Abstract: As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of the electrode pads of a TEG so as to facilitate the evaluation of electrical characteristics. According to an evaluation apparatus for a semiconductor device of the present invention, the above described problems can be solved by providing a plurality of probes arranged in a fan shape or probes manufactured by Micro Electro Mechanical Systems (MEMS) technology.

Abstract: A condition monitoring device for a wind turbine power generating apparatus provided with an auxiliary motor power supply system including a power-supply-side line connected to a power supply and a plurality of auxiliary-motor-side lines diverging from the power-supply-side line and connected to a plurality of auxiliary motors, respectively, comprises: a current measurement device for measuring a current flowing through the power-supply-side line; and a control device for controlling the plurality of auxiliary motors. The control device is configured to, when a generator of the wind turbine power generating apparatus is in a standby state where power generation is stopped at a low wind speed, execute a single sequential operation mode in which each of the plurality of auxiliary motors is singly and sequentially operated. The current measurement device is configured to measure a current flowing through the power-supply-side line during execution of the single sequential operation mode by the control device.

Abstract: A system, apparatus and method of determining remaining life of a bearing is disclosed. The method includes generating a bearing model of the bearing. The bearing model is based on one of condition data associated with operation of the bearing, historical condition data of the bearing, bearing specification and technical specification of a technical system including the bearing. The method further includes predicting a defect in the bearing based on the bearing model and predicting the remaining life of the bearing based on the predicted defect.

Abstract: A high density thin walled test device testing chips/ICs is disclosed. A housing includes a slot for a contact pin and a pair of elastomers. The pin has an arcuate recess to receive part of the elastomer. Likewise the housing includes a channel to receive part of the elastomer. The recess and channel together partially surround the elastomer but not completely to allow shear forces and expansion space for the elastomer as it is compressed by the channel and recess. In addition, a front channel extends from the top surface of the housing toward the bottom surface but leaving a floor to support the elastomer so that it does not warp the housing when compressed. Further, the channel or the recess may include retainers which prevent the elastomer from moving out of position when the pin is in an uncompressed state.

Abstract: Systems and methods for determining state of health (SOH) of a battery. For example, a method includes conditioning the battery by determining an initial state of charge of the battery; charging the battery from the initial state of charge to a first target state of charge via a predetermined multi-stage charging sequence; and determining SOH of the battery by charging the battery from the first target state of charge to a second target state of charge at an ICA charging rate; acquiring a voltage vs. capacity (QV) data of the battery during charging of the battery from the first target state of charge to the second target state of charge; obtaining an incremental capacity (IC) data based on at least the acquired QV data; pre-processing the IC data; extracting an incremental capacity analysis (ICA) peak from the IC data; and determining the SOH of the battery based upon the ICA peak.

Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.

Abstract: A fault monitoring device may monitor and detect for faults corresponding to a high-side voltage rail, to low-side voltage rail, or internally within a voltage source connected to the high-side voltage rail and the low-side voltage rail. The fault monitoring device may determine sample voltage levels and/or sample resistance values to detect the faults. Also, in various embodiments, the fault monitoring device may perform one or more fault monitoring processes over multiple stages. The fault monitoring device may determine the sample voltage levels and/or the sample resistance values while switching a secondary resistance circuit in different states over the multiple stages.

Abstract: An inductive position sensor may be configured to detect relative position between a first member and a second member. The inductive position sensor may include an inductive sensor element configured to be coupled to the first member and a screening layer formed over a screened portion of a member surface of the second member such that an exposed portion of the member surface is free of the screening layer. The screening layer may be configured to reduce an effect on induced signals in the inductive sensor element caused by the screened portion of the second member.

Abstract: A detection device detects a mechanical deformation of a high-voltage accumulator of a motor vehicle, and includes: a sensor element, which senses an electrical measurement variable, wherein the sensor element is substantially flat and is attached at least partially to a first component of the high-voltage accumulator; and an evaluation device for analyzing the electrical measurement variable between the sensor element and a second component of the high-voltage accumulator and for outputting a corresponding warning on the basis of the electrical measurement variable, wherein at least one region of the surface of the second component is electrically conductive.

Abstract: A system comprises: a radio frequency (RF) resonator comprising a cavity and a tuning element, the cavity having at least one port, and the tuning element having a length inside the cavity; a processor; a spectrum analyzer coupled to the at least one port, the spectrum analyzer to provide to the processor values of a resonance parameter, the resonance parameter indicative of a resonant wavelength of the RF resonator; and an automotive steering mechanism coupled to the tuning element.

