Abstract: The invention relates to a method of manufacturing a rotor for an electric machine, wherein the rotor is composed of at least one electric sheet wherein at least one electric sheet is thermally treated regionally to directly modify its magnetic permeability in the treated region.

Abstract: The present invention relates to a punch down tool comprising a handle, a holder extending from the handle, and a down blade assembly operably connected to the holder. The down blade assembly comprises at least two down blades, wherein the down blades include a U-shaped cut out configured thereon for accommodating a wire that is to be crimped into a connector. The tool further comprises a housing in which the down blades are disposed such that the down blades are linearly displaceable within the housing. A cutting blade is also provided on the housing.

Abstract: Embodiments include microelectrodes including a flexible shank and a bioabsorbable material surrounding the flexible shank. The flexible shank can include a flexible substrate, a circuit, and a plurality of sensors. Embodiments also include a methods of forming flexible active electrode arrays including depositing a flexible polymer on a substrate. The methods also include forming a plurality of sensors on the flexible polymer and attaching a silicon-based chip to the flexible shank. The methods also include coating the flexible shank in a bioabsorbable material and cutting the shank and a portion of the bioabsorbable material from the substrate.

Abstract: A component mounting station is divided into two component mounting areas in a board conveyance direction according to the size of circuit boards used in two types of production that are performed in order, and the area in which a backup pin is arranged on a backup plate is divided into two pin arrangement areas corresponding to the two component mounting areas. The quantity of backup pins necessary to support the component mounting board are arranged in a predetermined arrangement pattern, the circuit boards transported using the conveyor are stopped in the component mounting areas according to the type of component mounting board produced, the backup plate is lifted up, and the circuit boards are clamped by the clamp member, and the circuit boards supported by the backup pins in the pin arrangement areas are positioned below the circuit boards, and components are mounted on the circuit boards.

Abstract: An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.

Abstract: An apparatus for manipulating a wire comprises a first lever and a second lever. The first lever comprises a first tip-support portion, a first handle portion, and a first hinge portion. The second lever comprises a second tip-support portion, a second handle portion, and a second hinge portion. The first hinge portion and the second hinge portion are pivotally interconnected about a lever-pivot axis. The apparatus also comprises means for biasing the first tip-support portion and the second tip-support portion toward each other, a first tip half pivotally coupled to the first tip-support portion, and a second tip half pivotally coupled to the second tip-support portion. The first tip half comprises a first channel. The second tip half comprises a second channel.

Abstract: A medium is accommodated in a container together with an electronic component body including an underlying electrode layer. The medium treats a surface of the underlying electrode layer while vibration is applied to the container. The medium is spherical or substantially spherical. The medium has a diameter not smaller than about 0.2 mm and not greater than about 2.0 mm. The medium contains tungsten.

Abstract: A wedge connector system for connecting first and second elongate electrical conductors includes a C-shaped sleeve member, a wedge member, and an insert member. The sleeve member defines a sleeve cavity and opposed first and second sleeve channels on either side of the sleeve cavity. The wedge member includes a wedge body having first and second opposed wedge side walls. The insert member is configured to be selectively mounted in the first sleeve channel and defines an insert member channel to receive the first conductor when the insert member is mounted in the first sleeve channel. The sleeve member and the wedge member are configured to capture the first and second conductors such that: the first conductor is received in the insert member channel and captured between the sleeve member and the first wedge side wall; and the second conductor is captured between the sleeve member and the second wedge side wall.

Abstract: A component mounter comprises a mounting head that holds a plurality of nozzles. Two imaging positions are provided for the circumferential orbit along which the nozzles of the mounting head are arranged. While the nozzles are rotated continuously about the rotation axis, an operation of imaging the nozzles located at the imaging positions is performed for each of the imaging positions. Therefore, in a period when the nozzles rotate by an angle not larger than a predetermined angle around the rotation axis formed by the interval between the two imaging positions adjacent to each other along the circumferential orbit, imaging of the nozzles can be completed by locating each of the nozzles at one of the two imaging positions. As a result, it becomes possible to image the plurality of nozzles of the mounting head efficiently.

Abstract: A manufacturing method for an electrode of a high-temperature piezoelectric element, comprises: coating traditional conductive slurry on surfaces of a molded piezoelectric material (1); then polarizing the piezoelectric material (1); and then removing the coating of conductive slurry (2) on the surfaces there of, and connecting the piezoelectric material to outside electrode lead wires (3) to output a signal generated by piezoelectric effect thereof. A structure of a high-temperature piezoelectric element, comprises polarized piezoelectric material (1), wherein the coating of metallic conductive slurry (2) is removed from the surfaces of the polarized piezoelectric material (1) and the surfaces of the polarized piezoelectric material (1) is connected to electrode lead wires (3) to output a signal generated by piezoelectric effect thereof.

Abstract: Methods of encapsulating an environmentally sensitive device. The methods involve temporarily laminating a flexible substrate to a rigid support using a reversible adhesive for processing, reversing the reversible adhesive, and removing the device from the rigid support.

