Patents Examined by Livius R Cazan
  • Patent number: 11177708
    Abstract: A method for integrally manufacturing a stator core and a housing for an electrical machine includes printing, by a three-dimensional (3D) printing process, the stator core. In addition, the method includes printing, by the 3D printing process, the housing. In particular, printing the housing occurs contemporaneously with printing the stator core. The method also includes printing, by the 3D printing process, at least one end cap and coupling the at least one end cap to the housing to enclose a cavity defined by the housing.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: November 16, 2021
    Assignee: GE AVIATION SYSTEMS LLC
    Inventors: Hao Huang, Xiaochuan Jia, Joshua Tyler Mook
  • Patent number: 11177595
    Abstract: Disclosed aspects relate to connector structures and a card. A first connector structure is to join a first subset of a set of electrical connections. A second connector structure is to join a second subset of the set of electrical connections. The card manages the set of electrical connections and is located between the first and second connector structures to connect with the first and second connector structures.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: November 16, 2021
    Assignee: International Business Machines Corporation
    Inventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Mark J. Jeanson, Mark O. Maxson
  • Patent number: 11171548
    Abstract: A conductor shaping apparatus rotates one of a first shaping die and a second shaping die about a rotational axis with respect to the other so as to format least one bent portion in a conductor. The conductor shaping apparatus includes a holding section that holds the conductor, a first drive source that applies driving force to the first shaping die and rotates the first shaping die about the rotational axis, a second drive source that applies driving force to the second shaping die and rotates the second shaping die about the rotational axis, and a controller that controls the first and second drive sources so as to rotate one of the first and second shaping dies about the rotational axis with respect to the other and controls the first and second drive sources so as to integrally rotate the first and second shaping dies about the rotational axis.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: November 9, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Junki Nishino, Hiromitsu Kuraoka
  • Patent number: 11167384
    Abstract: A system and method for dismantling components of electronic media electronic storage devices such as hard disk drives, solid state drives and hybrid hard drives. The components are dismantled in a nondestructive manner so as to be capable of reuse. First devices loosen the various components of the storage device, Second devices are provided for removing components from the storage device. A holding chassis receives the storage device, and moves the storage device for engagement with the first and second devices. A mechanism may be provided for destroying the data containing portion of the electric storage device when it is removed from the storage device. A database of information concerning past and current storage devices including their configurations, component locations and screw/fastener locations is provided along with a scanning system for retrieving information about the storage device being introduced into the system.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: November 9, 2021
    Assignee: Serenity Data Security, LLC
    Inventor: Kevin P. Clark
  • Patent number: 11160173
    Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device is adapted to position and fix a circuit board having at least one pad. The first fixing device has a first positioning groove adapted to position the circuit board. The second fixing device is adapted to position and fix at least one wire. The second fixing device has at least one second positioning groove adapted to position the at least one wire. Each second positioning groove is aligned with a corresponding pad on the circuit board so that the wire in the second positioning groove is aligned with the corresponding pad on the circuit board.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: October 26, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Measurement Specialties (Chengdu) Ltd., TE Connectivity Services GmbH
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Lin Ye, Yong Yan, Roberto Francisco-Yi Lu, Qinglong Zeng
  • Patent number: 11152022
    Abstract: A correction method includes a correction process for correcting warping of a plate-like workpiece including a frame portion and a plurality of flexure elements formed within the frame portion. The correction process includes arranging a first clean sheet on an elastic mat having a flat upper surface, supplying the plate-like workpiece on the first clean sheet, overlaying a second clean sheet from above the first clean sheet and the plate-like workpiece, lowering a pressure roller toward the elastic mat from above the second clean sheet, sandwiching the plate-like workpiece between the elastic mat and the pressure roller, moving the pressure roller along an upper surface of the elastic mat while having the plate-like workpiece sandwiched between the elastic mat and the pressure roller, and taking out the plate-like workpiece from the first clean sheet.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: October 19, 2021
    Assignee: NHK SPRING CO., LTD.
    Inventors: Hiroyoshi Uetake, Yukihiro Hayashi
  • Patent number: 11146003
    Abstract: Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: October 12, 2021
    Assignee: International Business Machines Corporation
    Inventors: Alan F. Benner, Benjamin Vito Fasano, Paul Francis Fortier, Hilton T. Toy
  • Patent number: 11141823
    Abstract: Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: October 12, 2021
    Assignee: Laird Technologies, Inc.
