Patents Examined by Len Tran
  • Patent number: 11815319
    Abstract: A mesh panel for a heat exchanger system is provided. The mesh panel comprises a mesh body extending from an upper end to a lower end, the mesh body having an inlet side and an outlet side opposite the inlet side. The mesh body comprises a plurality of mesh wires arranged to form a mesh pattern defining a plurality of mesh openings between the mesh wires, and at least one penetrating mesh portion extending at least partly along a depth direction of the mesh body, the depth direction being normal to a plane extending between the upper and lower ends of the mesh body, the at least one penetrating mesh portion at least partly defining an air flow opening, the air flow opening having greater dimensions than each of the mesh openings.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: November 14, 2023
    Assignee: OVH
    Inventors: Ali Chehade, Mohamad Hnayno, Louis Genelle
  • Patent number: 11808496
    Abstract: A heat exchanger includes plural heat transfer tubes disposed with a specified spacing from each other in the up and down direction, and a distributor configured to distribute refrigerant to the heat transfer tubes. The distributor includes a body part, and plural flow-splitting parts, the body part including a first passage in which refrigerant flows upward, the flow-splitting parts communicating with the first passage and with one of the heat transfer tubes. The flow-splitting parts include one or more first flow-splitting parts each communicating with a first heat transfer tube, which is a higher positioned heat transfer tube. The flow-splitting parts include one or more second heat transfer tubes each communicating with a second heat transfer tube positioned below the first heat transfer tube. The refrigerant inlet of the first flow-splitting part communicates with the first passage at a location below the refrigerant inlet of the second flow-splitting part.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: November 7, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kosuke Miyawaki, Yoji Onaka, Yohei Kato
  • Patent number: 11808530
    Abstract: The present disclosure provides a louvered fin including a leading edge, a trailing edge, and a surface extending between the leading edge and the trailing edge. The surface defines a first set of holes along a first axis, a second set of holes along a second axis and offset from the first set of holes, and a third set of holes along a third axis and offset from the second set of holes. Each of the first axis, the second axis, and the third axis extends substantially parallel to a longitudinal axis of the fin. A first offset distance between the second and first set of holes is greater than a second offset distance between the third and second set of holes. The second and the third set of holes define a substantially obtuse trapezoidal matrix.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: November 7, 2023
    Assignee: Rheem Manufacturing Company
    Inventor: Kevin Mercer
  • Patent number: 11808494
    Abstract: The disclosed technology includes devices, systems, and methods for heat pump systems configured to operate in low ambient temperatures. The disclosed technology can include a heat pump water heater system having an evaporator, a first compressor configured to compress refrigerant to a first pressure, and a second compressor configured to compress the refrigerant to a second pressure. The second pressure can be greater than the first pressure. The heat pump water heater system can include a preheater configured to receive the refrigerant at the first pressure and heat water and a condenser configured to receive the refrigerant at the second pressure and heat water. The water can be passed through the preheater before being passed through the condenser.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: November 7, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Yang Zou, Sivakumar Gopalnarayanan
  • Patent number: 11808506
    Abstract: An ice making machine has a framework-shaped frame which encloses an ice making tray and a drive unit and a fixing portion which fixes the frame to an inner wall surface in a freezing compartment. The frame includes a first frame portion and a second frame portion opposed to each other in an X-axis direction and a third frame portion and a fourth frame portion opposed to each other in a Y-axis direction. The fixing portion protrudes upward from the third frame portion. The third frame portion contacts the inner wall surface when the frame is fixed to the freezing compartment. The fourth frame portion includes a plate portion which extends in the X-axis direction with a thickness direction directed to the Y-axis direction and connects the first frame portion and the second frame portion to each other and a plurality of ribs provided on the plate portion.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: November 7, 2023
    Assignee: NIDEC SANKYO CORPORATION
    Inventor: Yuta Oshima
  • Patent number: 11802340
    Abstract: A cooling chamber comprising a support plate connected to a cryo pump and turbo pump, a clamp ring with a plurality of clamp pads on the bottom thereof where each clamp pad has a beveled surface directed downward and a lift plate to move the clamp ring from a clamp position to a loading position are described. Cluster tools incorporating the cooling chamber and methods of using the cooling chamber are also described.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: October 31, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Bharath Swaminathan, John Mazzocco, Hanbing Wu, Ashish Goel, Anantha K. Subramani
  • Patent number: 11796232
    Abstract: A conical refrigerant coil comprises a plurality of pipes, each pipe arranged in a conical spiral and each pipe comprising a plurality of loops. At least some of the loops of each pipe of the plurality of pipes are arranged alternatingly along at least a portion of a length of the coil.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: October 24, 2023
    Assignee: Green Air, Inc.