Abstract: A method is provided for setting up a transmission link for electrical energy, in which at least one superconductive cable and a cryostat surrounding the same are used, the cryostat having two metal tubes arranged concentrically in relation to one another, between which a vacuum insulation is provided. The ends of the cryostat in the assembled state as well as the superconductive cable located in the same are attached on fixed parts of the transmission link. At least at one end of the cryostat, there is gaplessly connected to the same a tube body which is bent by an angle of at least 180° and likewise consists of two metal tubes arranged concentrically in relation to one another, between which a vacuum insulation is provided. The superconductive cable protruding from the cryostat is arranged in the tube body at room temperature in such a way that it runs at least in the direct proximity of the wall of the inner tube of the tube body that has the greater bending radius.

Abstract: A component mounting line configured to move an automatic exchanging device that performs setting and removing of feeders of multiple component mounters, including a position detecting device that detects the position of the automatic exchanging device is configured from a timing belt with an end and provided to extend in a straight line along the moving lane on the front side of the component mounting line, a timing pulley that moves together with the automatic exchanging device while maintaining a state in which the teeth of the timing pulley are engaged with the teeth of the timing belt, and a rotary encoder that outputs a rotation angle of the timing pulley, and the pulse output of the rotary encoder is counted to detect the position of the automatic exchanging device.

Abstract: A component-mounting device includes a mounting head, a discharging portion, and a paste receiving portion. The mounting head holds a component. The discharging portion applies paste by spraying to the component held by the mounting head. The paste receiving portion is provided on the mounting head and captures paste that has been discharged from the discharging portion and has failed to reach the component.

Abstract: A coil portion is formed. A first articulation portion extends from the coil portion. A first mounting structure extends from the first articulation portion. The first mounting structure includes a first mounting region configured to mount in contact with a terminal of a first electrical component. The first articulation portion and the first mounting structure are configured to position the first mounting region at a location outside of a strong electromagnetic field emanating from the coil portion. A second articulation portion extends from the coil portion. A second mounting structure extends from the second articulation portion. The second mounting structure includes a second mounting region configured to mount in contact with a terminal of a second electrical component. The second articulation portion and the second mounting structure are configured to position the second mounting region at a location outside of the strong electromagnetic field emanating from the coil portion.

Abstract: A motor for a surgical instrument includes a rotor and a stator. The rotor includes a shaft and a magnet. The stator includes (i) a cavity in which the rotor is disposed, and (ii) a coil assembly. The coil assembly includes multiple phase sets. The phase sets include multiple sets of wires. Each of the phase sets includes multiple coils and corresponds to a respective one of the sets of wires. The coils in each of the phase sets are at respective positions about the rotor. One of the sets of wires includes at least three wires. The stator causes the rotor to axially rotate a surgical tool of the surgical instrument based on current received at the sets of wires.

Abstract: A component mounter for holding a component and for mounting the component on a surface of a board includes a head, a horizontal moving device, a vertical moving device, a mounting control device, and an imaging device. The imaging device is configured to image an imaging target by receiving incident light from the imaging target on an imaging element via an optical system. The optical system includes a first optical system configured to guide incident light from a direction of a side surface of a nozzle tip to a first region of the imaging element, and a second optical system configured to guide incident light from a direction of the surface of the board to a second region of the imaging element. The imaging device is configured to image an image via the first optical system and the second optical system.

Abstract: The present invention concerns a method for making a microsatellite, comprising providing: modules of a first type configured to house electronic boards of a microsatellite; modules of a second type configured to house devices and systems of a microsatellite; and modules of a third type comprising first and second interface means configured to be coupled to a launch vehicle and to external appendages of a microsatellite, respectively; said modules of a third type being designed to cause a body of a microsatellite to have a predefined height; wherein all the modules of the first, second and third types are configured to be stacked regardless of the type. The method further comprises making a body of a microsatellite by stacking modules of different types, wherein the stacked modules include at least one module of the second type and at least one module of the third type.

Abstract: An electrical machine includes a casing including a base wall provided with a projection projecting from the base wall towards the inside of the casing. A stator includes a core having a plurality of pole shoes, a plurality of conductors wound on the pole shoes to form a plurality of coils constituting a stator winding. Insulators are interposed between the core and the stator winding. A coil of the winding has an end portion engaged with the projection for heat exchange. The insulators include a housing for a first number of turns of the coil and a second housing for a second number of turns of the coil. The first and second housings are shaped such that a layer of the turns of the end portion abutted against the projection is defined by stretches of the conductors all substantially coplanar with each other.

Abstract: A producing method for an electrical insulating structure that covers an outer surface of a to-be-insulated object is provided. The method comprises: a taping step of winding a main insulation tape on outside of the to-be-insulated object; a spraying step of spraying nanoparticles onto the outer surface of the wound main insulation tape; a vacuum drawing step of vacuum drawing the tape-wound to-be-insulated object; and an impregnation step of injecting a nanoparticle-containing impregnating macromolecular polymer in which nanoparticles have been kneaded to impregnate the to-be-insulated object therewith. In the spraying step, microcapsules, which contain the nanoparticles and are able to release the nanoparticles before the impregnation step, are sprayed.