Patents Examined by Livius Radu Cazan
  • Patent number: 10361527
    Abstract: A crimping device includes an anvil and a crimp tooling member. The anvil is configured to receive a terminal on a top surface thereof. The crimp tooling member has a forming profile recessed from a bottom side of the crimp tooling member. The forming profile is configured to engage a crimp barrel of the terminal as the crimp tooling member moves towards the anvil during a crimping operation to crimp the crimp barrel into mechanical and electrical engagement with an electrical wire disposed within the crimp barrel. The forming profile defines at least one pocket along a top-forming surface of the forming profile that extends between two side walls of the forming profile. Each pocket is configured to form a corresponding protrusion in the crimp barrel of the terminal during the crimping operation.
    Type: Grant
    Filed: February 18, 2016
    Date of Patent: July 23, 2019
    Assignees: TE CONNECTIVITY CORPORATION, TE CONNECTIVITY GERMANY GMBH
    Inventors: Helge Schmidt, Marjorie Kay Myers, David Alan College
  • Patent number: 10362681
    Abstract: A method for manufacturing a flexible circuit electrode array adapted to electrically communicate with organic tissue including the following steps: a) providing a flexible polymer base layer; b) curing the base layer; c) depositing a metal layer on base layer; d) patterning the metal layer and forming metal traces on the base layer; e) roughening the surface of the base layer; f) chemically reverting the cure of the surface of the base layer; g) depositing a flexible polymer top layer on the surface of the base layer and the metal traces; h) curing the top layer and the surface of the base layer forming one single flexible polymer layer; and i) creating openings through the single layer to the metal trace layer.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: July 23, 2019
    Assignee: Second Sight Medical Products, Inc.
    Inventors: Robert Greenberg, Neil Hamilton Talbot, Jordan Matthew Neysmith
  • Patent number: 10334769
    Abstract: A method of allocating electronic components to be mounted to each of a plurality of nozzle holders provided on a mounting head is provided, in which the electronic component which does not have a usage record or the electronic component which is a test target is allocated to a nozzle holder which does not have operation restrictions. An electronic component mounting system is provided with a mounting head which is provided with a plurality of nozzle holders, each of which holds a suction nozzle, and a control device which allocates electronic components to be mounted to each of the plurality of nozzle holders. The control device includes an electronic component allocation section which allocates an electronic component which does not have a usage record or an electronic component which is a test target to a nozzle holder which does not have operation restrictions.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: June 25, 2019
    Assignee: FUJI CORPORATION
    Inventor: Mitsuru Sanji
  • Patent number: 10332713
    Abstract: An apparatus for positioning and attaching one or more sensor devices to a surface of an electrical component is described. The apparatus comprises one or more sensor devices and a stencil fixture that holds at least one of the one or more sensor devices, where the stencil fixture positions the sensor at a location proximate to a surface of the electrical component prior to attaching the sensor to the surface of the electrical component.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: June 25, 2019
    Assignee: Whisker Labs, Inc.
    Inventors: Ryan Linderman, Steven M. Lanzisera
  • Patent number: 10320269
    Abstract: The transport device includes a backflow prevention mechanism that prevents backflow in which workpieces are moved in the direction opposite to the predetermined direction, the backflow prevention mechanism has two backflow prevention valves 810 attached to an end portion of a transport rail, and each of the backflow prevention valves 810 has an inductive plate 812 inclined with respect to the predetermined direction from the center of the transport rail to the side along the predetermined direction, and a coupling plate 813 combining a center side end portion of the inductive plate 812 positioned close to the center of the transport rail and a side surface of the transport rail.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: June 11, 2019
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Daisuke Ueno, Tsutomu Ogasawara, Keita Mitsunashi, Hideki Shigematsu
  • Patent number: 10305161
    Abstract: A dual stacked stripline circulator includes multiple composite ferrite discs, each having an inner portion and an outer portion; a first substrate having an edge with a first composite ferrite disc disposed in the first substrate; a second substrate having an edge with a second composite ferrite disc disposed in the second substrate; a third substrate having an edge with a third composite ferrite disc disposed in the third substrate, the third substrate disposed adjacent the second substrate; a fourth substrate having an edge with a fourth composite ferrite disc disposed in the fourth substrate; a first pattern defining three ports of a first three-port circulator disposed between the first substrate and the second substrate; a second pattern defining three ports of a second three-port circulator disposed between the third substrate and the fourth substrate; and a metal film encircling the edge of the first, second, third and fourth substrate.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: May 28, 2019
    Assignee: RAYTHEON COMPANY
    Inventors: James A. Carr, Mark B. Hanna
  • Patent number: 10304733
    Abstract: Carbon nanotube template arrays may be edited to form connections between proximate nanotubes and/or to delete undesired nanotubes or nanotube junctions.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: May 28, 2019
    Assignee: DEEP SCIENCE, LLC
    Inventors: Roderick A. Hyde, Muriel Y. Ishikawa, Nathan P. Myhrvold, Clarence T. Tegreene, Charles Whitmer, Lowell L. Wood, Jr.
