Patents Examined by Len Tran
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Patent number: 11891181Abstract: An outer panel-mediated cooling system includes a heat source chamber; a cooling path that is located between outer and inner panels; a non-cooling path that is located between the outer and inner panels and thermally insulated from a cooling path and the outer panel and through which at least one of pressurized gas and return gas from the heat source chamber passes; a mixing chamber into which cooled gas leaving the cooling path and an uncooled gas leaving the non-cooling path flow, in which the cooled gas and the uncooled gas are mixed to form a mixed gas, and out of which the mixed gas flows toward the heat source chamber; and a flow rate regulating valve that regulates a flow rate of gas flowing toward the mixing chamber.Type: GrantFiled: December 24, 2019Date of Patent: February 6, 2024Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHAInventors: Yu Haruki, Keiji Sakagawa, Kazuhide Hakamada, Ryosuke Mitani
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Patent number: 11892246Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.Type: GrantFiled: January 4, 2022Date of Patent: February 6, 2024Assignee: FUJITSU LIMITEDInventors: Kento Ohga, Hideo Kubo, Kenji Sasabe, Masahide Kodama, Atsushi Endo, Keita Hirai, Nobumitsu Aoki, Takashi Urai
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Patent number: 11892238Abstract: A packaging system for transporting a payload while maintaining the payload within an acceptable temperature range. The payload is cooled by two sets of U-shaped heat pipes within the payload compartment. A set of cold heat pipes is cooled by a layer of phase change material located above the payload, while a set of warm heat pipes is cooled by a layer of phase change material located below the payload.Type: GrantFiled: June 3, 2020Date of Patent: February 6, 2024Assignee: Sonoco Development, Inc.Inventor: Iftekhar Ahmed
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Patent number: 11892221Abstract: The present invention relates to a refrigerator. A refrigerator according to the present invention may comprises a first tray assembly forming one part of ice-making cells, and a second tray assembly forming the other part of same. Following the start of ice making process, so that ice can be produced in the direction of ice-making cells formed by any one tray assembly, from among the first and second tray assemblies, to the ice-making cells formed by the other tray assembly, the other tray assembly comprises a first surface forming a part of the ice-making cells, and a second surface extending from the first surface and supported by at least one surface of the one assembly.Type: GrantFiled: October 1, 2019Date of Patent: February 6, 2024Assignee: LG ELECTRONICS INC.Inventors: Donghoon Lee, Wookyong Lee, Sunggyun Son, Donghoon Lee, Seungseob Yeom, Yongjun Bae, Chongyoung Park
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Patent number: 11892240Abstract: A combination structure of a vapor chamber and a heat pipe includes a half-shell seat element, a half-shell cover element, a wick structure, and a working fluid. The half-shell seat element includes a vapor chamber half-shell seat and multiple heat pipe half-shell seats. Each heat pipe half-shell seat is extended from the vapor chamber half-shell seat. The vapor chamber half-shell seat includes a vapor chamber cavity. Each heat pipe half-shell seat includes a heat pipe cavity. Each heat pipe cavity communicates with the vapor chamber cavity. The half-shell cover element is sealedly connected with the half-shell seat element. The wick structure is continuously laid on the vapor chamber half-shell seat and each heat pipe half-shell seat, and is formed in the vapor chamber cavity and each heat pipe cavity. The working fluid is disposed in the vapor chamber cavity.Type: GrantFiled: May 26, 2022Date of Patent: February 6, 2024Assignee: TAIWAN MICROLOOPS CORP.Inventor: Chun-Hung Lin
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Patent number: 11892211Abstract: A climate-control system may include a first compressor, a second compressor, a suction manifold, and a flow restrictor. The first and second compressors each include a shell and a compression mechanism. The shells define suction chambers from which the compression mechanisms draw working fluid. The shells include suction inlet fittings through which working fluid is drawn into the suction chambers. The suction inlet fittings are fluidly connected to the suction manifold. The suction manifold provides suction-pressure working fluid to the suction inlet fittings of the first and second compressors. The flow restrictor may be at least partially disposed within the suction manifold.Type: GrantFiled: May 20, 2022Date of Patent: February 6, 2024Assignee: Copeland LPInventors: Brandon Jerome Witt, Philip L. Landfair, Vishal Kumar Vaghela, Satyam Anandrao Shinde
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Patent number: 11884127Abstract: A thermal management system includes: a first radiator, a first electric water pump, and a first coolant line configured to allow a coolant to be circulated by the first electric water pump; a second radiator, a second electric water pump, and a second coolant line configured to allow a coolant to be circulated by the second electric water pump; and a first flow control device and a second flow control device installed at front ends and rear ends of the first radiator and the second radiator so as to control a coolant flow direction between the first coolant line, the second coolant line, and a third coolant line. The third coolant line is installed so as to connect the first flow control device and the second flow control device to each other.Type: GrantFiled: December 2, 2021Date of Patent: January 30, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Seong Bin Jeong, Wan Je Cho, Jae Eun Jeong, Hyun Jae Lee, Nam Ho Park, Tae Hee Kim