    Inventors: Tsang-I Tsai, Yi-Shen Lin, Min-Wei Hsu, Chen-Xi Yu
  • Patent number: 11146156
    Abstract: A stator for a high efficiency motor, and a manufacturing method of such a stator, the stator including a stator core partitioned into a center hole and inner spaces. The stator core includes a yoke portion and a plurality of teeth. The stator includes coils coiled around the plurality of teeth, respectively, and filling parts filling the inner spaces, respectively. The filling parts are configured to prevent magnetic flux leakage from occurring between the coils coiled around the plurality of teeth.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: October 12, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Young Min Kim
  • Patent number: 11139090
    Abstract: An electrical cable having a plurality of conductors including a grounding conductor and at least one power-carrying conductor. The plurality of conductors disposed approximately in parallel within an outer jacket such that the electrical cable has a substantially elongated horizontal cross-section.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: October 5, 2021
    Assignee: Encore Wire Corporation
    Inventors: David K. Smith, William T. Bigbee, Jr., Jose D. Garza, Mark D. Bennett
  • Patent number: 11129321
    Abstract: A movement error detection apparatus includes a plurality of marks including a fifth mark (movable region inside mark) arranged in a movable region of a movable conveyor and first to fourth marks (movable region outside marks) arranged outside the movable region of the movable conveyor; a substrate recognition camera (imaging device to move together with a mounting head to image the first to fifth marks; and a projection device (auxiliary device) to assist an imaging. The first to fourth marks are arranged on a horizontal reference plane including a substrate, and the fifth mark is arranged at a position which is lower than the horizontal reference plane and at which the movable conveyor is not interfered. The projection device absorbs a height difference between the fifth mark and the horizontal reference plane to assist the substrate recognition camera in picking up a focused image of the fifth mark.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: September 21, 2021
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Tarou Kawai, Ryousuke Nakamura
  • Patent number: 11096320
    Abstract: A plurality of nozzles are arranged at intervals of a center-to-center distance along a circumferential orbit around the predetermined rotation axis integrally. The nozzle that is positioned at the working position is changed by rotating the plurality of nozzles around the predetermined rotation axis. At that time, regardless of the manner in which the nozzle positioned at the working position is changed, the nozzle approaching the working position, and the nozzle moving away from the working position, move within an imaging target range having a width smaller than twice the center-to-center distance with the working position as the center along the circumferential orbit. Then, a camera images the nozzle which is moving within the imaging target range. Thus, it is not necessary to temporarily stop the nozzle for imaging, and as a result, imaging of the nozzles is performed efficiently.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: August 17, 2021
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Tadashi Onishi, Akinobu Uesugi
  • Patent number: 11081820
    Abstract: The present disclosure includes an adjustable circuit board assembly including a circuit board, a header connected to the circuit board, and a matrix connector. The header may be configured for connection with the circuit board via a connection matrix and the matrix connector. A method of manufacturing a circuit board assembly may include providing a circuit board, providing a terminal header having a plurality of terminals, providing a connection matrix to at least one of the circuit board and the terminal header, providing a matrix connector, connecting the terminal header with the circuit board via the matrix connector and the connection matrix, and connecting the plurality of terminals to the circuit board.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: August 3, 2021
    Assignee: Lear Corporation
    Inventors: Montserrat Piñol Pedret, Ferran Juanes Ribas, Primitivo Aznar, Enric Aparicio Rollan
  • Patent number: 11076490
    Abstract: A method of applying viscous media on a substrate is disclosed. In the method, the substrate is provided, which is arranged for mounting of electronic components thereon. Further, flux is provided on a deposit of solder paste, which deposit is arranged at a predetermined position on the substrate. The flux is provided by a non-contact dispensing process, such as jetting. By providing flux on the deposit prior to reflow, the risk of quality related issues, such as e.g. graping, advantageously is reduced.
