Patents Examined by Livius Radu Cazan
  • Patent number: 10181635
    Abstract: Methods and systems are disclosed for enabling installation of antennas in a cost effective and efficient manner. The methods and systems disclosed herein provide a hollow pole and an elevating mechanism, wherein the elevating mechanism can be used to position antenna equipment located in one or more capsules attached to the elevating mechanism. The antenna equipment may be attached to a removable power source located in the capsule or to a non-removable power source located at the base of the hollow pole. Additionally, the antenna equipment may also be attached to communications equipment adapted to communicate with one or more communications networks. In an embodiment disclosed herein, the capsules may be adapted to rotate around a one or more axis in response to received commands and/or in accordance with instructions stored on a memory module attached to the capsules.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: January 15, 2019
    Assignee: CenturyLink Intellectual Property LLC
    Inventor: Charles I. Cook
  • Patent number: 10170817
    Abstract: A technique relates to a superconducting airbridge on a structure. A first ground plane, resonator, and second ground plane are formed on a substrate. A first lift-off pattern is formed of a first lift-off resist and a first photoresist. The first photoresist is deposited on the first lift-off resist. A superconducting sacrificial layer is deposited while using the first lift-off pattern. The first lift-off pattern is removed. A cross-over lift-off pattern is formed of a second lift-off resist and a second photoresist. The second photoresist is deposited on the second lift-off resist. A cross-over superconducting material is deposited to be formed as the superconducting airbridge while using the cross-over lift-off pattern. The cross-over lift-off pattern is removed. The superconducting airbridge is formed to connect the first and second ground planes by removing the superconducting sacrificial layer underneath the cross-over superconducting material. The superconducting airbridge crosses over the resonator.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: January 1, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Josephine B. Chang, John M. Cotte
  • Patent number: 10170245
    Abstract: Disclosed herein is a multilayer capacitor comprising: a laminate in which a plurality of first sheets and second sheets are alternately laminated, wherein the first sheets and the second sheets are disposed in a direction perpendicular to a mounting surface; a first inner electrode formed on the first sheets, wherein the first electrode is exposed through upper, lower, and first lateral surfaces of the laminate; a second inner electrode that is formed on the second sheets and has a horizontally symmetrical shape with respect to the first inner electrode; a sealing portion encapsulating the first and second inner electrodes exposed through two lateral surfaces of the laminate; and an external electrode that is electrically connected to the first and second inner electrodes exposed through the upper and lower surfaces of the laminate.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: January 1, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hae Suk Chung, Jae Yeol Choi, Hyun Woo Kim, Dong Su Cho
  • Patent number: 10155106
    Abstract: A method for making an implantable lead is related. A pipe is provided. The pipe includes a first end portion, a second end portion opposite to the first end portion, and a middle portion connecting the first end portion and the second end portion. A flexible conductive layer is formed on the middle portion of the pipe. At least one contactor is applied on the first end portion of the pipe. At least one connector is applied on the second end portion of the pipe. At least one wire is placed in the pipe to electrically connect the at least one contactor and the at least one connector.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: December 18, 2018
    Assignee: TSINGHUA UNIVERSITY
    Inventors: Lu-Ming Li, Chang-Qing Jiang, Hong-Wei Hao
  • Patent number: 10149420
    Abstract: A component mounting method is provided in a component mounting apparatus that mounts a component onto a board using a plurality of pieces of production data linked to component data. The method includes executing, when the component data is changed, a simulation of a production cycle time based on the production data, and comparing a simulation result of the production cycle time after change of the component data with a production cycle time or a simulation result of the production cycle time before change of the component data, and outputting a comparison result.