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Patent number: 11879674Abstract: The current invention provides an evaporative condensing system using an evaporative condenser heat exchanger having an outer surface. The heat exchanger has a superhydrophilic surface. A compressor is configured to circulate a working fluid through the heat exchanger. A water distribution system is adapted to deposit a controlled amount of water on the heat exchanger to absorb heat from the heat exchanger by evaporation of water from the heat exchanger. A collector is located below the heat exchanger to receive excess water from the heat exchanger and direct excess water to a drain and an air delivery system is provided to direct air over the heat exchanger. The water distribution system supplies water to the heat exchanger in sufficient quantity that the water wets the heat exchanger, keeps the heat exchanger wet along its length, and excess water remains to carry dissolved solids to the collector.Type: GrantFiled: March 8, 2023Date of Patent: January 23, 2024Inventor: Rajiv K. Karkhanis
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Patent number: 11879672Abstract: An air conditioning system is provided and including a solar heat generator configured for collecting solar radiation and for heating fluid by the solar radiation and a fluid container coupled to the solar heat generator and being configured to maintain the heated fluid. The system further includes a heat exchanger disposed inside the fluid container and being configured for transferring heat from the heated fluid to refrigerant inside the heat exchanger, the heat exchanger is configured to increase pressure and temperature of the refrigerant. The system further includes a condenser, an expansion member and an evaporator configured to form together with the heat exchanger an air-conditioning cycle.Type: GrantFiled: December 23, 2021Date of Patent: January 23, 2024Inventor: Moshe Zeidman
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Patent number: 11859873Abstract: A fluid cooling apparatus capable of improving liquefaction efficiency of a fluid by appropriately cooling the fluid in various temperature ranges through a simple process.Type: GrantFiled: January 31, 2017Date of Patent: January 2, 2024Assignee: SAMSUNG HEAVY IND. CO., LTDInventors: Donghun Lee, Mungyu Kim, Joonho Min, Hyunki Park, Chihun Lee
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Patent number: 11859893Abstract: A refrigerator including a main body having a refrigerating compartment and a freezing compartment, a refrigerating compartment door rotatably coupled to the main body to open and close at least a part of the refrigerating compartment, an ice-making compartment, an ice maker disposed in the ice-making compartment to make ice, a dispenser to dispense ice, an auxiliary door to open and close the ice-making compartment, and a cold air duct connecting the ice-making compartment to the freezing compartment to cool the ice-making compartment. The ice maker including an ice-making tray that is rotatable and a cold air guide that is deformable and restorable and fixed to the ice-making tray.Type: GrantFiled: November 18, 2020Date of Patent: January 2, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Jeong, Kyoungki Park, Kwanyeol Lee
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Patent number: 11851349Abstract: A controlled-type recalcitrant high-concentration freeze-separation apparatus, includes: a condenser having therein a condenser stainless antifreeze tube formed in a cell and tube form, and a condenser copper refrigerant tube formed in a cell and tube form inside the stainless antifreeze tube to block direct contact between circulating water flowing into the condenser and the condenser copper refrigerant tube; and an evaporator having therein an evaporator stainless antifreeze tube formed in a form of a cell and tube inside, and an evaporator copper refrigerant tube formed in a cell and tube form inside the evaporator stainless antifreeze tube to block direct contact between circulating water flowing into the evaporator and the evaporator copper refrigerant tube.Type: GrantFiled: December 28, 2021Date of Patent: December 26, 2023Assignee: YOONJIN ENVIRONMENT CO., LTDInventors: Jung-A Rhim, Jeong-hyo Yoon, Mal-suk Ko, Gi-hoon Lee, Kwangsoo Noh, Gunpio Lee
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Patent number: 11852422Abstract: Disclosed is a double wave fin plate for a fin-tube heat exchanger, having: one half-plate having one perimeter edge with one cut-out forming one portion of a tube connector; another half-plate having another perimeter edge with another cut-out forming another portion of the tube connector; the one perimeter edge and the other perimeter edge are connected to one another about each cut-out to form the fin plate and the tube connector; one surface waveform is formed on the one half-plate; another surface waveform is formed on the other half-plate, and the one surface waveform is disposed at an angle to the other surface waveform in the fin plate.Type: GrantFiled: September 4, 2020Date of Patent: December 26, 2023Assignee: CARRIER CORPORATIONInventors: Lokanath Mohanta, Arindom Joarder, Jack Leon Esformes
