Abstract: A method for repairing cells of a flash memory array includes using a fuse memory array circuit. The fuse memory cells are initially programmed. The locations of defective memory cells of the main array are determined. These locations are stored in the fuse memory cells by erasing predetermined locations in the fuse memory cell array so that the locations are programmed.

Abstract: A nonvolatile memory array has a single transistor flash memory cell and a two transistor EEPROM memory cell which maybe integrated on the same substrate. The nonvolatile memory cell has a floating gate with a low coupling coefficient to permit a smaller memory cell. The floating gate placed over a tunneling insulation layer, the floating gate is aligned with edges of the source region and the drain region and having a width defined by a width of the edges of the source the drain. The floating gate and control gate have a relatively small coupling ratio of less than 50% to allow scaling of the nonvolatile memory cells. The nonvolatile memory cells are programmed with channel hot electron programming and erased with Fowler Nordheim tunneling at relatively high voltages.

Abstract: In an embodiment of a method of programming a resistive memory device, an electrical potential is applied to the gate of a transistor operatively associated with the resistive memory device, and successive, increasing electrical potentials are applied across the resistive memory device. In another embodiment of a method of programming a resistive memory device, an electrical potential is applied across the resistive memory device; and successive, increasing electrical potentials are applied to the gate of a transistor operatively associated with the resistive memory device.

Abstract: Disclosed here is a nonvolatile semiconductor memory device used to prevent data loss that might occur in unselected memory cells due to a disturbance that might occur during programming/erasing in/from those memory cells. In the nonvolatile semiconductor memory device, the number of programming/erasing operations performed in a data storage block over a programming/erasing unit of the subject nonvolatile memory is recorded in an erasing/programming counter EW CT provided in each data storage block. When the value of the erasing/programming counter reaches a predetermined value, the data storage block corresponding to the erasing/programming counter is refreshed. In the refreshing operation, the data in the data storage block is stored in a temporary storing region provided in the data storage block, then the data in a temporary storing region of the data storage area is erased and the data stored temporarily is programmed in the data storage block again.

Abstract: The invention disclosed herein is a non-volatile memory device. The non-volatile memory device comprises: a first transistor connected between a first voltage and a control node, and controlled by a second voltage; a second transistor connected between the first voltage and the control node, and controlled by a third voltage, and a word line driver for driving a word line in responsive to a voltage of the control node. The second voltage is set to a ground voltage during an erase operation. The third voltage is set to a power voltage during the erase operation.

Abstract: A semiconductor device includes signal lines over which signals are transferred, and a drive circuit driving the signal lines in operating modes. The operating modes include a dynamic operation mode in which the signal lines are precharged, and a static operation mode in which the signal lines are not precharged.

Abstract: A semiconductor device includes: groups of memory cells that are connected to word lines; and select gates that are controlled by control word lines and are connected to the groups of memory cells, each of the select gates being capable of storing protection information for a respective one of the groups of memory cells.

Abstract: A semiconductor memory device comprises: a plurality of memory elements; at least one bit line, wherein a memory operation is performed via at least a portion of the bit line with respect to at least one of the plurality of memory elements; and a load resistance regulating circuit for changing a resistance value to reduce or eliminate a difference in bit line load resistance depending on a position of the memory element.

Abstract: A memory device comprises a memory cell array (1) with a multitude of memory cells (111). Each of the memory cells (111) is assigned to one of a multitude of blocks (15). Each memory cell (111) is accessible by an access signal in order to alter stored information. Each of the memory cells (111) is assigned to one of a multitude of blocks (15). The memory device further comprises a measuring unit (100) coupled to the memory cell array (1) and being operable to identify a selected access characteristic of each of the memory cells (11) and an assignment unit (150) which is coupled to the measuring unit (100) and is operable to assign a performance parameter (215) to each block (15). A performance memory unit (2) is adapted to contain the performance parameters (215) assigned to the blocks (15).

Abstract: A nonvolatile memory array has a single transistor flash memory cell and a two transistor EEPROM memory cell which maybe integrated on the same substrate. The nonvolatile memory cell has a floating gate with a low coupling coefficient to permit a smaller memory cell. The floating gate placed over a tunneling insulation layer, the floating gate is aligned with edges of the source region and the drain region and having a width defined by a width of the edges of the source the drain. The floating gate and control gate have a relatively small coupling ratio of less than 50% to allow scaling of the nonvolatile memory cells. The nonvolatile memory cells are programmed with channel hot electron programming and erased with Fowler Nordheim tunneling at relatively high voltages.