Abstract: A test head assembly for a semiconductor device has a carrier, a pin seat and a test wire assembly. The carrier is formed in an L shape and has a lateral board, a perpendicular board and a opening formed through the perpendicular board. The pin seat is mounted in the corresponding opening. The test wire assembly has a test head, a plurality of connectors and a plurality of test wires. The test head is mounted on an outer sidewall of the lateral board and connected to the pin seat through the test wires and the connectors. Therefore, the pin seat is mounted on the perpendicular board of the L-shaped uprightly and the test head is mounted on the lateral board. The pin seat and the test head are not parallel to each other, and a lateral size of the test head assembly is reduced to increase the space usage.

Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.

Abstract: A method and device for testing a battery that powers a body-wearable medical device. The battery is contacted via battery contacts and a capacitor is arranged in parallel with the battery contacts. During the battery test, a first capacitor voltage U1 is determined at a first time t1 and a second capacitor voltage U2 is determined at a second time t2 subsequent to time t1. A test current is drawn between time t1 and time t2. t1 is determined by the beginning of drawing the test current and time t2 is determined such that the capacitor voltage at time t2 is in a steady state and is substantially constant while the test current is being drawn. A charging state of the battery is determined from the difference in voltage between U1 and U2 and/or from a time difference between the time t1 and time t2.

Abstract: In an example, monitoring circuitry includes a first and a second coupling to electrically connect the monitoring circuitry to a monitored circuit having a resistance. The resistance of the monitored circuit may be indicative of a status, and the monitored circuit may be connected in series between the first and second coupling. The first coupling comprises a plurality of galvanically separated connection elements which are to form an electrical connection with a common connection element of the monitored circuit. The monitoring circuitry further comprises a monitoring apparatus to determine the resistance of the monitored circuit via the first coupling and the second coupling. The monitoring apparatus is to acquire a plurality of electrical values and to use the plurality of electrical values to determine a value of the resistance of the monitored circuit.

Abstract: A sensor system and method of operating the sensor system can include an indicator that is operable in resonance, the indicator being connected to a movable element of an actuator, and a sensor including sensor windings arranged in direct proximity to the indicator and external to a closed housing. The sensor can receive a position or an angle of the indicator, and can measure the position or the angle of the movable element inside the actuator through the closed housing based on inductive resonance facilitated by the indicator.

Abstract: According to an embodiment, a diagnosis method of a battery is provided. In the diagnosis method, based on an internal state of the battery at a plurality of mutually different times, a time when the internal state of the battery becomes a predetermined state after the plurality of mutually different times is estimated.

Abstract: A voltage measurement device is a voltage measurement device including a plurality of voltage detection circuits which measure cell voltages of a plurality of cells connected in series. Each of the plurality of voltage detection circuits includes: a communication end information holding circuit which holds communication end information specifying, as at least one communication end position, at least one of the plurality of voltage detection circuits; and a communication control circuit which controls transfer for sending a communication command received from a preceding voltage detection circuit located at a preceding stage to a next voltage detection circuit located at a next stage, according to the communication end information.

Abstract: An electrical safety monitoring system is provided. The system includes an analog circuit having line inputs for hardwiring an L1, an L2, an L3, and a GND three-phase connections, the analog circuit configured to monitor if voltage exists between any two of the line inputs, a heartbeat circuit electrically connected to the analog circuit to provide a heartbeat signal indicative of voltage present on any of the line inputs, an isolated voltage source electrically connected to the heartbeat circuit to power the heartbeat circuit with a VDC+ and a VDC?, and a logic circuit in operative communication with the heartbeat circuit for monitoring input from the heartbeat circuit and decoding the input from the heart beat circuit. The isolated voltage source may be supplied by a programmable logic controller (PLC) and the logic circuit may be implemented within the same PLC as a function block.

Abstract: Apparatus and method for detecting flaws in a wall of a metallic pipe containing a fluid are disclosed. The apparatus includes: a plurality of sensors distributed around an inner circumference of the metallic pipe, for sensing magnetic field signals from the metallic pipe; a collapsible supporting structure, including a plurality of supporting petals, at a front side of the plurality of sensors for supporting the apparatus; a sail mounted on and extended from bottom ends of the plurality of supporting petals, when the plurality of supporting petals are in an extended state, the sail is expanded to form a shape capable for containing the fluid; a processing module receiving sensed data from the plurality of sensors; and one or more battery modules for electrically powering the plurality of sensors and the processing module.

Abstract: A shoe for analyzing a component is provided. The shoe includes a housing, a NDT probe disposed on a side of the housing, and a shoe interface. The shoe interface is disposed at the side of the housing and contacts the component during the analyzing of the component. The shoe interface separates the NDT probe from the component during the analyzing of the component and moves along the component during the analyzing of the component. The shoe also includes first and second wear indicators. The first wear indicator indicates that the shoe interface is usable during the analyzing of the component. The second wear indicator indicates that the shoe interface should be replaced. Both of the wear indicators are configured similar to the shoe interface and move along the component while the shoe analyzes the component.