  • Patent number: 10299366
    Abstract: In an example, a polymeric material is disclosed. The polymeric material includes a polymer substrate and a plurality of graphene traces arranged to form a tamper detection circuit on the polymer substrate.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: May 21, 2019
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark. D. Plucinski, Timothy J. Tofil
  • Patent number: 10284057
    Abstract: A highly versatile stator manufacturing device is provided. A stator manufacturing device 7 includes: an engagement portion 8 engageable with a distal end of an extension portion 5 of each of a plurality of conductor segments 4 extending from a plurality of extension positions that differ in a radial direction R in each slot 3 of a stator core 2; a circumferential direction drive portion 9 that drives the engagement portion 8 engaging with the extension portion 5 in a circumferential direction C, to bend the extension portion 5; and a radial direction drive portion 10 that drives the engagement portion 8 in the radial direction R.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: May 7, 2019
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Takahiro Kimura, Takeshi Yanagisawa, Hiroyuki Yabe
  • Patent number: 10275701
    Abstract: The invention relates to a method for producing portable data carriers (10, 11), wherein first there are provided a module carrier band (20), on which are arranged chip modules (26) with contact surfaces (21) arranged on one side of the module carrier band (20), and at least one substrate foil (31, 32, 33), respectively as rolled goods. The module carrier band (20) and the at least one substrate foil (31, 32, 33) are unrolled from the respective roll (51, 52, 53) and continuously brought together. Then, the module carrier band (20) is permanently connected with the at least one substrate foil (31, 32, 33) in such a way that the contact surfaces (21) of the chip modules (26) point outward. From the composite (40) there can be detached in particular portable data carriers in the format ID-000 (10) or mini-UICC (11).
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: April 30, 2019
    Assignee: GIESECKE+DEVRIENT MOBILE SECURITY GMBH
    Inventors: Thomas Tarantino, Thomas Gotz, Marc Elsasser, Robert Griesmeier
  • Patent number: 10256012
    Abstract: An assembly conductor manufacturing method includes aligning, around a center strand, a plurality of peripheral strands, each having at least two side surfaces, one of which opposes an adjacent peripheral strand on one side in a circumferential direction and the other of which opposes an adjacent peripheral strand on the other side in the circumferential direction, so as to form an assembly conductor in which the center strand and the peripheral strands are aligned; twisting the plurality of peripheral strands around the center strand that forms the assembly conductor; and plastic forming the twisted assembly conductor into a substantially rectangular sectional shape. The peripheral strand provided with the two side surfaces has a sectional shape in which a width between the side surfaces becomes narrower toward the center strand.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: April 9, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Toshiaki Masui, Hirofumi Inoshita
  • Patent number: 10250000
    Abstract: A tool comprising a receptacle for receiving and holding a cable terminating assembly comprising a plurality of conductors and a plurality of piercing contacts, the tool comprising a pair of handles which actuate opposed presses and blades, the presses pushing the piercing contacts into the conductors while the blades trim the ends of the conductors.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: April 2, 2019
    Assignee: BELDEN CANADA INC.
    Inventors: Jean-S├ębastien Plamondon, Arthur Becquart, Luc Milette, Benoit Chevarie, Vincent Pilon
  • Patent number: 10251281
    Abstract: This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: April 2, 2019
    Assignee: ABLEGO TECHNOLOGY CO., LTD.
