Abstract: A multi-port semiconductor memory in which wrong read-out due to coupling noise is hardly generated and operation speed is fast is provided. When data are written in memory cells from a pair of bit lines for one port, NMOS transistors become on. Electrical potential only at a low-level side is pulled up between the pair of bit lines, because electrical potential at a high-level side is approximately equivalent to power potential. Accordingly, when one of adjacent bit lines is on high-level and the other is on low-level, potential difference is reduced by the pull-up, resulting in reduction of generating time of the coupling noise. Although read-out of data can not be performed while the coupling noise is being generated, since the concerned generating time is reduced in the invention, the operation speed is substantially fast.

Abstract: The non-volatile memory device includes a current detection circuit for comparing, in data retrieve operation, storage information written in a non-volatile manner in a memory cell row with retrieval information in order to determine whether or not the storage information matches the retrieval information. The current detection circuit compares a data read current flowing through each bit line corresponding to each memory cell of a memory cell row storing the storage information with a data read current flowing through each bit line corresponding to each retrieval memory cell storing the retrieval information.

Abstract: A string of memory cells with a charge trapping structure is read, by selecting part of a memory cell selected by a word line. Part of the memory cell is selected by turning on one of the pass transistors on either side of the string of memory cells. The charge storage state of the selected part is determined by measuring current in a bit line tied to both pass transistors.

Abstract: As part of anti-fuse circuitry for a memory device, a preferred exemplary embodiment of the current invention provides a direct connection between an anti-fuse and a contact pad used to provide voltage to that anti-fuse. The contact pad also serves as a voltage source for at least one other part of the memory device. At least one circuit coupled to the anti-fuse is temporarily isolated from it in the event that a voltage present at the pad would damage the circuit or cause the circuit to improperly read the status of the anti-fuse. The contact pad is available during a probe stage of the in-process memory device, but once the device is packaged, access to that contact pad is prevented. At the backend of the production process, the anti-fuse may be accessed through a second pad, whose electrical communication with the anti-fuse is regulated.

Abstract: A high-density DDR-1/DDR-2 compatible SDRAM chip with a reduced output circuit area is provided. When the SDRAM is a DDR1 SDRAM, an output signal output from an output circuit (14) is output to an output terminal (17) as a main output signal. When the SDRAM is a DDR2 SDRAM, an output signal output from an output circuit (15) is output to the output terminal (17) as the main output signal and, at the same time, the output signal output from the output circuit (14) is output as a sub-output signal to perform operation for adjusting the slew rate or the amount of output current of the main output signal or for adjusting the impedance of the output terminal as viewed from an external point.

Abstract: Semiconductor memory devices. A semiconductor memory device includes a booster circuit generating a predetermined power voltage exceeding an external power voltage, a global power line supplying the predetermined power voltage, and a plurality of memory blocks. Each memory block has a local power line, a plurality of functional circuits coupled to the local power lines and a voltage control device coupled between the global power line and the local power line. The voltage control device outputs the predetermined power voltage or a first voltage to the functional circuits through the local power line in a first period and a second period respectively, according to a select signal, wherein the first voltage exceeds the external power voltage but is lower than the predetermined power voltage.

Abstract: An end of a selected bit line in a selected column is electrically coupled to an end of a corresponding current return line by one of first and second write column select gates, which are selectively turned on in response to results of column selection. A data write circuit sets the other end of the selected bit line and the other end of the current return line to one and the other of a power supply voltage and a ground voltage in accordance with a level of write data via one of first and second data buses and an inverted data bus, respectively.

Abstract: An aspect of the present invention provides a ferroelectric memory comprising a cell block having a plurality of unit cells connected in series, one end of the cell block being connected to a plate line and the other end of the cell block being connected to a bit line through a block selecting transistor, a sense amplifier connected to the bit line, and a block selector decoder which controls ON/OFF of the block selecting transistor. The timing for operating the sense amplifier and block selector decoder is changed corresponding to a position of a selected unit cell objective for data read of the plurality of unit cells.

Abstract: A memory circuit has a regular memory cell array; a redundant memory cell array that can replace a failed portion in the regular memory cell array; a redundant replacement memory for storing data on the failed portion in the regular memory cell array; and a pre-charge circuit disposed in the regular memory cell array, depending on the data on the failed portion, the failed portion in the regular memory cell array is replaced with the redundant memory cell array, whilst a pre-charge path is closed which leads to the pre-charge circuit corresponding to the failed portion. This enables a common redundant replacement memory to effect a relief of the failed portion and shutoff of the pre-charge current to the failed portion.

Abstract: A ferroelectric memory device preventing an imprint and including a plurality of wordlines, a plurality of bitlines, a plurality of ferroelectric memory cells, a wordline driver which drives the wordlines, and a bitline driver which drives the bitlines. The wordline driver and the bitline driver switch an operation mode of the ferroelectric memory device to a first mode which is one of a data reading mode, a data rewriting mode and a data writing mode, by applying a voltage Vs having a first polarity to at least one ferroelectric memory cell selected from the ferroelectric memory cells.

Abstract: Each nonvolatile memory cell transistor has such directivities that a current flows only from the drain to the source and that charge is exchangeable only at the source. The source of one of a pair of memory cell transistors connected to each word line is connected to the drain of the other memory cell transistor, and the drain of the one memory cell transistor is connected to the source of the other. During a data rewrite operation, reverse voltages are applied to the sources and drains of the pair of memory cell transistors. Because of the directivities of each memory cell transistor, charge is exchanged with a charge accumulation layer only in the source region. This makes the data rewritable in only one of the pair of memory cell transistors. As a result, data is rewritable on a memory cell basis without increasing the memory cell size.