Abstract: A signal capture system and method is used to capture a data signal using a data strobe signal having a preamble of strobe signal transitions. The system includes a data latch circuit receiving the data signal. The data latch circuit is clocked by transitions of the data strobe signal to capture respective bits of data corresponding to the data signal. A decoder receives a memory command signal and generates a data start signal after a delay period from receiving the memory command signal if the command signal corresponds to a read or a write command. The receipt of read or write command signals is used by a control circuit to identify the start of valid read or write data signals. The control circuit then outputs the captured data signals responsive to the data start signal, thereby ignoring the transitions in the preamble of the data strobe signal.

Abstract: In a virtual ground memory array, sneak currents between input/output groups of sensed cells may be reduced by providing at least one column of programmed cells between the input/output groups. The sneak currents may arise when cells in each of two adjacent I/O groups are sensed (or programmed) at the same time.

Abstract: A word line driver is provided for accessing a DRAM cell embedded in a conventional logic process. The DRAM cell includes a p-channel access transistor coupled to a cell capacitor. The word line driver includes an n-channel transistor located in a p-well, wherein the p-well is located in a deep n-well. The deep n-well is located in a p-type substrate. A word line couples the drain of the n-channel transistor to the gate of the p-channel access transistor. A negative boosted voltage supply applies a negative boosted voltage to the p-well and the source of the n-channel transistor. The negative boosted voltage is less than ground by an amount equal to or greater than the threshold voltage of the p-channel access transistor. The deep n-well and the p-type substrate are coupled to ground. The various polarities can be reversed in another embodiment.

Abstract: A method, system, and circuit for performing a memory related operation are disclosed. An operating voltage is applied to a bitline and a neighboring bitline is precharged. The precharge voltage has a magnitude less than the operating voltage. Both voltages ramp up at like or different rates. The precharge voltage can reach its effective magnitude prior to or with the operating voltage reaching its effective value.

Abstract: A selected wordline that is coupled to cells for programming is biased with a programming voltage. The unselected wordlines that are adjacent to the selected wordline are biased at a first predetermined voltage. The remaining wordlines are biased at a second predetermined voltage that is greater than the first predetermined voltage. The first predetermined voltage is selected by determining what unselected, adjacent wordline bias voltage produces a minimized Vpass disturb in response to the selected wordline programming voltage.

Abstract: For writing K-bit write data in parallel (K is integer at least 2), bit lines each arranged for each memory cell columns and at least K current return lines are provided. K selected bit lines to write the K-bit write data are connected in series in a single current path. When data having different levels are written through adjacent selected bit lines, the selected bit lines are connected to each other at their one ends or the other ends, so that a bit line write current flowing through the former selected bit line is directly transmitted to the latter selected bit line. On the other hand, when data having the same level are written through adjacent selected bit lines, a bit line write current flowing through the former selected bit line is turned back by the corresponding current return line, and then transmitted to the latter selected bit line.

Abstract: A method to eliminate program deceleration and to enhance the resistance to program disturbance of a non-volatile floating gate memory cell is disclosed. This method eliminates or minimizes the impact of the hole displacement current. This can be done, for example, by increasing the rise time of the high programming voltage applied to the high voltage terminal. Alternatively, the transistor of the non-volatile floating gate memory cell can be turned off until the voltage applied to the high voltage terminal has reached the programming voltage. This can be done, for example by delaying the voltage applied to either the low voltage terminal or to the control gate to turn on the transistor until the voltage at the high voltage terminal has past the ramp up voltage and has reached a level programming voltage.

Abstract: An ultra cycling nitride read only memory (NROM) device is coupled to a NROM array such that both bits of the ultra cycling NROM device will be erased when all NROM devices of the NROM array are erased. The ultra cycling NROM device is then programmed at its right bit. A threshold voltage difference will be obtained for the ultra cycling NROM device for the un-programmed left bit. Next, a cycling number is obtained based on the threshold voltage difference for the ultra cycling NROM device. A threshold voltage shift can be found based on the cycling number for the NROM array. Finally, an erase voltage will be calculated according to the threshold voltage shift for the NROM array. If the NROM array is programmed again, the erase voltage will be applied to un-programmed NROM devices of the NROM array to further reduce the threshold voltages.

Abstract: A selected wordline that is coupled to cells for programming is biased with a programming voltage. The unselected wordlines that are adjacent to the selected wordline are biased at a first predetermined voltage. The remaining wordlines are biased at a second predetermined voltage that is greater than the first predetermined voltage. The first predetermined voltage is selected by determining what unselected, adjacent wordline bias voltage produces a minimized Vpass disturb in response to the selected wordline programming voltage.

Abstract: Normal memory cells are arranged in rows and columns, and dummy memory cells are arranged to form dummy memory cell rows by sharing memory celf columns with the normal memory cells. When there is at least one defect in the normal memory cells and/or the dummy memory cells, replacement/repair is carried out using a redundant column in a unit of memory cell column. The redundant column includes not only spare memory cells for repair of the normal memory cells but also spare dummy memory cells for repair of the dummy memory cells.