surface has a plurality of assembling regions spaced apart from each other, and at least two of the assembling regions have an assembling tolerance therebetween along the testing direction. The metal sheet of the carrier is deformable through at least one of the coarse adjustment members so as to reduce the assembling tolerance along the testing direction.

Abstract: An inspection apparatus includes a stage on which a substrate having an inspection target is placed, a probe card, a light irradiator, and a controller. The probe card has probes that supply a current to the inspection target. The light irradiator irradiates light to heat the substrate. The controller controls the light irradiator to execute uniformly heating the inspection target by the light from the light irradiator, and heating an outer peripheral portion of the inspection target by the light from the light irradiator.

Abstract: A method of constructing a chart of correlations between a rapid discharge and a slow discharge in order to measure the wear of at least one electrochemical cell, including a measurement phase that includes a training sequence followed by a characterization sequence, and an aging phase. Each of the sequences includes charging-relaxing-discharging-relaxing under controlled conditions and is repeated with different conditions. The time of each discharge is measured. The aging phase includes an alternation of charges and discharges with no intermediate relaxation and is implemented before each repetition of the measurement phase, such that a real capacity is obtained for a plurality of pairs of imposed parameters.

Abstract: A contact probe includes: a first contact member; a second contact member; and a spring member. The first contact member includes: a first tip part configured to contact a first contact target; and a boss part configured to couple with the spring member by fitting into the spring member, and the second contact member includes: a second tip part configured to contact a second contact target; and a cylindrical part extending from the second tip part and having a cylindrical shape with an inner circumference having a uniform diameter, the cylindrical part being engaged with at least a portion of the spring member, the portion of the spring member that is engaged with the cylindrical part having a diameter larger than the other portion of the spring member, the entire spring member being configured to be housed in the cylindrical part when the spring member is contracted.

Abstract: Probe systems including imaging devices with objective lens isolators and related methods are disclosed herein. A probe system includes an enclosure with an enclosure volume for enclosing a substrate that includes one or more devices under test (DUTs), a testing assembly, and an imaging device. The imaging device includes an imaging device objective lens, an imaging device body, and an objective lens isolator. In examples, the probe system includes an electrical grounding assembly configured to restrict electromagnetic noise from entering the enclosure volume. In examples, methods of preparing the imaging device include assembling the imaging device such that the imaging device objective lens is at least partially electrically isolated from the imaging device body. In some examples, utilizing the probe system includes testing the one or more DUTs while restricting electrical noise from propagating from the imaging device to the substrate.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.

Abstract: A battery voltage measurement circuit includes: a first switch configured to be connected to a positive electrode of a battery; a second switch configured to be connected to a negative electrode of the battery; detection resistances that are connected in series between the first switch and the second switch; capacitors that are connected in parallel to the detection resistances; and a measurement circuit that measures a voltage applied to the detection resistances. The battery voltage measurement circuit has a plurality of measurement modes depending upon status of the first and second switches, and further has a failure detection mode for the capacitors based on a change in the voltage after switching from one to an other of the measurement modes.