    Type: Grant
    Filed: July 8, 2015
    Date of Patent: December 4, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Isato Iwata, Hirokazu Takehara, Takuya Yamazaki, Hiroki Sagara
  • Patent number: 10148054
    Abstract: A method is described for solderless electrical press-in contacting of conductive press-in pins in circuit boards, the method comprising the following steps: Providing a circuit board having at least one contacting opening for press-in contacting; providing at least one press-in component having at least one conductive press-in pin; providing a sonotrode for exerting a force and for applying ultrasonic energy. In order to electrically and mechanically contact press-in pins to a circuit board by means of ultrasonic press-in technology, it is provided that the press-in component together with its press-in pin, is fixated during a press-in step, in particular held firmly in place, and that a force and ultrasonic energy are directly applied to the circuit board by means of the sonotrode such that the circuit board is pressed at the location of its contacting opening onto the press-in pin, not directly acted upon by the sonotrode, of the press-in component.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: December 4, 2018
    Assignee: Robert Bosch GmbH
    Inventors: Andreas Otto, Cynthia Halm
  • Patent number: 10115521
    Abstract: An electronic component includes a multilayer body formed by laminating an insulator substrate and a plurality of insulator layers, a coil including coil conductors provided on the insulator substrate, and an internal magnetic path penetrating the insulator substrate. A manufacturing method for the electronic component includes: forming the coil conductors and a sacrificial conductor at the same time on a mother insulator substrate, which is the assemblage of a plurality of the insulator substrates; laminating insulator sheets, which are to be the corresponding insulator layers mentioned above, on the mother insulator substrate so as to cover the coil conductors; and exposing the sacrifice conductor by removing part of the insulator sheets.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: October 30, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Akinori Hamada
  • Patent number: 7168159
    Abstract: In a wire termination apparatus, an anvil for placing a terminal thereon is mounted on a base plate, corresponding in position to a crimper of a ram. The terminal is crimped by a crimping portion, which includes the crimper and the anvil. An elongate link piece is mounted on the ram, and a guide member having a groove in which an elongate component, such as a fluorescent tube, is placed, is mounted on the tip of the link piece. The guide member is positioned to be aligned with the terminal placed on the anvil, when the ram is in its uppermost position. A conductive lead of the component and a conductor of an insulated wire are inserted into the terminal from directions perpendicular to each other, then the terminal is crimped by the crimper.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: January 30, 2007
    Assignee: Tyco Electronics AMP K.K
    Inventor: Kouji Imai
  • Patent number: 7159295
    Abstract: A miniature PMDC motor 10 has a permanent magnet stator comprising two arcuate ceramic magnets 20 fitted to a can-like housing 11 and circumferentially separated by interdisposed rubber magnets 21 wedging or nipping the ceramic magnets 20 in place within the housing 11 without the use of circumferential magnet stops formed in the side of the housing.
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: January 9, 2007
    Assignee: Johnson Electric S.A.
    Inventor: James Ching Sik Lau
  • Patent number: 7155811
    Abstract: An armature for a brush commutated electric motor having a distributed coil winding arrangement for reducing brush arcing and electromagnetic interference (EMI). The winding pattern involves segmenting each coil into first and second subcoil portions with differing pluralities of turns. Each subcoil portion is wound around separate pairs of spaced apart slots of a lamination stack. Adjacent coils are wound such that one subcoil portion of each is wound in a common slot to therefore form an overlapping arrangement of each pair of adjacently coils. The winding pattern serves to “shift” the resultant magnetic axes of each coil in such a manner so as to significantly reduce brush arcing and the EMI resulting therefrom. The reduction in EMI is sufficient to eliminate the need for EMI reducing components, such as chokes, which have typically been required to maintain EMI to acceptably low levels.
    Type: Grant
    Filed: September 20, 2004
    Date of Patent: January 2, 2007
    Assignee: Black & Decker Inc.
    Inventor: Ren Hong Wang
  • Patent number: 7152306
    Abstract: A method for installing a stator winding in a stator core. A winding turn is formed by drawing a cable portion from a cable reel and inserting it into two winding slots. Each winding turn that is jointlessly connected to first winding turn and has the same winding direction as the first turn is formed by making this winding turn include a cable section corresponding to a turn on the reel that has been lifted off the reel by lateral movement over a gable of the reel. To form each winding turn that is jointlessly connected to the first winding turn and has a second winding direction opposite the winding direction of the first turn, the cable portion forming this winding turn is made to include a section corresponding to a turn on the reel that has been lifted off the reel by lateral movement over the other gable.
    Type: Grant
    Filed: February 8, 2002
    Date of Patent: December 26, 2006
    Assignee: ABB AB
    Inventors: Birger Andersson, Lars Öhrn, John Seppas, Hans-Åke Eriksson, Gunnar Porsby, Göran Eriksson, Jan-Olof Lamell, Ville Voutilainen, Daniel Dahlblom, Lars Bjernegård
  • Patent number: 7150090
    Abstract: A method to replace a brushless exciter with a static excitation system for a generator including the steps of: measuring a plurality of dimensions of the brushless exciter; determining a rotational mass moment of inertia of a rotation portion of the excitation system design; forming a rotating static excitation system having substantially the same rotational mass moment of inertia as the brushless exciter; removing the brushless exciter from the generator, and attaching the static excitation system to the generator.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: December 19, 2006
    Assignee: General Electric Company
    Inventors: David Norwood Dorsey, Klaus Werner Sommerlatte
  • Patent number: 7146718
    Abstract: When mounting semiconductor chips, the semiconductor chips are presented on a wafer table where they are picked one after the other by a pick and place system, transported and placed onto a substrate that rests on a supporting surface of a substrate table. The wafer table is aligned diagonally to the supporting surface of the substrate table whereby part of the wafer table is located under the substrate table. The pick and place system comprises a shuttle with a swivel arm carrying a bondhead. The swivel arm is swivelled back and forth between two predetermined swivel positions whereby in the first swivel position a longitudinal axis of the swivel arm embraces the angle ? with the perpendicular to the supporting surface of the substrate table and whereby in the second swivel position the longitudinal axis of the swivel arm runs orthogonally to the supporting surface of the substrate table.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: December 12, 2006
    Assignee: ESEC Trading SA
    Inventor: Silvan Thuerlemann
  • Patent number: 7143506
    Abstract: A method for manufacturing rotary electric machine that has a stator winding to provide a stator winding that has a plurality of conductors wound one over another. The conductors are wound with left and right ends. Therefore, the stator winding on the stator core has an overlapped joined portion.