    Type: Grant
    Filed: September 7, 2015
    Date of Patent: July 27, 2021
    Assignee: MYCRONIC AB
    Inventor: Johan Bergström
  • Patent number: 11076493
    Abstract: Some embodiments of the inventive subject matter are directed to forming, on a first circuit board, first pins that connect to first leads of a first electronic component; forming, on the first circuit board, second pins that connect to second leads of a second electronic component; affixing the first circuit board to a second circuit board having a first layer with first wires; and forming second wires on a second layer of the second circuit board, wherein said forming the second wires creates an electrical connection on the second circuit board between a portion of the first pins and a portion of the second pins. In some embodiments, the second circuit board is smaller than the first circuit board, and the second layer of the second circuit board is, in length, approximately equivalent to a distance between the first electronic component and the second electronic component.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: July 27, 2021
    Assignee: International Business Machines Corporation
    Inventors: Douglas A. Baska, Daniel M. Dreps, Rohan U. Mandrekar, Roger D. Weekly
  • Patent number: 11071208
    Abstract: A circuit board component layout determination method includes the steps of: (1) simulating the placement of components by a circuit board layout software program; (2) performing a circuit board component layout density analysis to obtain a circuit board component layout density percentage; (3) determining whether or not the simulated placement of components is feasible according to the circuit board component layout density percentage, and if yes, carrying out step (4); and (4) placing the components into the circuit board. The method uses a circuit board layout software program and a spreadsheet or a database to calculate the statistics of an area of a circuit board that can be laid and an area of the circuit board that cannot be laid, so as to analyze and determine the implementability of a component layout, and improve the control, efficiency and cost-effective of the component layout of the circuit board.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: July 20, 2021
    Assignee: PORTWELL INC.
    Inventor: Shih Yao Lin
  • Patent number: 11063502
    Abstract: The disclosure relates to a method for producing a stator, where, for one or both layers of a two-layer winding, a tool with receiving regions is respectively provided on an end face of a laminated core. A relative arrangement of the receiving regions corresponds to a relative end position for conductor ends of the conductor elements. In a positioning process, the tool is moved into a first turning position and each conductor end of a first group of the conductor elements is respectively inserted into one of the receiving regions. Then the tool is turned into at least one further turning position and each conductor end of a further group of the conductor elements is respectively inserted into one of the receiving regions until the conductor ends of all the conductor elements of the layer are in the relative end position in relation to one another.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: July 13, 2021
    Assignee: CONTINENTAL AUTOMOTIVE GMBH
    Inventors: Axel Gohs, Christoph Radtke
  • Patent number: 11064611
    Abstract: A method for fabricating a printed circuit, comprising: darkening a surface location of a conductive material with one or more ultrafast pulses of laser radiation and ablating the conductive material at the surface location with one or more longer duration pulses of laser radiation to produce traces or micro via patterns on the surface of a PCB. A hole for a blind micro via is produced by ablating the conductive material at the darkened surface location with one or more longer duration pulses of laser radiation and cleaning a second conductive material under the substrate with one or more further longer duration pulses of laser radiation.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: July 13, 2021
    Assignee: IPG PHOTONICS CORPORATION
    Inventor: David C. Clark
  • Patent number: 11006559
    Abstract: A component transfer device includes a detector configured to detect a rotation angle of a driving motor that moves a pair of gripping sections, or a position of the gripping sections, and a motor control section configured to perform position feedback control of the driving motor based on a detection signal of the detector and a position command signal from the transfer control device. A transfer control device is provided with a torque monitoring section configured to monitor a value of a command torque applied to the driving motor from the motor control section, and a gripping state determining section configured to determine that there was a change in a gripping state of the component when, with the pair of gripping sections in a state gripping the component, the command torque monitored by the torque monitoring section drops to a value smaller than a first threshold value.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: May 11, 2021
    Assignee: FUJI CORPORATION
    Inventors: Hideyuki Kumazawa, Shingo Miyazaki
  • Patent number: 11004607
    Abstract: A method for manufacturing a multilayer ceramic capacitor includes: producing a plurality of dielectric green sheets; producing therefrom a plurality of internal electrode-printed green sheets; producing therefrom a plurality of individually cut unsintered laminates by stacking some of the plurality of dielectric green sheets, as cover layers, and the plurality of internal electrode-printed green sheets together; producing therefrom element body precursors by applying a ceramic paste to side faces of the unsintered laminates for forming side margins thereon, wherein an application thickness of the ceramic paste is adjusted in a manner such that a thickness of the side margins is greater than a thickness of the cover layers in the final product; producing therefrom element bodies by sintering; and forming external electrodes on at least one of principal faces and on both end faces of the element bodies.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: May 11, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Shohei Kitamura, Yukihiro Konishi, Kotaro Mizuno, Yoichi Kato, Yusuke Kowase, Toru Makino, Yoshinori Tanaka