    Inventor: Shu-Hui Hung
  • Patent number: 10250001
    Abstract: A wire crimping device includes: a wire crimping unit which crimps a crimping section into which a wire tip is inserted from a wire insertion opening which opens on a proximal end side of the crimping section in a long length direction; and a guiding unit which guides a distal end portion of an aluminum lead line to the wire insertion opening of a female crimp terminal arranged at a predetermined position for being crimped by the wire crimping unit, wherein an inner diameter of an opposedly facing portion of the guiding unit which opposedly faces the wire insertion opening is set in conformity with an inner diameter of the wire insertion opening.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: April 2, 2019
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Yukihiro Kawamura, Satoshi Takamura, Takeshi Hyotani, Koichi Kitagawa, Eiji Aramaki
  • Patent number: 10244639
    Abstract: A stacked mounting structure and a method of manufacturing stacked mounting structure are provided. The stacked mounting structure includes a plurality of members provided with a mounting area which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted, and an electroconductive member which is disposed on the area for connections between the mutually facing members, and a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: March 26, 2019
    Assignee: OLYMPUS CORPORATION
    Inventors: Mikio Nakamura, Yu Kondo
  • Patent number: 10237978
    Abstract: A fabricating method according to the present disclosure is a component built-in multilayer substrate fabricating method for incorporating a component (12) in a resin multilayer substrate (11) formed by laminating and pressing thermoplastic resin sheets (111a to 111d) so as to crimp them to each other. With the fabricating method according to the present disclosure, a metal pattern (13) is provided on a component mounting surface of the thermoplastic resin sheet (111a). Further, the component (12) is inserted in the area sandwiched by the metal pattern (13). Out of widths relating to the area sandwiched by the metal pattern (13), the width in the component mounting surface side is assumed to be a width W2, and the width in the component-insertion side is assumed to be a width W3, the width W2 being equal to or larger than a width W1 of the component but less than the width W3.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: March 19, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kuniaki Yosui
  • Patent number: 10219387
    Abstract: A process for manufacturing a printed circuit board having high-density microvias formed in a thick substrate is disclosed. The method includes the steps of forming one or more holes in a thick substrate using a laser drilling technique, electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes, and filling the one or more plated holes with a non-conductive material.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: February 26, 2019
    Assignee: NVIDIA CORPORATION
    Inventors: Leilei Zhang, Ronilo V. Boja, Abraham Fong Yee, Zuhair Bokharey
  • Patent number: 10209072
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using accelerometers. Some such accelerometers include a substrate, a first plurality of electrodes, a second plurality of electrodes, a first anchor attached to the substrate, a frame and a proof mass. The substrate may extend substantially in a first plane. The proof mass may be attached to the frame, may extend substantially in a second plane and may be substantially constrained for motion along first and second axes. The frame may be attached to the first anchor, may extend substantially in a second plane and may be substantially constrained for motion along the second axis. A lateral movement of the proof mass in response to an applied lateral acceleration along the first or second axes may result in a change in capacitance at the first or second plurality of electrodes.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: February 19, 2019
    Assignee: SNAPTRACK Inc.
    Inventors: Philip Jason Stephanou, David William Burns, Ravindra Vaman Shenoy
  • Patent number: 10201092
    Abstract: A carrier-attached copper foil having satisfactory circuit formability on the ultra-thin copper layer surface is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order. The ultra-thin copper layer surface has an absorbance of light at a wavelength of 400 nm is 85% or more.
    Type: Grant
    Filed: November 27, 2014
    Date of Patent: February 5, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Tomota Nagaura
  • Patent number: 10181635
    Abstract: Methods and systems are disclosed for enabling installation of antennas in a cost effective and efficient manner. The methods and systems disclosed herein provide a hollow pole and an elevating mechanism, wherein the elevating mechanism can be used to position antenna equipment located in one or more capsules attached to the elevating mechanism. The antenna equipment may be attached to a removable power source located in the capsule or to a non-removable power source located at the base of the hollow pole. Additionally, the antenna equipment may also be attached to communications equipment adapted to communicate with one or more communications networks. In an embodiment disclosed herein, the capsules may be adapted to rotate around a one or more axis in response to received commands and/or in accordance with instructions stored on a memory module attached to the capsules.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: January 15, 2019
    Assignee: CenturyLink Intellectual Property LLC
    Inventor: Charles I. Cook