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Patent number: 11856733Abstract: Provided is a cold plate including: a heat absorption space for a working medium to be filled therein; a heat transfer structure disposed on a base within the heat absorption space for transferring thermal energy generated from a heat source that is in contact with the base to the working medium; and a flow guide structure disposed in the heat absorption space for guiding the working medium. The flow guide structure of the cold plate can effectively improve the efficiency of thermal energy absorption of the working medium.Type: GrantFiled: June 12, 2020Date of Patent: December 26, 2023Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chien-An Chen, Chien-Yu Chen, Yu-Jie Liu
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Patent number: 11846474Abstract: A cooling array for cooling of an electronic component includes the electronic component, a housing which at least partially enclosing the electronic component, a heat sink support connected to the housing in a fluid-tight manner, and a heat sink which is accommodated in the heat sink support. The heat sink is thermally coupled to the electronic component in order to disperse heat generated by the electronic component.Type: GrantFiled: May 10, 2021Date of Patent: December 19, 2023Assignee: LISA DRAEXLMAIER GMBHInventors: Erwin Lichtenberg, Christian Goestl, Christian Friedrich
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Patent number: 11841180Abstract: Provided is a refrigerator. The refrigerator may include a first tray assembly defining a portion of an ice making cell and a second tray assembly defining another portion of the ice making cell. The one tray assembly of the first and second tray assemblies may include a first portion that defines at least a portion of the ice making cell and a second portion extending from a predetermined point of the first portion.Type: GrantFiled: October 2, 2019Date of Patent: December 12, 2023Assignee: LG ELECTRONICS INC.Inventors: Donghoon Lee, Wookyong Lee, Seungseob Yeom, Donghoon Lee, Yongjun Bae, Sunggyun Son, Chongyoung Park
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Patent number: 11835273Abstract: A refrigerant cycle apparatus includes a main refrigerant circuit, a bypass circuit, and a controller. The main refrigerant circuit includes a compressor, a heat source-side heat exchanger, a heat source-side expansion valve, and a utilization-side heat exchanger. The controller performs a second operation of opening a hot gas bypass valve in a state in which the compressor is driven before performing a first operation in which the heat source-side heat exchanger serves as a heat absorber for the refrigerant and the utilization-side heat exchanger serves as a radiator for the refrigerant. In the first operation or the second operation, when a difference between a pressure of the refrigerant on the discharge side of the compressor and a pressure of the refrigerant on the suction side of the compressor becomes larger than a first predetermined value, the controller decreases the number of revolutions of the compressor.Type: GrantFiled: February 25, 2022Date of Patent: December 5, 2023Assignee: Daikin Industries, Ltd.Inventors: Yuji Yamada, Shinichi Takahashi
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Patent number: 11828547Abstract: A heat-dissipating device includes a casing and a heat dissipating fin set. The casing has a first hole structure. The heat dissipating fin set includes a protruding fin, a sheltering component and a bridging component. A hollow chamber of the protruding fin has a first opening and a second opening adjacent to each other. The first opening is connected to an inner space of the casing. The sheltering component is disposed on the protruding fin to shelter the second opening. The bridging component is connected to the protruding fin and fixed onto the first hole structure.Type: GrantFiled: March 2, 2021Date of Patent: November 28, 2023Assignee: Qisda CorporationInventors: Chi-Cheng Lin, Po-Fu Wu, Hung-Jen Wei
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Patent number: 11828477Abstract: A heat exchanger includes: a surface with a water-repellent coating. The surface has a surface structure that includes protrusions. Condensed water droplets, each having a droplet diameter that allows a subcooled state to be maintained even under a predetermined freezing condition, combine with one other on the surface and generate an energy. The surface structure uses the energy to remove the combined condensed water droplets from the surface.Type: GrantFiled: March 30, 2018Date of Patent: November 28, 2023Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Tomohiro Nagano, Hirokazu Fujino, Kaori Yoshida, Isao Fujinami, Deb Kumar Mondal, Hiroki Yamaguchi
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Patent number: 11821667Abstract: A cooling apparatus includes a heat receiver that evaporates a low pressure heat transfer medium. The apparatus includes a compressor that compresses the evaporated heat transfer medium in a gas phase state, and a condenser that condenses the compressed heat transfer medium. The apparatus includes a receiver tank that receives and stores at least one of the heat transfer medium from any place in a flow path of the medium in the gas phase state that returns the medium to the heat receiver and the condensed medium in a liquid phase state. The apparatus includes an air storage tank that air separated from the heat transfer medium. The apparatus includes a liquid level controller that controls a liquid level in the receiver tank such that the heat transfer medium is stored in the receiver tank at a predetermined liquid level height.Type: GrantFiled: November 8, 2021Date of Patent: November 21, 2023Assignee: NEC CORPORATIONInventors: Yoshinori Miyamoto, Minoru Yoshikawa, Masaki Chiba