Abstract: Structures and methods for DEAPROM memory with low tunnel barrier intergate insulators are provided. The DEAPROM memory includes a first source/drain region and a second source/drain region separated by a channel region in a substrate. A floating gate opposes the channel region and is separated therefrom by a gate oxide. A control gate opposes the floating gate. The control gate is separated from the floating gate by a low tunnel barrier intergate insulator having a tunnel barrier of less than 1.5 eV. The low tunnel barrier intergate insulator includes a metal oxide insulator selected from the group consisting of NiO, Al2O3, Ta2O5, TiO2, ZrO2, Nb2O5, Y2O3, Gd2O3, SrBi2Ta2O3, SrTiO3, PbTiO3, and PbZrO3. The floating gate includes a polysilicon floating gate having a metal layer formed thereon in contact with the low tunnel barrier intergate insulator. And, the control gate includes a polysilicon control gate having a metal layer formed thereon in contact with the low tunnel barrier intergate insulator.

Abstract: A method for programming a single bit nonvolatile memory cell integrated on a metal-dielectric-semiconductor technology chip. The memory cell comprises a semiconductor substrate including a source, a drain, and a channel in-between the source and the drain. The memory cell further comprises a control gate that comprises a gate electrode and a dielectric stack. The gate electrode is separated from the channel by the dielectric stack. Further, the dielectric stack comprises at least one charge storage dielectric layer. The method for programming the memory cell comprises applying electrical ground to the source, applying a first voltage having a first polarity to the drain, applying a second voltage of the first polarity to the control gate; and applying a third voltage having a second polarity opposite to the first polarity to the semiconductor substrate.

Abstract: Through the use of an allocation logic unit with a Flash controller, a single primary chip enable is de-multiplexed into a multiple secondary chip enables for multiple Flash memory dies or chips. In so doing, Flash storage device capacity is greatly expanded. In a first aspect, a memory package includes a plurality of memories; and an allocation logic unit coupled to the plurality of memories for receiving a single chip enable signal. The allocation logic unit de-multiplexes the single chip enable signal to a plurality of chip enable signals. Each of the plurality of chip enable signals access to one of the plurality of memories. In a second aspect, a printed circuit board (PCB) includes a Flash controller for providing at least one primary chip enable signal. The PCB also includes a plurality of Flash memory chips and at least one allocation logic unit coupled to at least a portion of the plurality of Flash memory chips and the Flash controller.

Abstract: A memory module includes a plurality of integrated memory components are arranged on a mounting substrate and a refresh control circuit arranged separately from the memory components on the mounting substrate. The output of the refresh control circuit is connected to the plurality of integrated memory components. The refresh control circuit receives and processes address or command signals which have been generated outside the memory module; based on the access information obtained therefrom, independently generates a refresh command or a refresh command sequence for refreshing the contents of memory cells in a selected one of the memory components; and transmits the command or command sequence to the selected memory component. Refresh commands of this type no longer have to be generated by a memory controller.

Abstract: A ferroelectric memory device includes a bit line pair, a plurality of memory cells which include one transistor and one ferroelectric capacitor, and a plurality of judgement memory cells which include two transistors and two ferroelectric capacitors. Each of the memory cells is connected to one of the bit lines of the bit line pair, and each of the judgement memory cells is connected to both of the bit lines of the bit line pair.

Abstract: A dual port semiconductor memory device, including PMOS scan transistors, is provided. The dual port semiconductor memory device includes two PMOS transistors, two NMOS pull-down transistors, two NMOS pass transistors, and a PMOS scan transistor. The scan transistor being PMOS, noise margins can be improved. In addition, these seven transistors are arranged in two n-wells and 2 p-wells, while n-wells and p-wells are arranged in series and in alternating fashion. Therefore, the length of a memory cell along the minor axis of the memory cell is relatively short. This memory cell layout helps shorten the length of a bit line by arranging a pair of bitlines in parallel with well boundaries, i.e., in the direction of the short axis of the memory cell, and makes it possible to prevent crosstalk between a bitline and a complementary bitline by arranging conductive lines between the bitline and the complementary bitline.

Abstract: In a card storage device containing a non-volatile memory and a buffer memory, the buffer memory includes a plurality of banks. Data is transferred sequentially from a host CPU to the banks of the buffer memory, data is transferred to the non-volatile memory from a bank that becomes full, a write operation is started when one unit of data to be written into the non-volatile memory at a time has been transferred and, without waiting for the data to be written, the next write data is transferred from the host CPU to a bank from which write data has been transferred.

Abstract: A sense amplifier circuit comprises (1) an isolation device comprising a control terminal and first and second terminals, the first terminal of the isolation device coupled to a signal line, (2) a gated diode comprising first and second terminals, the first terminal of the gated diode coupled to the second terminal of the isolation device, and the second terminal of the gated diode coupled to a set line; and (3) control circuitry coupled to the control terminal of the isolation device and adapted to control voltage on the control terminal of the isolation device in order to enable and disable the isolation device. A latch circuit further comprises a precharge device comprising a control terminal and first and second terminals, the first terminal of the precharge device coupled to a power supply voltage, and the second terminal of the precharge device coupled to the first terminal of the isolation device.

Abstract: A reference voltage generator uses a conventional forward junction voltage generating device and a conventional thermal generator to generate a thermal voltage. The forward junction voltage and the thermal voltages have respective thermal sensitivities that act oppositely to each other so that, when the forward junction voltage is combined with the thermal voltage to produce a reference voltage, the reference voltage is substantially insensitive to temperature. The forward junction voltage and the thermal voltage are combined to produce the reference voltage in a manner that avoids generating any voltage having a magnitude that is greater than the magnitude of the sum of the forward voltage and the thermal voltage.