    Inventors: Nathaniel S. Roady, Evan Paul Sachdeva
  • Patent number: 11788780
    Abstract: A modular arrangement for use in vapor-compression refrigeration system includes an evaporator, oil separator, condenser and oil cooler, arranged inside an outer casing with a longitudinal cylindrical shell and the end plates in both ends of the shell. The shell includes three separate parts, separated from each other by arranging first and second partition walls between the parts. The first part includes the evaporator, the second part includes the oil separator and the third part includes the oil cooler and the condenser. The third part including a combination of the oil cooler and the condenser is constructed by arranging one plate pack into the third part, which is divided two functional plate pack parts by an intermediate plate arranged between the heat exchange plates of the plate pack. The first plate pack part functions as oil cooler and the second plate pack part functions as the condenser.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: October 17, 2023
    Assignees: VAHTERUS OY, MAYEKAWA EUROPE NV/SA
    Inventors: Mauri Kontu, Jean-Pierre Boone
  • Patent number: 11791506
    Abstract: A modular heat exchanger for battery thermal management having a plurality of similarly constructed heat exchange elements affixed to a cover plate and fluidly coupled with one another via a single external manifold structure that functions as both an inlet manifold and an outlet manifold for each of the heat exchange elements. Rigidity is improved with alternating tabs or overlapping tabs between adjacent elements, and/or side edges between adjacent elements having cutouts for receiving stiffening ribs formed in the cover plate. The external manifold structure provides additional stiffening for the interconnected heat exchange elements.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: October 17, 2023
    Assignee: Dana Canada Corporation
    Inventors: Garreth D. G. Graves, Benjamin A. Kenney, Michael A. Martin, Kenneth M. A. Abels, Lee M. Kinder
  • Patent number: 11788779
    Abstract: A mixing device and a vapor compression system incorporating a mixing device are provided. The vapor compression system includes a suction line, at least two compressors, and at least one mixing device that is predominantly open (e.g., i.e., include at least a certain percentage, such as seventy percent (70%), of voids/openings). The suction line is used for transferring a working fluid made up of a mixture of a refrigerant and an oil. The suction line includes at least one inlet (e.g., for receiving the working fluid) and at least one outlet (e.g., for distributing the working fluid). The vapor compression system include a first compressor fluidly connected to a first outlet and a second compressor fluidly connected to a second outlet. At least one mixing device is disposed within the suction line (e.g., to increase an internal turbulence of the working fluid).
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: October 17, 2023
    Assignee: Carrier Corporation
    Inventors: Lokanath Mohanta, Arindom Joardar, Nicolas Fonte
  • Patent number: 11781797
    Abstract: Provided is a refrigeration appliance that includes a fresh food compartment and a freezer compartment. An opening is provided between the freezer compartment and the fresh food compartment to allow air to flow from the fresh food compartment to the freezer compartment and an air tower located within the fresh food compartment is adapted to deliver air from the freezer compartment to the fresh food compartment.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: October 10, 2023
    Assignee: Electrolux Home Products, Inc.
    Inventors: Marcelo Candeo, Cory Dale Simpson
  • Patent number: 11761692
    Abstract: A refrigeration system comprising an evaporator, and a method of operating a refrigeration system. The evaporator comprises: a first fluid volume upstream of a second fluid volume, and a plurality of channels fluidly connecting the first fluid volume and the second fluid volume. The system further comprises a flow restrictor arranged to prevent fluid flow through at least a first channel of the plurality of channels in response to a pressure difference between the first fluid volume and the second fluid volume being less than a predetermined threshold, and to permit fluid flow through the first channel in response to the pressure difference being greater than the predetermined threshold.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: September 19, 2023
    Assignee: UTC FIRE & SECURITY EMEA BVBA
    Inventor: Xavier-Pierre Nicolas Bouquet
  • Patent number: 11758692
    Abstract: A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: September 12, 2023
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chien-An Chen, Chien-Yu Chen, Wei-Hao Chen, Bo-Zhang Chen, Chun-Chi Lai, Yun-Kuei Lin
  • Patent number: 11745901
    Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: September 5, 2023
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: Jay H. Ambrose, Rolland Holmes
  • Patent number: 11747091
    Abstract: A fast heat-sinking device for evaporators according to the present invention is disclosed, comprising at least one heat-sinking component which is formed by means of conjunctively assembling an outer wall board and an inner wall board; the interior of the outer wall board includes a semi-open first evaporation area; the interior of the inner wall board includes a semi-open second evaporation area, and the inner wall board is concavely configured with a gap; as such, the inner wall board is attached onto one side of the outer wall board thus further being assembled into the heat-sinking component, and the first evaporation area and the second evaporation area are connected in communication at the notch so as to together form an air concentration area, as a heat-sinking structure of the evaporator.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: September 5, 2023
    Assignee: LDC PRECISION ENGINEERING CO., LTD.