    Type: Grant
    Filed: October 27, 2003
    Date of Patent: December 5, 2006
    Assignee: Denso Corporation
    Inventor: Tooru Ooiwa
  • Patent number: 7134180
    Abstract: An electric machine (40) has a stator (43), a permanent magnet rotor (38) with permanent magnets (39) and a magnetic coupling uncluttered rotor (46) for inducing a slip energy current in secondary coils (47). A dc flux can be produced in the uncluttered rotor when the secondary coils are fed with dc currents. The magnetic coupling uncluttered rotor (46) has magnetic brushes (A, B, C, D) which couple flux in through the rotor (46) to the secondary coils (47c, 47d) without inducing a current in the rotor (46) and without coupling a stator rotational energy component to the secondary coils (47c, 47d). The machine can be operated as a motor or a generator in multi-phase or single-phase embodiments and is applicable to the hybrid electric vehicle. A method of providing a slip energy controller is also disclosed.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: November 14, 2006
    Assignee: UT-Battelle, LLC
    Inventor: John S. Hsu
  • Patent number: 7131191
    Abstract: In a wire drawing process for forming a wire rod containing iridium as a main component and which further contains nickel and at least one of platinum, rhodium and ruthenium, and having a cross-sectional area of not smaller than 0.05 mm2 and not larger than 1.2 mm2. The worked material is continuously heated red hot and/or white hot in a heating region 103 extending up to 60 mm from the work inserting surface 101a of a die 101 in a direction opposite that in which the work 102 moves, the work being heated to a temperature of 1000 to 1150° C. at a temperature measuring position 105 which is removed from the work inserting surface 101a by 20 mm. Furthermore, the temperature in the region 106 extending from the temperature measuring position 105 to the work inserting surface 101a is set to not lower than 1000° C., and the wire drawing rate is set to 300 to 1600 mm/min.
    Type: Grant
    Filed: April 14, 2004
    Date of Patent: November 7, 2006
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Wataru Matsutani, Osamu Yoshimoto, Yoshihiro Matsubara
  • Patent number: 7124499
    Abstract: The apparatus is used for installing a wire in a crimp, in particular a wire being provided on a wire spool mounted on a spool holder. The wire outputs the apparatus at a wire output guide. The apparatus comprises a crimp punch tool located in front of the wire output guide. A first actuator allows operating the crimp punch tool. The wire is cut using a wire cutter adjacent to the crimp punch tool. The cutter tool is operated by a second actuator. In use, the wire is installed by feeding the wire from the wire spool through the wire output guide and then into the crimp. The crimp is closed by punching it using the crimp punch tool. The wire is cut after the last crimp using the wire cutter tool. The apparatus and method can be used for installing very fragile and small wires.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: October 24, 2006
    Assignee: Simpler Networks Inc.
    Inventors: Jean-Claude Villeneuve, Michel Décarie, Normand Lassonde, Pierre Kakos, Paul-André Messier
  • Patent number: 7120995
    Abstract: An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a pick and place system with a bondhead with a chip gripper. Part of the wafer table is located underneath the substrate table. The pick and place system has a first linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a first direction guided by first guide elements, and a second linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a second direction. The shuttle of the first linear motor has second guide elements that guide the shuttle of the second linear motor. The bondhead with the chip gripper is arranged on the shuttle of the second linear motor.
    Type: Grant
    Filed: June 3, 2004
    Date of Patent: October 17, 2006
    Assignee: ESEC Trading SA
    Inventor: Dieter Vischer
  • Patent number: 7117582
    Abstract: A method of enabling a reliable, motor-to-base merge process is designed for motors that are attached to a base with screws that mount from outside of the base. An assembly fixture receives the motor, which has a tooling hole for circumferentially locating the motor relative to the base. The assembly fixture closely receives the motor and has a tooling pin that engages the tooling hole to prevent rotation of the motor relative to the assembly fixture. During the motor-to-base merge process, the motor is inverted with the tooling pin in the tooling hole. The assembly fixture aligns the threaded screw holes in the motor with the mounting holes on the base.
    Type: Grant
    Filed: September 23, 2003
    Date of Patent: October 10, 2006
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Ta-Chang Fu, Ungtae Kim, Robert A. Lenicheck, Sattar Malek, Stanley Yen Wong
  • Patent number: 7117593
    Abstract: An electrical connector and a method for producing the same are described. The electrical connector has an insulative housing and a plurality of metallic wires. The insulative housing has a plurality of slots formed therein, and the slots are defined with a width less than that of the metallic wire. The metallic wires are set into the slots and further are folded. Each of the metallic wires has a contact portion protruding out of a surface of the insulative housing for electrically connecting the electrical component.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: October 10, 2006
    Inventor: Ted Ju