    Inventors: Chi-Feng Hsu, Cheng-Jen Liang, Chih-Wei Chen
  • Patent number: 11745622
    Abstract: A device for controlling a battery for a vehicle is provided to maintain a battery temperature representing the optimal charging efficiency when the battery reaches a charging time point. The device determines the charging time point of a battery used in a hybrid vehicle and an electric vehicle, and adjusts the battery temperature based on a status of charge (SoC) of the battery at the determined charging time point.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: September 5, 2023
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventor: Ki Nam Jeon
  • Patent number: 11732976
    Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: August 22, 2023
    Assignee: AIC INC.
    Inventors: Yen-Chih Chen, Hsih-Ting You, Chi-Fu Chen, Wei-Ta Chen, Chien-Yang Lin
  • Patent number: 11719495
    Abstract: A plate heat exchanger includes heat transfer plates having openings at four corners thereof, having outer wall portions at their edges, and stacked together. The heat transfer plates are partially brazed together such that a first flow passage for first fluid and a second flow passage for second fluid are alternately arranged, with a heat transfer plate interposed between these flow passages, the openings communicating with each other, forming a first header allowing the first fluid to flow into and out of the first flow passage and a second header allowing the second fluid to flow into and out of the second flow passage. One heat transfer plate located between the first or second flow passage is formed by stacking two metal plates. Space between the metal plates includes a fine flow passage located within a heat exchange region, and a peripheral leakage passage outward of the fine flow passage.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: August 8, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Faming Sun, Susumu Yoshimura, Yoshitaka Eijima, Sho Shiraishi, Ryosuke Abe, Masahiro Yokoi, Kazutaka Suzuki
  • Patent number: 11698216
    Abstract: A refrigeration system including a storage chamber configured to store a product at a predetermined temperature. The storage chamber is defined by an inner wall. The inner wall at least partially defines an air plenum. The inner wall includes an opening wall surface, a floor surface, a rear wall surface and a ceiling wall surface. The system also includes a refrigerant circuit including a compressor, a condenser, a condenser fan, an evaporator and an evaporator fan arranged and disposed in an operable configuration to provide refrigeration to the storage chamber. The air plenum includes a conduit arranged and disposed to convey air from an air inlet across the evaporator and into a discharge chamber and out an air outlet. The air outlet is configured to discharge cooled air in a direction toward the opening wall surface.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: July 11, 2023
    Assignee: Standex International Corporation
    Inventors: Kevin Herrera Blackwood, Teddy Glen Bostic, Jr., Gloria Christine Corrine Welther Burchett, Mark Andrew James, Jonathan Matthew Kolaski, Jeffrey Alan Madill, John Lee Warder
  • Patent number: 11674721
    Abstract: A refrigerator according to an embodiment of the present invention includes: a compressor configured to compress a refrigerant; and an inverter module configured to control the compressor, wherein the inverter module includes: a heatsink provided with a cooling passage through which coolant passes; a coolant inlet connected to the heatsink to communicate with an inlet of the cooling passage; a coolant outlet connected to the heatsink to communicate with an outlet of the cooling passage; at least one insulated gate bipolar transistor (IGBT) disposed on a top surface of the heatsink; and at least one diode disposed to be spaced apart from the IGBT on the top surface of the heatsink, wherein the cooling passage includes: an IGBT cooling passage that is closer to the coolant inlet among the coolant inlet and the coolant outlet; and a diode cooling passage that is closer to the coolant outlet among the coolant inlet and the coolant outlet, wherein the diode cooling passage is disposed behind the IGBT cooling passa
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: June 13, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Kiwook Lee, Namsoo Lee, Chanmyung Park